EMMC64G-IY29-5B111

The EMMC64G-IY29-5B111 is a packaged managed NAND flash memory device implementing the e•MMC™ 5.1 standard. It combines triple-level cell (TLC) NAND flash with an onboard e•MMC controller to provide a single-package non-volatile storage solution with industry-standard host interface.

Designed for commercial and industrial applications, the device relieves the host processor of flash management tasks—such as error control, wear-leveling and performance optimization—while offering a wide operating temperature range and standard FBGA packaging for compact embedded designs.

Key Features

• Memory Core 512 Gbit TLC NAND organized as 64G × 8, providing high-density non-volatile storage in a single package.
• Interface and Protocol e•MMC™ 5.1 interface with backward compatibility to prior e•MMC™ revisions and support for high-speed e•MMC protocols.
• Performance Modes Supports multiple bus modes and speeds including single data transfer (up to 52 MB/s), DDR-104 (up to 104 MB/s), HS-200 (up to 200 MB/s) and HS-400 (up to 400 MB/s) with variable clock frequencies up to 200 MHz.
• Bus Widths and Connectivity Ten-wire bus interface with support for 1-bit, 4-bit and 8-bit data widths and an optional hardware reset.
• Power and Voltage Operating voltage support includes VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V.
• Industrial Temperature Range Rated for operation from −40 °C to +85 °C with storage temperature in the same range.
• Package 153-ball JEDEC FBGA (11.5 × 13 mm) package for compact board-level integration; RoHS-compliant package noted in documentation.
• Data Integrity and Management Internal ECC, CRC for command/data communication, enhanced data management algorithms and power-off notification to protect data during program operations.
• Security and Reliability Secure bad block erase, secure write protection, RPMB throughput improvements, device health reporting and production state awareness are supported.
• Maintenance and Updates Field firmware update (FFU), cache flushing report, cache barrier and background operation control with High Priority Interrupt (HPI) support.

Typical Applications

• Commercial Embedded Systems Acts as a universal storage element in commercial embedded devices where an integrated e•MMC™ interface and onboard flash management simplify design.
• Industrial Applications Suited for industrial equipment requiring wide temperature operation and managed NAND to reduce host processing for storage management.
• Boot and System Storage Supports alternate boot operation mode for simple boot sequencing in systems that require on-board boot media.
• Secure Data Storage RPMB and enhanced write protection features enable secure and authenticated storage partitions for protected data.

Unique Advantages

• Highly Integrated Storage: TLC NAND plus onboard e•MMC™ controller supplies a managed flash solution that reduces firmware and software burden on the host.
• Flexible Performance Options: Multiple bus modes (SDR/DDR, HS-200, HS-400) and data widths let designers trade off throughput and pin usage according to system needs.
• Designed for Harsh Environments: Industrial operating temperature range (−40 °C to +85 °C) supports deployments outside typical commercial temperature limits.
• Built-in Data Protection: CRC, internal ECC and power-off notification improve data integrity and reduce risk during program operations.
• Serviceability and Monitoring: Field firmware update capability, device health reports and production state awareness aid long-term maintenance and lifecycle management.
• Compact, Standard Package: 153-ball JEDEC FBGA (11.5 × 13 mm) enables compact board designs while following JEDEC packaging conventions.

Why Choose IC FLSH 512GBIT EMMC 5.1 153FBGA?

The EMMC64G-IY29-5B111 from Kingston Technology positions itself as a robust, integrated storage option for commercial and industrial embedded systems that need managed NAND flash with an industry-standard e•MMC™ 5.1 interface. Its onboard controller handles flash management tasks—such as error correction, wear-leveling and NAND management—freeing host resources and simplifying firmware design.

With multiple performance modes, secure storage features, field firmware update support and a wide operating temperature range, this device is suitable for designs that require scalable storage capacity, operational reliability and lifecycle visibility in a compact JEDEC FBGA package.

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