EMMC64G-TY29-5B101

The EMMC64G-TY29-5B101 is a packaged managed NAND flash device combining triple-level cell (TLC) NAND with an onboard e•MMC controller following the JEDEC e•MMC 5.1 standard. It provides 512 Gbit of non-volatile storage in a compact 153-ball FBGA package designed for commercial and industrial embedded storage needs.

With an integrated controller that handles error correction, wear-leveling and flash management, this e•MMC device simplifies host design and delivers standardized e•MMC connectivity, multi-mode bus operation and features for robust data integrity and secure storage.

Key Features

• Core Architecture: Packaged managed NAND flash with an e•MMC 5.1 interface and an onboard controller that manages NAND media and device-level functions.
• Memory Organization & Capacity: 512 Gbit total capacity organized as 64G × 8, implemented as TLC NAND.
• High‑speed Interfaces: Supports e•MMC bus modes including single data rate (up to 52 MB/s with 8-bit @52MHz), DDR-104 (up to 104 MB/s), HS-200 (up to 200 MB/s @200MHz) and HS-400 (up to 400 MB/s @200MHz).
• Bus Flexibility: Ten-wire bus with optional hardware reset and selectable data widths (1-bit, 4-bit, 8-bit) for host interface flexibility.
• Power and Voltage: Operates with VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V as specified in the product datasheet.
• Data Integrity & Reliability: Internal ECC, Cyclic Redundancy Code (CRC) for commands/data, enhanced data management algorithms and protections for sudden power loss during program operations.
• Security & Partitioning: Secure write protection options, secure bad block erase commands, RPMB throughput improvements and support for multiple user data partitions with enhanced attributes.
• Advanced Device Management: Features include field firmware update (FFU), device health reporting, production state awareness, command queuing, cache flushing report and enhanced strobe.
• Package & Temperature Range: 153-ball JEDEC FBGA package (153-FBGA, 11.5 × 13 mm) with operating temperature range of −25 °C to +85 °C and storage temperature −40 °C to +85 °C.

Typical Applications

• Commercial Embedded Systems: Provides managed non-volatile storage for general commercial devices requiring standardized e•MMC connectivity and onboard flash management.
• Industrial Equipment: Designed for industrial use cases within the specified operating temperature range where integrated flash management and data protection are required.
• Boot and System Storage: Supports alternate boot operation mode for simple boot sequencing and reliable system boot storage.
• Secure Data Partitions: RPMB and secure write protection features support authenticated or protected storage areas for device security and integrity needs.

Unique Advantages

• Integrated Flash Management: Onboard e•MMC controller handles ECC, wear‑leveling and NAND management, reducing host software complexity.
• Multi‑Mode Performance: Support for HS-200 and HS-400 modes enables scalable throughput options to match host capability and application requirements.
• Standardized Interface: JEDEC e•MMC 5.1 compliance and backward compatibility ease system integration and long-term product sustainment.
• Robust Data Protection: CRC, internal ECC and sudden power-failure protections improve data integrity during program operations.
• Compact Industrial Package: 153-ball FBGA (11.5 × 13 mm) provides high-density storage in a small footprint suitable for space-constrained designs.
• Device Manageability: Features such as FFU, device health report and command queuing support field maintenance and system diagnostics.

Why Choose EMMC64G-TY29-5B101?

EMMC64G-TY29-5B101 delivers a standardized, managed NAND storage solution with 512 Gbit capacity and an onboard e•MMC 5.1 controller that offloads flash management from the host. Its combination of multi-mode performance, integrated reliability features and secure partition support makes it well suited for commercial and industrial embedded designs that require compact, predictable non-volatile storage.

Manufactured by Kingston Digital Inc., the device’s JEDEC compliance and backward compatibility support longer-term design sustainment across future e•MMC revisions and NAND generations, helping to reduce integration risk and simplify product lifecycle management.

Request a quote or submit an inquiry for pricing and availability of EMMC64G-TY29-5B101 to evaluate it for your next embedded storage design.