EMMC32G-TS0A-01011

The EMMC32G-TS0A-01011 is a packaged managed NAND flash device implementing the JEDEC e•MMC™ 5.1 standard. It integrates triple-level cell (TLC) NAND flash with an onboard e•MMC controller to provide a standard e•MMC interface and offload flash management from the host.

Designed for commercial and industrial embedded storage, the device delivers up to 256 Gbit organized as 32G x 8, with high-speed bus modes and onboard data protection features to support system boot, file storage and other embedded storage roles.

Key Features

• Core Memory  256 Gbit TLC NAND organized as 32G × 8, packaged managed flash with integrated e•MMC controller for on-device flash management.
• Interface and Performance  Compliant with e•MMC™ 5.1; supports 1-/4-/8-bit data bus widths, variable clock frequencies up to 200 MHz and multiple bus modes including single data rate (up to 52 MB/s @ 52 MHz), DDR-104 (up to 104 MB/s @ 52 MHz), HS-200 (up to 200 MB/s @ 200 MHz) and HS-400 (up to 400 MB/s @ 200 MHz).
• Power and Voltage  Supply range listed as 2.7 V to 3.6 V. Datasheet notes VCCQ options of 1.8 V or 3.3 V with VCC = 3.3 V.
• Data integrity and protection  Internal ECC, Cyclic Redundancy Check (CRC) for command/data communication, wear-leveling, secure bad block erase, enhanced write protection (permanent and partial options) and data protection mechanisms for sudden power failure during program operations.
• Device Management and Security  Features include field firmware update (FFU), device health report, command queuing, RPMB throughput improvements, secure write protection, background operation control and high priority interrupt (HPI).
• Package and Temperature  153-ball JEDEC FBGA package (153-FBGA, 11.5 × 13 mm); operating temperature range −25 °C to +85 °C and storage range −40 °C to +85 °C.
• Reliability  Supports production state awareness, pre-end-of-life (EOL) information and an endurance rating of 3,000 program–erase cycles (per datasheet).

Typical Applications

• Commercial embedded systems  Provides managed non-volatile storage for general-purpose embedded devices requiring a standard e•MMC interface.
• Industrial applications  Suitable for industrial systems that need a compact, packaged storage device with a wide operating temperature range and on-board flash management.
• Boot and system storage  Supports alternate boot operation mode to provide a simple boot sequence and reliable system storage for host processors.

Unique Advantages

• Highly integrated managed NAND  Onboard e•MMC controller plus TLC NAND reduces host overhead for wear-leveling, ECC and bad-block management.
• Standardized e•MMC 5.1 interface  JEDEC e•MMC™ 5.1 compliance ensures backward compatibility with prior e•MMC revisions and predictable interface behavior.
• Flexible performance modes  Multiple bus widths and speed modes (including HS-200 and HS-400) enable designers to match throughput to system needs.
• Robust data protection  ECC, CRC, secure bad block handling, enhanced write protection and power-fail protection improve data integrity in embedded environments.
• Compact, industry-standard package  153-ball FBGA (11.5 × 13 mm) offers a small footprint for space-constrained boards.
• Operational visibility and serviceability  Device health reporting, FFU support and pre-EOL information help with maintenance and lifecycle management.

Why Choose IC FLASH 256GBIT EMMC 153WFBGA?

IC FLASH 256GBIT EMMC 153WFBGA (EMMC32G-TS0A-01011) positions itself as a compact, managed storage solution for commercial and industrial embedded designs that require a standardized e•MMC interface and on-device flash management. With TLC NAND, an integrated controller, a full set of e•MMC 5.1 features and multiple high-speed bus modes, it offloads flash management tasks from the host while providing configurable performance and security options.

This device is suited to designs that need reliable non-volatile storage in a small FBGA package, operating across −25 °C to +85 °C, and benefitting from features such as error correction, secure write protection, power-fail protection and field firmware updates for long-term maintenance and support.

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