EMMC32G-IX29-8AD01
| Part Description |
IC FLASH 256GBIT EMMC 153FBGA |
|---|---|
| Quantity | 607 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.8V, 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH not applicable | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC32G-IX29-8AD01 – IC FLASH 256GBIT eMMC 153FBGA
The EMMC32G-IX29-8AD01 is a packaged managed NAND flash memory device implementing the e•MMC™ 5.1 interface. It integrates triple-level cell (TLC) NAND flash with an onboard e•MMC controller to provide industry-standard storage and media management in a single 153-ball FBGA package.
Targeted for commercial and industrial applications, this device simplifies host design by handling flash error control, wear‑leveling, data management and performance optimization while providing a robust, backward-compatible e•MMC interface.
Key Features
- Core/Interface Packaged managed NAND with e•MMC™ 5.1 interface; backward compatible with prior e•MMC specification revisions and compliant with JEDEC JESD84-B51.
- Memory 256 Gbit total capacity organized as 32G × 8 using TLC NAND flash for high-density non-volatile storage.
- Performance Modes Supports multiple bus modes including single data transfer up to 52 MB/s (8-bit @ 52 MHz), DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s (@200 MHz), and HS-400 up to 400 MB/s (@200 MHz).
- Bus Flexibility Ten-wire bus with support for 1-bit, 4-bit and 8-bit data widths, variable clock frequencies 0–200 MHz, optional hardware reset and alternate boot operation mode.
- Power and Supply VCCQ supported at 1.8 V or 3.3 V and VCC = 3.3 V for interface and core supply options.
- Reliability and Data Integrity Internal ECC, Cyclic Redundancy Code (CRC) for command/data communication, enhanced write protection (permanent and partial), data protection for sudden power failure during program operations, and secure bad block erase commands.
- Device Management & Security Features include field firmware update (FFU), device health report, production state awareness, RPMB throughput improvements, command queuing, cache flushing report and cache barrier support.
- Package & Temperature 153-ball JEDEC FBGA package (11.5 × 13 mm) and industrial Tcase range from −40 °C to +85 °C; storage temperature −40 °C to +85 °C. The datasheet notes RoHS compliance for the FBGA package.
Typical Applications
- Commercial devices Provides standardized onboard storage for commercial electronics requiring managed NAND and a JEDEC e•MMC interface.
- Industrial systems Industrial Tcase range and managed flash features make it suitable for industrial equipment needing reliable non-volatile storage.
- Device boot and firmware storage Supports alternate boot operation mode and field firmware update (FFU) for systems that require a simple boot sequence and in-field firmware management.
Unique Advantages
- Highly integrated solution: Combines TLC NAND and an onboard e•MMC controller to offload flash management tasks from the host.
- Standards-based compatibility: Implements e•MMC™ 5.1 and maintains backward compatibility with prior revisions for interface longevity.
- Flexible performance modes: Multiple transfer modes (SDR, DDR, HS-200, HS-400) and selectable bus widths enable designers to match bandwidth to system needs.
- Robust data integrity features: Internal ECC, CRC, write protection options and sudden power-failure protection improve storage reliability.
- Industrial temperature support: −40 °C to +85 °C Tcase rating supports deployment in a wide range of operating environments.
- Compact JEDEC FBGA package: 153-ball FBGA (11.5 × 13 mm) minimizes board area while providing a standardized physical footprint.
Why Choose EMMC32G-IX29-8AD01?
The EMMC32G-IX29-8AD01 offers a compact, standards-based storage solution that pairs high-density TLC NAND with an integrated e•MMC controller to simplify system integration and media management. Its support for multiple high-speed transfer modes, robust data-protection features and industrial operating temperatures make it well suited for commercial and industrial designs that require managed, reliable non-volatile storage.
Backward compatibility with prior e•MMC revisions and JEDEC compliance help ensure interface stability and ease of product sustainment across future NAND generations, providing a predictable path for long-term deployments.
Request a quote or contact sales to discuss pricing, availability and how EMMC32G-IX29-8AD01 can fit into your next design.