EMMC32G-TS0A-01001

IC FLASH 256GBIT EMMC 153WFBGA
Part Description

IC FLASH 256GBIT EMMC 153WFBGA

Quantity 887 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC32G-TS0A-01001 – IC FLASH 256GBIT e•MMC 153WFBGA

The EMMC32G-TS0A-01001 is a packaged embedded flash memory device combining triple-level-cell (TLC) NAND with an onboard e•MMC™ controller and a JEDEC e•MMC™ 5.1 interface. It provides a managed, non-volatile storage solution tailored for commercial and industrial embedded systems that require compact, integrated flash storage.

With support for e•MMC™ 5.1 protocol features, multiple high-speed transfer modes and onboard media management, the device simplifies host design by offloading NAND management, error correction and wear-leveling to the integrated controller.

Key Features

  • Core Architecture  Packaged managed NAND flash with an onboard e•MMC™ 5.1 controller that handles flash/media management and performance optimization.
  • Memory Type & Capacity  256 Gbit total capacity organized as 32G × 8 using TLC NAND flash.
  • e•MMC™ Interface & Protocol  Compliant with JEDEC e•MMC™ 5.1 standard; backward compatible with prior e•MMC™ revisions and supports alternate boot operation.
  • Performance Modes  Variable clock frequencies 0–200 MHz with supported bus modes including single data rate (up to 52 MB/s @52 MHz on 8-bit), DDR-104 (up to 104 MB/s @52 MHz), HS-200 (up to 200 MB/s @200 MHz) and HS-400 (up to 400 MB/s @200 MHz).
  • Bus & Boot Options  Ten-wire bus interface with optional hardware reset; supports 1-bit, 4-bit and 8-bit data bus widths and host-initiated sleep/awake (CMD5).
  • Power & Voltage  Operating voltage range VCC = 3.3 V and VCCQ = 1.8 V / 3.3 V; supply range 2.7 V to 3.6 V.
  • Package  153-ball JEDEC FBGA (153-FBGA, 11.5 × 13 mm) RoHS-compliant package.
  • Temperature Range  Operating temperature range −25 °C to +85 °C and storage temperature −40 °C to +85 °C.
  • Reliability & Data Integrity  Internal ECC, CRC for command/data communication, enhanced data management, data protection for sudden power loss and endurance rated at 3,000 program-erase cycles.
  • Device Management & Security  Supports secure bad block erase commands, enhanced write protection (permanent and partial), field firmware update (FFU), device health report and production state awareness.
  • Advanced Host Features  Command queuing, cache flushing report, enhanced strobe, RPMB throughput improvements and background operation control with high-priority interrupt (HPI).

Typical Applications

  • Commercial Embedded Systems  Compact managed storage for general-purpose embedded devices requiring integrated NAND management and e•MMC™ interface support.
  • Industrial Controllers  Non-volatile program and data storage for industrial equipment operating across −25 °C to +85 °C.
  • Boot & System Storage  Alternate boot capability and onboard controller make the device suitable for primary boot media and system image storage in embedded designs.

Unique Advantages

  • Highly Integrated Storage  TLC NAND plus onboard e•MMC™ controller reduces host workload by internalizing wear-leveling, ECC and flash management.
  • Flexible Performance Modes  Support for 1/4/8-bit bus widths and multiple speed modes (including HS-200 and HS-400) lets designers balance throughput and interface complexity.
  • Robust Operating Range  Specified for −25 °C to +85 °C operation and −40 °C to +85 °C storage for use in a range of commercial and industrial environments.
  • Data Integrity & Power-Loss Protection  Built-in ECC, CRC and sudden-power-failure protection help maintain data integrity during program operations.
  • Device Management & Maintenance  Features such as field firmware update, device health reporting and production state awareness aid lifecycle management and diagnostics.
  • Compact, Standard Package  153-ball JEDEC FBGA (11.5 × 13 mm) offers a standardized footprint for space-constrained board designs.

Why Choose IC FLASH 256GBIT EMMC 153WFBGA?

The EMMC32G-TS0A-01001 positions itself as a ready-to-integrate embedded storage component that combines managed TLC NAND and an e•MMC™ 5.1 controller to reduce host design complexity while offering multiple high-speed transfer modes. Its feature set—onboard ECC, power-loss protection, device health reporting and field firmware update—supports reliable operation and maintainability in commercial and industrial applications.

Designed for engineers who need compact, managed non-volatile storage with configurable performance and a standardized FBGA package, this device delivers a balance of integration, performance modes and device-level management suitable for a wide range of embedded systems.

Request a quote or contact sales to discuss availability, pricing and technical details for EMMC32G-TS0A-01001.

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