EMMC64G-IY29-5B101

IC FLSH 512GBIT EMMC 5.1 153FBGA
Part Description

IC FLSH 512GBIT EMMC 5.1 153FBGA

Quantity 1,734 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC64G-IY29-5B101 – IC FLSH 512GBIT eMMC 5.1 153FBGA

The EMMC64G-IY29-5B101 is a packaged managed NAND flash memory device with an e•MMC™ 5.1 interface manufactured by Kingston Technology. It integrates triple-level cell (TLC) NAND flash with an onboard e•MMC controller to provide a standardized embedded storage solution for commercial and industrial applications.

Designed for systems requiring compact, managed non-volatile storage, this device delivers industry-standard e•MMC 5.1 functionality, support for multiple high-speed bus modes, and features for data integrity and media management suitable for embedded system designs operating across a wide temperature range.

Key Features

  • Core Architecture  Packaged managed NAND flash that combines TLC NAND media with an onboard e•MMC controller to offload flash management from the host.
  • Memory and Organization  512 Gbit memory capacity organized as 64G × 8, using NAND (TLC) technology for non-volatile storage.
  • e•MMC 5.1 Interface  Compliant with JEDEC e•MMC 5.1 (JESD84-B51); backward compatible with prior e•MMC revisions and supports standard e•MMC protocol features.
  • High-speed Bus Modes  Supports single-data-rate up to 52 MB/s, DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s, and HS-400 up to 400 MB/s. Supports 1-bit, 4-bit, and 8-bit data bus widths.
  • Bus and Reset  Ten-wire bus interface (clock, 1-bit command, 8-bit data) with an optional hardware reset and variable clock frequencies up to 200 MHz.
  • Data Integrity & Reliability  Internal ECC, CRC for command/data communication, enhanced data management algorithms and power-off protection during program operations.
  • Security & Management  Secure bad block erase commands, enhanced write protection (permanent and partial), RPMB improvements, field firmware update (FFU), device health report and production state awareness.
  • Package & Temperature  153-ball JEDEC FBGA package (153-WFBGA / 153-FBGA, 11.5 × 13 mm) and industrial operating temperature range of -40 °C to +85 °C.
  • Operating Voltage  Supports VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V as specified in the product datasheet.

Typical Applications

  • Industrial Embedded Systems  Provides managed non-volatile storage for industrial controllers and instrumentation that require operation across -40 °C to +85 °C.
  • Commercial Embedded Devices  Suitable for consumer and commercial embedded platforms needing a standardized e•MMC 5.1 interface and onboard flash management.
  • Networking and Communication Equipment  Compact onboard storage for firmware, configuration and logging where ECC, CRC and power-off protection help maintain data integrity.
  • Appliance & IoT Devices  Enables local storage of system code and user data with integrated wear-leveling and secure write protection to simplify host design.

Unique Advantages

  • Integrated Managed NAND  Onboard e•MMC controller plus TLC NAND reduces host-side flash management requirements and simplifies system firmware.
  • Standards Compliance  Conforms to JEDEC e•MMC 5.1 (JESD84-B51) and is backward compatible with prior revisions, aiding long-term system sustainment.
  • Multiple High-Speed Modes  Support for HS-200 and HS-400 modes with up to 400 MB/s theoretical transfer capability provides flexibility for different throughput needs.
  • Industrial Temperature Rating  Rated for operation from -40 °C to +85 °C, enabling deployment in environments with wide temperature ranges.
  • Robust Data Protection  ECC, CRC, enhanced data management and power-off protection features improve data integrity and reduce failure risk during critical operations.
  • Compact FBGA Package  153-ball WFBGA (11.5 × 13 mm) package provides a high-density footprint for space-constrained embedded boards.

Why Choose IC FLSH 512GBIT EMMC 5.1 153FBGA?

The EMMC64G-IY29-5B101 offers a compact, standards-based embedded storage solution that couples TLC NAND with an integrated e•MMC 5.1 controller. Its combination of industrial temperature operation, multiple high-speed bus modes, and on-device data-management and protection features make it suitable for commercial and industrial embedded designs that require managed, non-volatile storage.

Designed by Kingston Digital Inc., this device is positioned for designers seeking a compliant e•MMC 5.1 module that reduces host design complexity while providing diagnostic and maintenance capabilities such as field firmware update and device health reporting to support product lifecycle needs.

Request a quote or submit an inquiry for pricing and availability to evaluate the EMMC64G-IY29-5B101 for your embedded storage requirements.

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