EMMC04G-CT32-02DB0

IC FLASH 4GB EMMC 200MHZ 153FBGA
Part Description

IC FLASH 4GB EMMC 200MHZ 153FBGA

Quantity 383 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package153-FBGA (9x7.5)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size4 bitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltageN/AMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization128G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC04G-CT32-02DB0 – 4GB e•MMC 5.1 Flash (200 MHz, 153-WFBGA)

The EMMC04G-CT32-02DB0 is a 4GB packaged managed NAND flash device implementing the e•MMC™ 5.1 interface. It combines NAND flash memory and an onboard e•MMC controller to provide standard host-side access and offload flash management tasks from the host processor.

Designed for commercial and industrial applications, the device supports high-speed modes up to 200 MHz and provides integrated data integrity and management features for reliable embedded storage across a wide operating temperature range.

Key Features

  • Core / Architecture Packaged managed NAND flash with an onboard e•MMC™ controller compliant with JEDEC e•MMC™ 5.1 (JESD84-B51), enabling standard host interface and internal flash management.
  • Memory 4GB capacity in FLASH format. Memory organization is specified as 128G × 8.
  • Interface & Bus Modes e•MMC interface with a ten-wire bus (clock, 1-bit command, 8-bit data) and optional hardware reset. Supports 1-bit, 4-bit and 8-bit data widths and alternate boot operation mode.
  • Performance Variable clock frequencies from 0–200 MHz. Supports Single data transfer (up to 52 MB/s @ 52 MHz), DDR-104 (up to 104 MB/s @ 52 MHz), HS-200 (up to 200 MB/s @ 200 MHz) and HS-400 (up to 400 MB/s @ 200 MHz).
  • Operating Voltage & Temperature Operating voltage options listed as VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V. Rated for operation from −25 °C to +85 °C and storage from −40 °C to +85 °C.
  • Data Integrity & Reliability Internal ECC, Cyclic Redundancy Code (CRC) for command/data communication, enhanced data management algorithms, secure bad block erase and enhanced write protection (permanent and partial).
  • Power & Field Management Power-off notification for sleep, host-initiated explicit sleep (CMD5), data protection for sudden power failure during program operations, and field firmware update (FFU).
  • System & Maintenance Features Device health report, production state awareness, pre-EOL information, command queuing, cache flush and cache barrier reporting, background operation control and High Priority Interrupt (HPI).
  • Package 153-ball JEDEC WFBGA package (153-FBGA, 9 × 7.5 mm) in a RoHS-compliant package description.
  • Endurance Endurance specified at 3,000 program–erase cycles.

Typical Applications

  • Industrial systems — Reliable onboard storage for firmware, system logging and application data across −25 °C to +85 °C operating conditions.
  • Commercial embedded devices — Boot and application storage where an integrated e•MMC controller simplifies host design and flash management.
  • Consumer and networking equipment — Embedded non-volatile storage for firmware, configuration and temporary data buffering using standard e•MMC interface modes.

Unique Advantages

  • Highly integrated solution: Onboard e•MMC controller manages NAND media (ECC, wear-leveling and bad block management), reducing host software complexity.
  • Flexible performance modes: Supports multiple bus widths and modes including HS-200 and HS-400 for scalable throughput up to the listed mode limits.
  • Data integrity features: CRC for command/data, internal ECC and power-failure protection help maintain reliable data storage and communication.
  • Field firmware update capability: FFU support enables in-field device firmware upgrades without replacing hardware.
  • Operational robustness: Rated for −25 °C to +85 °C operation and includes production state reporting, device health, and pre-EOL information for lifecycle management.
  • Compact, industry-standard package: 153-ball WFBGA (9 × 7.5 mm) provides a small-footprint integration option for embedded designs.

Why Choose EMMC04G-CT32-02DB0?

The EMMC04G-CT32-02DB0 delivers a standardized e•MMC™ 5.1 interface in a single, managed NAND package, combining controller-level flash management with a compact 153-ball WFBGA footprint. Its combination of configurable bus widths, high-speed modes up to 200 MHz, and integrated data-protection features make it suitable for commercial and industrial embedded storage applications that require a predictable, maintained interface to the host.

With built-in health reporting, field firmware update support and endurance specified at 3,000 program–erase cycles, this device is positioned for designs seeking a balance of performance, integration and maintainability over the product lifecycle.

Request a quote or submit an inquiry for EMMC04G-CT32-02DB0 to obtain pricing, availability and technical support information.

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