EMMC64G-TY29-5B102
| Part Description |
IC FLASH 512GBIT EMMC 153FBGA |
|---|---|
| Quantity | 718 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC64G-TY29-5B102 – IC FLASH 512GBIT e•MMC 153FBGA
The EMMC64G-TY29-5B102 is a packaged managed NAND flash device with an e•MMC™ 5.1 interface, delivering 512 Gbit of non-volatile TLC NAND in a single integrated package. It combines NAND media and an onboard e•MMC controller to provide standard host interfacing while handling flash media management, error control and performance optimization on-device.
Designed for commercial and industrial embedded storage, the device targets system boot, application storage and high-throughput data paths where e•MMC compliance, integrated management and configurable performance modes are required.
Key Features
- Core / Controller Packaged managed NAND with onboard e•MMC™ 5.1 controller that relieves the host of flash management, wear-leveling and error control tasks.
- Memory 512 Gbit capacity organized as 64G × 8 using TLC NAND. Factory configured with pseudo SLC (pSLC) mode for enhanced reliability and performance.
- Interface & Performance Compliant with JEDEC e•MMC™ 5.1. Supports variable clock frequencies to 200 MHz, three bus widths (1, 4, 8 bits) and multiple transfer modes including Single (up to 52 MB/s), DDR-104 (up to 104 MB/s), HS-200 (up to 200 MB/s) and HS-400 (up to 400 MB/s).
- Power & Voltage Operating voltage range listed as 2.7 V to 3.6 V; VCCQ options include 1.8 V and 3.3 V per device documentation.
- Reliability & Data Protection Internal ECC, CRC for command/data integrity, secure bad block erase, enhanced write protection (permanent and partial), and protection against sudden power failure during program operations. Supports device health reporting and Field Firmware Update (FFU).
- Package & Temperature 153-ball JEDEC FBGA RoHS-compliant package (153-FBGA, 11.5 × 13 mm). Operating temperature range: −25 °C to +85 °C; storage temperature: −40 °C to +85 °C.
Typical Applications
- Commercial and Industrial Embedded Storage — Managed NAND storage for a wide range of commercial and industrial embedded systems that require a standard e•MMC interface and onboard flash management.
- System Boot and OS Storage — Supports alternate boot operation mode to provide a simple boot sequence for host processors and system firmware.
- Field-Updatable Devices — Field Firmware Update (FFU) support and device health reporting simplify maintenance and in-field updates.
- High-Throughput Data Paths — Supports HS-200 and HS-400 modes for systems that leverage higher sequential throughput.
Unique Advantages
- Factory-Configured pSLC Mode: Enhances endurance and performance by provisioning NAND in a pseudo-SLC configuration at manufacture.
- Integrated Flash Management: Onboard e•MMC controller manages ECC, wear-leveling and bad-block handling, reducing host software complexity.
- Flexible Interface Performance: Multiple bus widths and transfer modes (Single, DDR-104, HS-200, HS-400) allow tuning for capacity versus throughput.
- Robust Data Integrity Features: CRC, internal ECC, secure erase and sudden power-failure protection improve data reliability in the field.
- Compact JEDEC FBGA Package: 153-ball FBGA (11.5 × 13 mm) provides a small footprint for space-constrained designs.
- JEDEC e•MMC™ 5.1 Compliance: Backward compatibility with prior e•MMC revisions supports long-term system sustainment and compatibility.
Why Choose IC FLASH 512GBIT EMMC 153FBGA?
The EMMC64G-TY29-5B102 combines high-density NAND, an integrated e•MMC™ 5.1 controller and factory-configured pSLC mode to deliver a managed storage solution focused on integration and reliability. Its feature set—internal ECC/CRC, power-loss protection, FFU and device health reporting—addresses common embedded system storage requirements without adding host-side flash management complexity.
This device is suited to designers and procurement teams seeking JEDEC-compliant e•MMC storage for commercial and industrial embedded systems that require configurable performance modes, compact packaging and managed NAND functionality to simplify system design and lifecycle support.
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