EMMC32G-TX29-8AD11
| Part Description |
IC FLASH 256GBIT EMMC 153WFBGA |
|---|---|
| Quantity | 1,088 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.8V, 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH not applicable | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC32G-TX29-8AD11 – IC FLASH 256Gbit e•MMC 153-WFBGA
The EMMC32G-TX29-8AD11 is a packaged managed NAND flash device integrating triple-level cell (TLC) NAND with an onboard e•MMC™ 5.1 controller. It provides a standardized e•MMC interface and internal flash management to simplify host system design.
Designed for commercial and industrial applications, this device delivers dense non-volatile storage (256 Gbit) in a 153-ball FBGA (11.5 × 13 mm) package with an operating temperature range of -25°C to +85°C and support for VCCQ = 1.8 V/3.3 V and VCC = 3.3 V.
Key Features
- Core Architecture Packaged managed NAND flash combining TLC NAND with an onboard e•MMC™ 5.1 controller to handle media management, error control and performance optimization.
- Memory 256 Gbit capacity organized as 32G × 8, providing high-density non-volatile storage.
- Interface & Bus JEDEC e•MMC™ 5.1 interface with ten-wire bus (clock, command, 8-bit data) and support for 1-, 4- and 8-bit data widths and an optional hardware reset.
- Performance Modes Multiple transfer modes: single data rate up to 52 MB/s (8-bit @ 52 MHz), DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s, and HS-400 up to 400 MB/s.
- Voltage & Power Supports VCCQ = 1.8 V or 3.3 V and VCC = 3.3 V.
- Package & Mechanical 153-ball JEDEC FBGA package (153-WFBGA, 11.5 × 13 mm) for compact board-level integration.
- Temperature Range Operating (Tcase) from -25°C to +85°C and storage temperature range –40°C to +85°C.
- Data Integrity & Reliability Internal ECC, CRC for command/data communication, enhanced data management algorithms and protection features including secure bad block erase and enhanced write protection.
- System Features Supports alternate boot operation, SLEEP/AWAKE (CMD5), host-initiated explicit sleep, power-off notification, command queuing, field firmware update (FFU), device health report and cache flushing/reporting capabilities.
Typical Applications
- Commercial Embedded Storage Provides compact, managed non-volatile storage for commercial electronics requiring standardized e•MMC™ interfaces.
- Industrial Systems Suited for industrial applications operating within -25°C to +85°C that need dense local storage and onboard flash management.
- Boot and Firmware Storage Supports alternate boot operation and field firmware update (FFU) modes for streamlined boot sequences and in-field firmware maintenance.
- System Health & Diagnostics Device health reporting, production state awareness and pre-EOL information help with diagnostics and product lifecycle management.
Unique Advantages
- Integrated Flash Management: Onboard e•MMC™ controller manages ECC, wear-leveling and NAND media tasks, reducing host processing and firmware complexity.
- Standards-Based Compatibility: Complies with JEDEC e•MMC™ 5.1 and is backward compatible with prior e•MMC™ revisions, aiding product sustainment across future revisions.
- Flexible Performance Modes: Multiple bus widths and transfer modes (SDR, DDR-104, HS-200, HS-400) allow designers to choose appropriate throughput for their application.
- Robust Data Protection: Internal ECC, CRC checks, secure bad block erase and power-off notification features reduce the risk of data corruption during normal operation and power events.
- Compact, Industry Package: 153-ball FBGA (11.5 × 13 mm) offers high-density storage in a small footprint for space-constrained designs.
- Operational Visibility: Device health reports, production state awareness and cache/reporting features support maintenance and lifecycle planning.
Why Choose EMMC32G-TX29-8AD11?
The EMMC32G-TX29-8AD11 combines high-density TLC NAND with a managed e•MMC™ 5.1 controller to deliver a compact, standards-based storage solution that offloads flash management from the host. Its configurable bus widths and multiple transfer modes provide flexibility between throughput and system complexity.
With built-in data protection features, field firmware update support and device health reporting, this device is positioned for commercial and industrial embedded designs that require reliable, maintainable non-volatile storage and simplified system integration.
Request a quote or submit an inquiry to discuss availability, pricing and technical details for integrating the EMMC32G-TX29-8AD11 into your design.