XCS30-3PQ208I

The XCS30-3PQ208I is a Spartan® FPGA from AMD provided in a 208-BFQFP surface-mount package. It integrates 1,368 logic elements and approximately 18,432 bits of on-chip RAM to implement custom digital logic in compact hardware designs.

Designed for industrial applications, this device offers 169 general-purpose I/O pins, roughly 30,000 gates of logic capacity, and a 4.5 V to 5.5 V supply range, supporting deployment across a broad temperature window from −40°C to 100°C.

Key Features

• Core Logic — 1,368 logic elements provide programmable resources for implementing custom combinational and sequential logic functions.
• Embedded Memory — Approximately 0.018 Mbits (18,432 bits) of on-chip RAM for small buffering, state storage, and local data handling.
• I/O Capacity — 169 available I/O pins to interface with peripherals, sensors, and other system components.
• Logic Scale — Approximately 30,000 gates to support mid-density logic integration in compact systems.
• Power and Temperature — Supports a 4.5 V to 5.5 V supply and an operating temperature range of −40°C to 100°C for industrial environments.
• Package and Mounting — 208-BFQFP package case (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB space efficiency.
• Regulatory — RoHS compliant.

Typical Applications

• Embedded Control — Implement custom control logic and state machines for industrial equipment and automation systems.
• I/O Expansion and Bridging — Provide programmable interfacing between heterogeneous peripherals and digital buses using abundant I/O resources.
• Prototyping and Development — Rapidly iterate digital designs and validate logic implementations before committing to ASIC or discrete logic solutions.

Unique Advantages

• Compact, Programmable Integration: 1,368 logic elements and on-chip RAM enable consolidating multiple discrete functions into a single FPGA, reducing BOM and board complexity.
• Industrial Temperature Range: Rated from −40°C to 100°C, supporting reliable operation in harsh or variable environmental conditions.
• High I/O Count: 169 I/O pins simplify direct connections to sensors, actuators, and external interfaces without additional GPIO expanders.
• Standard Surface-Mount Package: 208-BFQFP (28×28 PQFP footprint) eases placement in compact PCBs and supports automated assembly.
• RoHS Compliant: Meets common environmental and manufacturing requirements for lead-free production.

Why Choose XCS30-3PQ208I?

The XCS30-3PQ208I positions itself as a mid-density, industrial-grade FPGA suitable for designs that need flexible, reprogrammable logic combined with a modest amount of embedded memory and a high I/O count. Its supply voltage range and temperature rating make it appropriate for industrial applications where robustness and environmental tolerance matter.

Engineers and procurement teams seeking a compact, surface-mount FPGA solution will find the XCS30-3PQ208I useful for consolidating logic, interfacing multiple peripherals, and accelerating development cycles while maintaining compliance with RoHS requirements.

Request a quote or submit a purchase inquiry to get pricing and availability for the XCS30-3PQ208I and to discuss how it can fit into your next design.