EMMC64G-TY29-5B102

IC FLASH 512GBIT EMMC 153FBGA
Part Description

IC FLASH 512GBIT EMMC 153FBGA

Quantity 718 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC64G-TY29-5B102 – IC FLASH 512GBIT e•MMC 153FBGA

The EMMC64G-TY29-5B102 is a packaged managed NAND flash device with an e•MMC™ 5.1 interface, delivering 512 Gbit of non-volatile TLC NAND in a single integrated package. It combines NAND media and an onboard e•MMC controller to provide standard host interfacing while handling flash media management, error control and performance optimization on-device.

Designed for commercial and industrial embedded storage, the device targets system boot, application storage and high-throughput data paths where e•MMC compliance, integrated management and configurable performance modes are required.

Key Features

  • Core / Controller Packaged managed NAND with onboard e•MMC™ 5.1 controller that relieves the host of flash management, wear-leveling and error control tasks.
  • Memory 512 Gbit capacity organized as 64G × 8 using TLC NAND. Factory configured with pseudo SLC (pSLC) mode for enhanced reliability and performance.
  • Interface & Performance Compliant with JEDEC e•MMC™ 5.1. Supports variable clock frequencies to 200 MHz, three bus widths (1, 4, 8 bits) and multiple transfer modes including Single (up to 52 MB/s), DDR-104 (up to 104 MB/s), HS-200 (up to 200 MB/s) and HS-400 (up to 400 MB/s).
  • Power & Voltage Operating voltage range listed as 2.7 V to 3.6 V; VCCQ options include 1.8 V and 3.3 V per device documentation.
  • Reliability & Data Protection Internal ECC, CRC for command/data integrity, secure bad block erase, enhanced write protection (permanent and partial), and protection against sudden power failure during program operations. Supports device health reporting and Field Firmware Update (FFU).
  • Package & Temperature 153-ball JEDEC FBGA RoHS-compliant package (153-FBGA, 11.5 × 13 mm). Operating temperature range: −25 °C to +85 °C; storage temperature: −40 °C to +85 °C.

Typical Applications

  • Commercial and Industrial Embedded Storage — Managed NAND storage for a wide range of commercial and industrial embedded systems that require a standard e•MMC interface and onboard flash management.
  • System Boot and OS Storage — Supports alternate boot operation mode to provide a simple boot sequence for host processors and system firmware.
  • Field-Updatable Devices — Field Firmware Update (FFU) support and device health reporting simplify maintenance and in-field updates.
  • High-Throughput Data Paths — Supports HS-200 and HS-400 modes for systems that leverage higher sequential throughput.

Unique Advantages

  • Factory-Configured pSLC Mode: Enhances endurance and performance by provisioning NAND in a pseudo-SLC configuration at manufacture.
  • Integrated Flash Management: Onboard e•MMC controller manages ECC, wear-leveling and bad-block handling, reducing host software complexity.
  • Flexible Interface Performance: Multiple bus widths and transfer modes (Single, DDR-104, HS-200, HS-400) allow tuning for capacity versus throughput.
  • Robust Data Integrity Features: CRC, internal ECC, secure erase and sudden power-failure protection improve data reliability in the field.
  • Compact JEDEC FBGA Package: 153-ball FBGA (11.5 × 13 mm) provides a small footprint for space-constrained designs.
  • JEDEC e•MMC™ 5.1 Compliance: Backward compatibility with prior e•MMC revisions supports long-term system sustainment and compatibility.

Why Choose IC FLASH 512GBIT EMMC 153FBGA?

The EMMC64G-TY29-5B102 combines high-density NAND, an integrated e•MMC™ 5.1 controller and factory-configured pSLC mode to deliver a managed storage solution focused on integration and reliability. Its feature set—internal ECC/CRC, power-loss protection, FFU and device health reporting—addresses common embedded system storage requirements without adding host-side flash management complexity.

This device is suited to designers and procurement teams seeking JEDEC-compliant e•MMC storage for commercial and industrial embedded systems that require configurable performance modes, compact packaging and managed NAND functionality to simplify system design and lifecycle support.

Request a quote or submit an inquiry to get availability, pricing and further technical details for the EMMC64G-TY29-5B102.

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