EMMC32G-TS0A-01001
| Part Description |
IC FLASH 256GBIT EMMC 153WFBGA |
|---|---|
| Quantity | 887 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC32G-TS0A-01001 – IC FLASH 256GBIT e•MMC 153WFBGA
The EMMC32G-TS0A-01001 is a packaged embedded flash memory device combining triple-level-cell (TLC) NAND with an onboard e•MMC™ controller and a JEDEC e•MMC™ 5.1 interface. It provides a managed, non-volatile storage solution tailored for commercial and industrial embedded systems that require compact, integrated flash storage.
With support for e•MMC™ 5.1 protocol features, multiple high-speed transfer modes and onboard media management, the device simplifies host design by offloading NAND management, error correction and wear-leveling to the integrated controller.
Key Features
- Core Architecture Packaged managed NAND flash with an onboard e•MMC™ 5.1 controller that handles flash/media management and performance optimization.
- Memory Type & Capacity 256 Gbit total capacity organized as 32G × 8 using TLC NAND flash.
- e•MMC™ Interface & Protocol Compliant with JEDEC e•MMC™ 5.1 standard; backward compatible with prior e•MMC™ revisions and supports alternate boot operation.
- Performance Modes Variable clock frequencies 0–200 MHz with supported bus modes including single data rate (up to 52 MB/s @52 MHz on 8-bit), DDR-104 (up to 104 MB/s @52 MHz), HS-200 (up to 200 MB/s @200 MHz) and HS-400 (up to 400 MB/s @200 MHz).
- Bus & Boot Options Ten-wire bus interface with optional hardware reset; supports 1-bit, 4-bit and 8-bit data bus widths and host-initiated sleep/awake (CMD5).
- Power & Voltage Operating voltage range VCC = 3.3 V and VCCQ = 1.8 V / 3.3 V; supply range 2.7 V to 3.6 V.
- Package 153-ball JEDEC FBGA (153-FBGA, 11.5 × 13 mm) RoHS-compliant package.
- Temperature Range Operating temperature range −25 °C to +85 °C and storage temperature −40 °C to +85 °C.
- Reliability & Data Integrity Internal ECC, CRC for command/data communication, enhanced data management, data protection for sudden power loss and endurance rated at 3,000 program-erase cycles.
- Device Management & Security Supports secure bad block erase commands, enhanced write protection (permanent and partial), field firmware update (FFU), device health report and production state awareness.
- Advanced Host Features Command queuing, cache flushing report, enhanced strobe, RPMB throughput improvements and background operation control with high-priority interrupt (HPI).
Typical Applications
- Commercial Embedded Systems Compact managed storage for general-purpose embedded devices requiring integrated NAND management and e•MMC™ interface support.
- Industrial Controllers Non-volatile program and data storage for industrial equipment operating across −25 °C to +85 °C.
- Boot & System Storage Alternate boot capability and onboard controller make the device suitable for primary boot media and system image storage in embedded designs.
Unique Advantages
- Highly Integrated Storage TLC NAND plus onboard e•MMC™ controller reduces host workload by internalizing wear-leveling, ECC and flash management.
- Flexible Performance Modes Support for 1/4/8-bit bus widths and multiple speed modes (including HS-200 and HS-400) lets designers balance throughput and interface complexity.
- Robust Operating Range Specified for −25 °C to +85 °C operation and −40 °C to +85 °C storage for use in a range of commercial and industrial environments.
- Data Integrity & Power-Loss Protection Built-in ECC, CRC and sudden-power-failure protection help maintain data integrity during program operations.
- Device Management & Maintenance Features such as field firmware update, device health reporting and production state awareness aid lifecycle management and diagnostics.
- Compact, Standard Package 153-ball JEDEC FBGA (11.5 × 13 mm) offers a standardized footprint for space-constrained board designs.
Why Choose IC FLASH 256GBIT EMMC 153WFBGA?
The EMMC32G-TS0A-01001 positions itself as a ready-to-integrate embedded storage component that combines managed TLC NAND and an e•MMC™ 5.1 controller to reduce host design complexity while offering multiple high-speed transfer modes. Its feature set—onboard ECC, power-loss protection, device health reporting and field firmware update—supports reliable operation and maintainability in commercial and industrial applications.
Designed for engineers who need compact, managed non-volatile storage with configurable performance and a standardized FBGA package, this device delivers a balance of integration, performance modes and device-level management suitable for a wide range of embedded systems.
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