EMMC32G-TS0A-01002
| Part Description |
IC FLASH 256GBIT EMMC 153FBGA |
|---|---|
| Quantity | 554 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC32G-TS0A-01002 – IC FLASH 256GBIT EMMC 153FBGA
The EMMC32G-TS0A-01002 is a packaged managed NAND flash device using e•MMC™ 5.1 interface architecture. It integrates 256 Gbit (32G x 8) TLC NAND with an onboard e•MMC controller to provide a standard embedded storage solution for commercial and industrial applications.
Designed for host systems that require onboard managed flash, the device emphasizes scalable performance modes, onboard data management and protection features, and a compact 153-ball FBGA package suitable for embedded designs operating from -25°C to +85°C.
Key Features
- Memory Core 256 Gbit (32G × 8) TLC NAND organized with factory-configured pseudo SLC (pSLC) mode for enhanced reliability and performance.
- Interface & Protocol JEDEC e•MMC™ 5.1 compliant interface with backward compatibility to prior e•MMC revisions; supports 1-, 4- and 8-bit data bus widths and an optional hardware reset.
- Performance Modes Variable clock up to 200 MHz with supported bus modes: Single data up to 52 MB/s (8-bit @ 52 MHz), DDR-104 up to 104 MB/s (@ 52 MHz), HS-200 up to 200 MB/s (@ 200 MHz) and HS-400 up to 400 MB/s (@ 200 MHz).
- Power & Voltage Supply voltage range 2.7 V to 3.6 V; VCCQ options 1.8 V / 3.3 V and VCC 3.3 V as specified in the device documentation.
- Package & Temperature 153-ball JEDEC FBGA package (11.5 × 13 mm) with an operating temperature range of -25°C to +85°C and storage range of -40°C to +85°C.
- Data Integrity & Reliability Internal ECC, CRC for command/data communication, enhanced data management algorithms, sudden power-failure data protection and an endurance rating specified at 50,000 program‑erase cycles.
- System & Security Features Supports alternate boot mode, secure bad block erase commands, enhanced write protection (permanent and partial), field firmware update (FFU), device health reporting and command queuing.
Typical Applications
- Embedded system boot storage Alternate boot operation mode and onboard controller simplify boot sequence implementation for embedded designs.
- Industrial and commercial storage Factory-configured pSLC, extended operating temperature range and endurance support reliable data storage in industrial and commercial devices.
- Consumer and appliance embedded memory Standard e•MMC™ 5.1 interface and compact FBGA package enable integration into compact consumer and appliance platforms requiring managed NAND.
Unique Advantages
- Packaged managed NAND with onboard controller: Integrates NAND media and e•MMC controller to offload flash management, ECC and wear-leveling from the host.
- Flexible performance scaling: Multiple bus modes (Single, DDR-104, HS-200, HS-400) and variable clocking up to 200 MHz allow tuning for throughput or power trade-offs.
- Factory-configured pSLC for reliability: pSLC configuration improves write reliability and endurance compared to native TLC operation.
- Robust data protection: Internal ECC, CRC, sudden power-failure protection and secure bad block management reduce the risk of data corruption.
- Compact, industry-standard package: 153-ball JEDEC FBGA (11.5 × 13 mm) supports dense board layouts while maintaining a standard footprint for embedded designs.
- Documented endurance and thermal range: 50,000 program‑erase cycles and -25°C to +85°C operating range provide clear specifications for reliability planning.
Why Choose EMMC32G-TS0A-01002?
The EMMC32G-TS0A-01002 combines a standard e•MMC™ 5.1 interface with factory-configured pSLC NAND and a comprehensive set of data integrity and management features to provide an integrated, manageable embedded storage option. Its performance modes and supported bus widths let designers balance throughput and system constraints while the onboard controller reduces host software complexity.
This device is suited to designers and procurement teams seeking a compact, JEDEC-compliant embedded storage component with specified endurance, thermal range and a feature set focused on reliability, boot support and field firmware management—helping simplify long-term product sustainment and system-level design.
Request a quote or contact sales to discuss availability, pricing, and how the EMMC32G-TS0A-01002 fits your embedded storage requirements.