EMMC64G-IY29-5B102

The EMMC64G-IY29-5B102 is a packaged managed NAND flash storage device combining triple-level cell (TLC) NAND with an onboard e•MMC™ controller and an e•MMC™ 5.1 interface. The device is presented in a 153-ball JEDEC FBGA package and provides a universal storage solution for commercial and industrial embedded systems.

Designed to offload flash management from the host, the device integrates error correction, wear-leveling and data-management features while supporting a range of high-speed e•MMC™ bus modes to meet diverse performance and reliability requirements.

Key Features

• Core / Memory 512 Gbit TLC NAND organized as 64G × 8, delivering non-volatile flash storage with integrated flash management.
• Interface e•MMC™ 5.1 compliant interface with backward compatibility to prior e•MMC™ revisions and a ten-wire bus (clock, 1‑bit command, 8‑bit data).
• Performance Modes Variable clock frequencies 0–200 MHz; supports 1‑bit/4‑bit/8‑bit bus widths and multiple transfer modes including Single up to 52 MB/s, DDR‑104 up to 104 MB/s @ 52 MHz, HS‑200 up to 200 MB/s @ 200 MHz, and HS‑400 up to 400 MB/s @ 200 MHz.
• Reliability & Data Integrity Internal Error Correction Code (ECC), Cyclic Redundancy Code (CRC) for command/data integrity, enhanced data management algorithms, and data protection for sudden power failure during program operations.
• Security & Management Secure bad block erase commands, enhanced write protection (permanent and partial), secure write protection, RPMB throughput improvements, device health reporting and production state awareness.
• Firmware & Maintenance Supports Field Firmware Update (FFU), cache flushing report, cache barrier, background operation control and High Priority Interrupt (HPI).
• Package & Temperature 153‑ball FBGA (11.5 × 13 mm) JEDEC package; industrial operating and storage temperature range −40 °C to +85 °C. The package is listed as RoHS compliant in the product documentation.
• Power Rails Supported operating voltages include VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V as specified in product documentation.

Typical Applications

• Commercial embedded systems Use as an integrated storage module where managed NAND and standard e•MMC™ interface simplify host design and storage integration.
• Industrial equipment Provides non-volatile storage across an industrial temperature range (−40 °C to +85 °C) for systems requiring robust flash management and data integrity.
• Universal storage solutions Acts as a single-package storage and controller solution to relieve host processors from NAND management tasks such as ECC and wear‑leveling.

Unique Advantages

• Integrated flash controller: Reduces host processor overhead by handling ECC, wear‑leveling and NAND media management on-device.
• e•MMC™ 5.1 compatibility: Backward compatible with prior e•MMC™ specifications to ease integration and long-term product sustainment.
• Multiple high-speed modes: Supports modes from Single up to HS‑400 (400 MB/s @ 200 MHz) to provide flexible performance scaling for different system requirements.
• Robust data protection: CRC, internal ECC, sudden power-failure protection and enhanced write-protection options improve data integrity and reliability.
• Industrial temperature support: Rated for operation and storage from −40 °C to +85 °C for deployment in temperature‑challenging environments.
• Compact JEDEC FBGA: 153‑ball FBGA (11.5 × 13 mm) package provides a small footprint managed-storage option for space‑constrained designs.

Why Choose EMMC64G-IY29-5B102?

The EMMC64G-IY29-5B102 positions itself as an integrated, standards‑based storage option that combines TLC NAND with an onboard e•MMC™ controller to simplify system design and flash management. With e•MMC™ 5.1 compliance, backward compatibility and multiple high‑speed bus modes, it offers scalable performance and straightforward interoperability for commercial and industrial embedded designs.

Its built‑in reliability and management features—ECC, CRC, power‑fail protection, secure write protection and device health reporting—help maintain data integrity and support long‑term product sustainment while the compact 153‑ball FBGA package and industrial temperature rating make it suitable for space‑ and environment‑constrained applications.

Request a quote or contact sales to discuss availability, volume pricing, and technical support for the EMMC64G-IY29-5B102.