EMMC32G-TX29-8AD11

IC FLASH 256GBIT EMMC 153WFBGA
Part Description

IC FLASH 256GBIT EMMC 153WFBGA

Quantity 1,088 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage1.8V, 3.3VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH not applicable
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC32G-TX29-8AD11 – IC FLASH 256Gbit e•MMC 153-WFBGA

The EMMC32G-TX29-8AD11 is a packaged managed NAND flash device integrating triple-level cell (TLC) NAND with an onboard e•MMC™ 5.1 controller. It provides a standardized e•MMC interface and internal flash management to simplify host system design.

Designed for commercial and industrial applications, this device delivers dense non-volatile storage (256 Gbit) in a 153-ball FBGA (11.5 × 13 mm) package with an operating temperature range of -25°C to +85°C and support for VCCQ = 1.8 V/3.3 V and VCC = 3.3 V.

Key Features

  • Core Architecture  Packaged managed NAND flash combining TLC NAND with an onboard e•MMC™ 5.1 controller to handle media management, error control and performance optimization.
  • Memory  256 Gbit capacity organized as 32G × 8, providing high-density non-volatile storage.
  • Interface & Bus  JEDEC e•MMC™ 5.1 interface with ten-wire bus (clock, command, 8-bit data) and support for 1-, 4- and 8-bit data widths and an optional hardware reset.
  • Performance Modes  Multiple transfer modes: single data rate up to 52 MB/s (8-bit @ 52 MHz), DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s, and HS-400 up to 400 MB/s.
  • Voltage & Power  Supports VCCQ = 1.8 V or 3.3 V and VCC = 3.3 V.
  • Package & Mechanical  153-ball JEDEC FBGA package (153-WFBGA, 11.5 × 13 mm) for compact board-level integration.
  • Temperature Range  Operating (Tcase) from -25°C to +85°C and storage temperature range –40°C to +85°C.
  • Data Integrity & Reliability  Internal ECC, CRC for command/data communication, enhanced data management algorithms and protection features including secure bad block erase and enhanced write protection.
  • System Features  Supports alternate boot operation, SLEEP/AWAKE (CMD5), host-initiated explicit sleep, power-off notification, command queuing, field firmware update (FFU), device health report and cache flushing/reporting capabilities.

Typical Applications

  • Commercial Embedded Storage  Provides compact, managed non-volatile storage for commercial electronics requiring standardized e•MMC™ interfaces.
  • Industrial Systems  Suited for industrial applications operating within -25°C to +85°C that need dense local storage and onboard flash management.
  • Boot and Firmware Storage  Supports alternate boot operation and field firmware update (FFU) modes for streamlined boot sequences and in-field firmware maintenance.
  • System Health & Diagnostics  Device health reporting, production state awareness and pre-EOL information help with diagnostics and product lifecycle management.

Unique Advantages

  • Integrated Flash Management:  Onboard e•MMC™ controller manages ECC, wear-leveling and NAND media tasks, reducing host processing and firmware complexity.
  • Standards-Based Compatibility:  Complies with JEDEC e•MMC™ 5.1 and is backward compatible with prior e•MMC™ revisions, aiding product sustainment across future revisions.
  • Flexible Performance Modes:  Multiple bus widths and transfer modes (SDR, DDR-104, HS-200, HS-400) allow designers to choose appropriate throughput for their application.
  • Robust Data Protection:  Internal ECC, CRC checks, secure bad block erase and power-off notification features reduce the risk of data corruption during normal operation and power events.
  • Compact, Industry Package:  153-ball FBGA (11.5 × 13 mm) offers high-density storage in a small footprint for space-constrained designs.
  • Operational Visibility:  Device health reports, production state awareness and cache/reporting features support maintenance and lifecycle planning.

Why Choose EMMC32G-TX29-8AD11?

The EMMC32G-TX29-8AD11 combines high-density TLC NAND with a managed e•MMC™ 5.1 controller to deliver a compact, standards-based storage solution that offloads flash management from the host. Its configurable bus widths and multiple transfer modes provide flexibility between throughput and system complexity.

With built-in data protection features, field firmware update support and device health reporting, this device is positioned for commercial and industrial embedded designs that require reliable, maintainable non-volatile storage and simplified system integration.

Request a quote or submit an inquiry to discuss availability, pricing and technical details for integrating the EMMC32G-TX29-8AD11 into your design.

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