EMMC32G-IX29-8AD01

IC FLASH 256GBIT EMMC 153FBGA
Part Description

IC FLASH 256GBIT EMMC 153FBGA

Quantity 607 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage1.8V, 3.3VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH not applicable
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC32G-IX29-8AD01 – IC FLASH 256GBIT eMMC 153FBGA

The EMMC32G-IX29-8AD01 is a packaged managed NAND flash memory device implementing the e•MMC™ 5.1 interface. It integrates triple-level cell (TLC) NAND flash with an onboard e•MMC controller to provide industry-standard storage and media management in a single 153-ball FBGA package.

Targeted for commercial and industrial applications, this device simplifies host design by handling flash error control, wear‑leveling, data management and performance optimization while providing a robust, backward-compatible e•MMC interface.

Key Features

  • Core/Interface  Packaged managed NAND with e•MMC™ 5.1 interface; backward compatible with prior e•MMC specification revisions and compliant with JEDEC JESD84-B51.
  • Memory  256 Gbit total capacity organized as 32G × 8 using TLC NAND flash for high-density non-volatile storage.
  • Performance Modes  Supports multiple bus modes including single data transfer up to 52 MB/s (8-bit @ 52 MHz), DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s (@200 MHz), and HS-400 up to 400 MB/s (@200 MHz).
  • Bus Flexibility  Ten-wire bus with support for 1-bit, 4-bit and 8-bit data widths, variable clock frequencies 0–200 MHz, optional hardware reset and alternate boot operation mode.
  • Power and Supply  VCCQ supported at 1.8 V or 3.3 V and VCC = 3.3 V for interface and core supply options.
  • Reliability and Data Integrity  Internal ECC, Cyclic Redundancy Code (CRC) for command/data communication, enhanced write protection (permanent and partial), data protection for sudden power failure during program operations, and secure bad block erase commands.
  • Device Management & Security  Features include field firmware update (FFU), device health report, production state awareness, RPMB throughput improvements, command queuing, cache flushing report and cache barrier support.
  • Package & Temperature  153-ball JEDEC FBGA package (11.5 × 13 mm) and industrial Tcase range from −40 °C to +85 °C; storage temperature −40 °C to +85 °C. The datasheet notes RoHS compliance for the FBGA package.

Typical Applications

  • Commercial devices  Provides standardized onboard storage for commercial electronics requiring managed NAND and a JEDEC e•MMC interface.
  • Industrial systems  Industrial Tcase range and managed flash features make it suitable for industrial equipment needing reliable non-volatile storage.
  • Device boot and firmware storage  Supports alternate boot operation mode and field firmware update (FFU) for systems that require a simple boot sequence and in-field firmware management.

Unique Advantages

  • Highly integrated solution: Combines TLC NAND and an onboard e•MMC controller to offload flash management tasks from the host.
  • Standards-based compatibility: Implements e•MMC™ 5.1 and maintains backward compatibility with prior revisions for interface longevity.
  • Flexible performance modes: Multiple transfer modes (SDR, DDR, HS-200, HS-400) and selectable bus widths enable designers to match bandwidth to system needs.
  • Robust data integrity features: Internal ECC, CRC, write protection options and sudden power-failure protection improve storage reliability.
  • Industrial temperature support: −40 °C to +85 °C Tcase rating supports deployment in a wide range of operating environments.
  • Compact JEDEC FBGA package: 153-ball FBGA (11.5 × 13 mm) minimizes board area while providing a standardized physical footprint.

Why Choose EMMC32G-IX29-8AD01?

The EMMC32G-IX29-8AD01 offers a compact, standards-based storage solution that pairs high-density TLC NAND with an integrated e•MMC controller to simplify system integration and media management. Its support for multiple high-speed transfer modes, robust data-protection features and industrial operating temperatures make it well suited for commercial and industrial designs that require managed, reliable non-volatile storage.

Backward compatibility with prior e•MMC revisions and JEDEC compliance help ensure interface stability and ease of product sustainment across future NAND generations, providing a predictable path for long-term deployments.

Request a quote or contact sales to discuss pricing, availability and how EMMC32G-IX29-8AD01 can fit into your next design.

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