EMMC64G-IY29-5B101
| Part Description |
IC FLSH 512GBIT EMMC 5.1 153FBGA |
|---|---|
| Quantity | 1,734 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC64G-IY29-5B101 – IC FLSH 512GBIT eMMC 5.1 153FBGA
The EMMC64G-IY29-5B101 is a packaged managed NAND flash memory device with an e•MMC™ 5.1 interface manufactured by Kingston Technology. It integrates triple-level cell (TLC) NAND flash with an onboard e•MMC controller to provide a standardized embedded storage solution for commercial and industrial applications.
Designed for systems requiring compact, managed non-volatile storage, this device delivers industry-standard e•MMC 5.1 functionality, support for multiple high-speed bus modes, and features for data integrity and media management suitable for embedded system designs operating across a wide temperature range.
Key Features
- Core Architecture Packaged managed NAND flash that combines TLC NAND media with an onboard e•MMC controller to offload flash management from the host.
- Memory and Organization 512 Gbit memory capacity organized as 64G × 8, using NAND (TLC) technology for non-volatile storage.
- e•MMC 5.1 Interface Compliant with JEDEC e•MMC 5.1 (JESD84-B51); backward compatible with prior e•MMC revisions and supports standard e•MMC protocol features.
- High-speed Bus Modes Supports single-data-rate up to 52 MB/s, DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s, and HS-400 up to 400 MB/s. Supports 1-bit, 4-bit, and 8-bit data bus widths.
- Bus and Reset Ten-wire bus interface (clock, 1-bit command, 8-bit data) with an optional hardware reset and variable clock frequencies up to 200 MHz.
- Data Integrity & Reliability Internal ECC, CRC for command/data communication, enhanced data management algorithms and power-off protection during program operations.
- Security & Management Secure bad block erase commands, enhanced write protection (permanent and partial), RPMB improvements, field firmware update (FFU), device health report and production state awareness.
- Package & Temperature 153-ball JEDEC FBGA package (153-WFBGA / 153-FBGA, 11.5 × 13 mm) and industrial operating temperature range of -40 °C to +85 °C.
- Operating Voltage Supports VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V as specified in the product datasheet.
Typical Applications
- Industrial Embedded Systems Provides managed non-volatile storage for industrial controllers and instrumentation that require operation across -40 °C to +85 °C.
- Commercial Embedded Devices Suitable for consumer and commercial embedded platforms needing a standardized e•MMC 5.1 interface and onboard flash management.
- Networking and Communication Equipment Compact onboard storage for firmware, configuration and logging where ECC, CRC and power-off protection help maintain data integrity.
- Appliance & IoT Devices Enables local storage of system code and user data with integrated wear-leveling and secure write protection to simplify host design.
Unique Advantages
- Integrated Managed NAND Onboard e•MMC controller plus TLC NAND reduces host-side flash management requirements and simplifies system firmware.
- Standards Compliance Conforms to JEDEC e•MMC 5.1 (JESD84-B51) and is backward compatible with prior revisions, aiding long-term system sustainment.
- Multiple High-Speed Modes Support for HS-200 and HS-400 modes with up to 400 MB/s theoretical transfer capability provides flexibility for different throughput needs.
- Industrial Temperature Rating Rated for operation from -40 °C to +85 °C, enabling deployment in environments with wide temperature ranges.
- Robust Data Protection ECC, CRC, enhanced data management and power-off protection features improve data integrity and reduce failure risk during critical operations.
- Compact FBGA Package 153-ball WFBGA (11.5 × 13 mm) package provides a high-density footprint for space-constrained embedded boards.
Why Choose IC FLSH 512GBIT EMMC 5.1 153FBGA?
The EMMC64G-IY29-5B101 offers a compact, standards-based embedded storage solution that couples TLC NAND with an integrated e•MMC 5.1 controller. Its combination of industrial temperature operation, multiple high-speed bus modes, and on-device data-management and protection features make it suitable for commercial and industrial embedded designs that require managed, non-volatile storage.
Designed by Kingston Digital Inc., this device is positioned for designers seeking a compliant e•MMC 5.1 module that reduces host design complexity while providing diagnostic and maintenance capabilities such as field firmware update and device health reporting to support product lifecycle needs.
Request a quote or submit an inquiry for pricing and availability to evaluate the EMMC64G-IY29-5B101 for your embedded storage requirements.