EMMC04G-CT32-02DB0
| Part Description |
IC FLASH 4GB EMMC 200MHZ 153FBGA |
|---|---|
| Quantity | 383 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (9x7.5) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4 bit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 128G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC04G-CT32-02DB0 – 4GB e•MMC 5.1 Flash (200 MHz, 153-WFBGA)
The EMMC04G-CT32-02DB0 is a 4GB packaged managed NAND flash device implementing the e•MMC™ 5.1 interface. It combines NAND flash memory and an onboard e•MMC controller to provide standard host-side access and offload flash management tasks from the host processor.
Designed for commercial and industrial applications, the device supports high-speed modes up to 200 MHz and provides integrated data integrity and management features for reliable embedded storage across a wide operating temperature range.
Key Features
- Core / Architecture Packaged managed NAND flash with an onboard e•MMC™ controller compliant with JEDEC e•MMC™ 5.1 (JESD84-B51), enabling standard host interface and internal flash management.
- Memory 4GB capacity in FLASH format. Memory organization is specified as 128G × 8.
- Interface & Bus Modes e•MMC interface with a ten-wire bus (clock, 1-bit command, 8-bit data) and optional hardware reset. Supports 1-bit, 4-bit and 8-bit data widths and alternate boot operation mode.
- Performance Variable clock frequencies from 0–200 MHz. Supports Single data transfer (up to 52 MB/s @ 52 MHz), DDR-104 (up to 104 MB/s @ 52 MHz), HS-200 (up to 200 MB/s @ 200 MHz) and HS-400 (up to 400 MB/s @ 200 MHz).
- Operating Voltage & Temperature Operating voltage options listed as VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V. Rated for operation from −25 °C to +85 °C and storage from −40 °C to +85 °C.
- Data Integrity & Reliability Internal ECC, Cyclic Redundancy Code (CRC) for command/data communication, enhanced data management algorithms, secure bad block erase and enhanced write protection (permanent and partial).
- Power & Field Management Power-off notification for sleep, host-initiated explicit sleep (CMD5), data protection for sudden power failure during program operations, and field firmware update (FFU).
- System & Maintenance Features Device health report, production state awareness, pre-EOL information, command queuing, cache flush and cache barrier reporting, background operation control and High Priority Interrupt (HPI).
- Package 153-ball JEDEC WFBGA package (153-FBGA, 9 × 7.5 mm) in a RoHS-compliant package description.
- Endurance Endurance specified at 3,000 program–erase cycles.
Typical Applications
- Industrial systems — Reliable onboard storage for firmware, system logging and application data across −25 °C to +85 °C operating conditions.
- Commercial embedded devices — Boot and application storage where an integrated e•MMC controller simplifies host design and flash management.
- Consumer and networking equipment — Embedded non-volatile storage for firmware, configuration and temporary data buffering using standard e•MMC interface modes.
Unique Advantages
- Highly integrated solution: Onboard e•MMC controller manages NAND media (ECC, wear-leveling and bad block management), reducing host software complexity.
- Flexible performance modes: Supports multiple bus widths and modes including HS-200 and HS-400 for scalable throughput up to the listed mode limits.
- Data integrity features: CRC for command/data, internal ECC and power-failure protection help maintain reliable data storage and communication.
- Field firmware update capability: FFU support enables in-field device firmware upgrades without replacing hardware.
- Operational robustness: Rated for −25 °C to +85 °C operation and includes production state reporting, device health, and pre-EOL information for lifecycle management.
- Compact, industry-standard package: 153-ball WFBGA (9 × 7.5 mm) provides a small-footprint integration option for embedded designs.
Why Choose EMMC04G-CT32-02DB0?
The EMMC04G-CT32-02DB0 delivers a standardized e•MMC™ 5.1 interface in a single, managed NAND package, combining controller-level flash management with a compact 153-ball WFBGA footprint. Its combination of configurable bus widths, high-speed modes up to 200 MHz, and integrated data-protection features make it suitable for commercial and industrial embedded storage applications that require a predictable, maintained interface to the host.
With built-in health reporting, field firmware update support and endurance specified at 3,000 program–erase cycles, this device is positioned for designs seeking a balance of performance, integration and maintainability over the product lifecycle.
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