EMMC32G-KC30-01B01

IC FLASH 256GBIT EMMC 153VFBGA
Part Description

IC FLASH 256GBIT EMMC 153VFBGA

Quantity 355 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGA (8x8.5)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage1.8V, 3.3VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC32G-KC30-01B01 – IC FLASH 256GBIT EMMC 153VFBGA

The EMMC32G-KC30-01B01 is a packaged managed NAND flash device implementing the e•MMC™ 5.1 interface. It combines NAND TLC flash memory and an onboard e•MMC controller in a 153-ball VFBGA package to provide integrated non-volatile storage.

This device targets commercial and industrial embedded storage use cases where a standard e•MMC interface, onboard media management, and multiple performance modes (including HS-400 and HS-200) simplify system design and offload flash management from the host.

Key Features

  • Core / Architecture  Packaged managed NAND flash with an onboard e•MMC™ 5.1 controller that handles flash media error control, wear-leveling and performance optimization.
  • Memory  256 Gbit capacity organized as 32G × 8 using NAND (TLC) technology, provided as non-volatile FLASH memory.
  • Interface & Performance Modes  e•MMC™ 5.1 interface supporting variable clock frequencies to 200 MHz and multiple bus widths (1, 4, 8 bits). Supported modes include Single data transfer (up to 52 MB/s), DDR-104 (up to 104 MB/s @ 52 MHz), HS-200 (up to 200 MB/s @ 200 MHz) and HS-400 (up to 400 MB/s @ 200 MHz).
  • Power / Voltage  Operating VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V, supporting common e•MMC power domains.
  • Reliability & Data Integrity  Internal ECC, cyclic redundancy code (CRC) for commands/data, enhanced data management algorithms and data protection for sudden power failure during program operations.
  • System & Security Features  Enhanced write protection (permanent and partial), secure bad block erase commands, field firmware update (FFU), device health reporting and production state awareness.
  • Package & Temperature  153-ball JEDEC VFBGA package (153-FBGA, 8 × 8.5) in a RoHS-compliant package with an operating temperature range of −25°C to +85°C and storage temperature −40°C to +85°C.

Typical Applications

  • Embedded boot storage  Supports alternate boot operation mode to provide a simple boot sequence for embedded systems.
  • Commercial and industrial embedded storage  Integrated controller relieves the host processor of NAND management tasks, making it suitable for commercial and industrial devices requiring managed non-volatile storage.
  • High-throughput data buffering  HS-200 and HS-400 modes plus DDR-104 support enable higher sustained transfer rates for systems that require fast data movement between host and storage.
  • Systems requiring robust data integrity  Internal ECC, CRC, enhanced data management and power-failure protection help protect stored data in environments with intermittent power or heavy write activity.

Unique Advantages

  • Highly integrated managed storage: Onboard e•MMC controller combined with NAND Flash reduces host design complexity by handling wear-leveling and error management.
  • JEDEC e•MMC 5.1 compliance: Backward compatible with prior e•MMC revisions and supports a standard host interface for interoperability across designs.
  • Multiple performance modes: Support for Single, DDR-104, HS-200 and HS-400 modes allows designers to balance throughput and system constraints.
  • Data protection features: Internal ECC, CRC checks and power-failure protection reduce risk of data corruption during program operations.
  • Compact, industry-standard package: 153-ball VFBGA (8 × 8.5) provides a small footprint for space-constrained board designs.
  • Operational range for embedded environments: Rated for operation from −25°C to +85°C to address a range of commercial and industrial temperature requirements.

Why Choose EMMC32G-KC30-01B01?

The EMMC32G-KC30-01B01 positions itself as a compact, managed non-volatile storage solution that combines a JEDEC-compliant e•MMC™ 5.1 interface with integrated NAND management. Its onboard controller and data integrity features reduce host processing requirements while providing defined performance modes to match application needs.

This device is suited for designers of commercial and industrial embedded systems who require a standardized interface, built-in flash management, and a compact FBGA package. Its backward compatibility with prior e•MMC revisions and features such as field firmware update and device health reporting support long-term product sustainment.

Request a quote or contact sales to discuss availability, pricing and how the EMMC32G-KC30-01B01 can fit your embedded storage requirements.

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