EMMC64G-TB9F-03B11
| Part Description |
IC FLASH 256GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 1,316 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (8x8.5) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC64G-TB9F-03B11 – IC FLASH 256GBIT EMMC 153VFBGA
The EMMC64G-TB9F-03B11 is a Kingston Technology e•MMC™ flash memory device that implements the JEDEC eMMC 5.1 standard. It encloses NAND flash and an integrated eMMC controller in a standardized WFBGA package to provide a single-package storage interface to the host processor.
Designed for mobile and embedded applications, this eMMC device targets use in smartphones, tablet PCs, eBook readers, smart TVs, set-top boxes, smart home appliances, wearables, single board computers, robotics, medical devices, networking and building control devices. On-board controller functions such as ECC, wear-leveling, IOPS optimization and read sensing reduce storage management burden on the host CPU.
Key Features
- Interface and Standard JEDEC-compliant eMMC 5.1 interface (HS400 capable) providing a standardized host connection and simplified integration.
- Memory Technology NAND Flash (TLC) technology for higher-capacity storage in embedded applications.
- Memory Organization & Capacity Memory organization specified as 64G × 8 with a MemorySize entry of 512 Gbit as provided in product specifications.
- Controller-Managed Storage Integrated eMMC controller handles ECC, wear-leveling, IOPS optimization and read sensing to offload flash management from the host processor.
- Enhanced Mode (pSLC) pSLC configuration is available for improved performance and endurance where required.
- Performance Specified clock frequency: 200 MHz to support high-speed data transfer when used with compatible hosts.
- Power Operating supply voltage range of 2.7 V to 3.6 V for common embedded power rails.
- Package 153-WFBGA (153-FBGA, 8 × 8.5 mm) compact JEDEC-standard package suitable for space-constrained designs.
- Operating Temperature Rated for an operating temperature range of −25 °C to 85 °C for many industrial and consumer embedded environments.
Typical Applications
- Smartphones & Tablets Local non-volatile storage for operating systems, apps and multimedia content in mobile devices.
- Smart TVs & Set-Top Boxes On-board storage for firmware, media buffering and application data in consumer entertainment equipment.
- IoT & Embedded Systems Compact storage for single board computers, robotics, networking modules and building control devices where board space and power are constrained.
- Wearables & Portable Electronics Solid-state storage for user data and firmware in small-form-factor wearable devices and eReaders.
- Medical & Industrial Devices Non-volatile storage for embedded software and recorded data in medical devices and factory automation equipment.
Unique Advantages
- Highly integrated single-package solution: NAND flash and eMMC controller are enclosed in one JEDEC-standard package, reducing BOM and simplifying board-level integration.
- Standardized eMMC 5.1 interface: Provides a common host interface so host firmware does not need frequent changes to accommodate NAND technology variations.
- Controller offloads flash management: On-board ECC, wear-leveling and read sensing reduce host CPU overhead and simplify system software.
- Configurable performance/endurance: Enhanced pSLC mode option supports use cases requiring higher endurance or improved write performance.
- Compact WFBGA package: 153-pin WFBGA (8 × 8.5 mm) package enables high-density board layouts for space-constrained designs.
- Wide operating range and standard voltages: −25 °C to 85 °C operating temperature and 2.7 V–3.6 V supply range match common embedded system environments.
Why Choose IC FLASH 256GBIT EMMC 153VFBGA?
The EMMC64G-TB9F-03B11 combines a JEDEC eMMC 5.1 interface with integrated NAND and controller features to deliver a standardized, easy-to-integrate storage option for embedded and mobile designs. Its controller-managed functions and optional enhanced pSLC mode help balance endurance and performance needs while reducing host processing demands.
This device is appropriate for designers seeking compact, controller-managed non-volatile storage in applications spanning consumer electronics, IoT, industrial and medical devices. As part of Kingston's e•MMC™ family, it aligns with a product set that spans multiple capacities and package formats to support design scalability.
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