EMMC64G-TY29-5B111
| Part Description |
IC FLASH 512GBIT EMMC 153WFBGA |
|---|---|
| Quantity | 337 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kingston Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.8V, 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH not applicable | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of EMMC64G-TY29-5B111 – IC FLASH 512GBIT EMMC 153WFBGA
The EMMC64G-TY29-5B111 is a packaged managed NAND flash memory device that integrates triple-level cell (TLC) NAND with an onboard e·MMC™ 5.1 controller. It provides a standard e·MMC interface and on-chip management to serve as a compact, single-component storage solution for commercial and industrial embedded systems.
Designed for applications requiring non-volatile block storage, the device delivers a range of protocol, bus-width and power options along with data integrity features and internal flash management to offload the host processor.
Key Features
- e·MMC™ 5.1 Interface Compliant with JEDEC e·MMC™ 5.1 (JESD84-B51) and backward compatible with prior e·MMC revisions, providing a standard host interface and protocol support.
- Managed NAND (TLC) Packaged triple-level cell (TLC) NAND with an integrated controller that handles NAND management, wear-leveling and internal error correction.
- Memory Organization & Capacity 64G × 8 organization delivering a total memory size of 512 Gbit in a single integrated package.
- Supported Bus Modes & Speeds Supports 1-, 4-, and 8-bit data buses and multiple transfer modes: single data rate (up to 52 MB/s), DDR-104 (up to 104 MB/s @ 52 MHz), HS-200 (up to 200 MB/s @ 200 MHz) and HS-400 (up to 400 MB/s @ 200 MHz).
- Signal & Power VCCQ supported at 1.8 V or 3.3 V and VCC at 3.3 V, enabling flexible host interface voltage configurations.
- Package & Mounting 153-ball JEDEC WFBGA package (153-FBGA, 11.5 × 13 mm) providing a compact footprint for board-level integration.
- Operating Temperature Rated for operation from −25 °C to +85 °C with storage temperature specified from −40 °C to +85 °C.
- Data Integrity & Reliability Internal ECC, CRC for command/data communication, power-off data protection during program operations, secure bad block erase and enhanced write protection options.
- Operational & Management Features Supports alternate boot mode, SLEEP/AWAKE (CMD5), field firmware update (FFU), device health reporting, command queuing, cache flushing report and production state awareness.
Typical Applications
- Commercial Embedded Storage Serves as compact non-volatile storage for general embedded systems that require standard e·MMC interface and managed NAND functionality.
- Industrial Control & Instrumentation Provides robust storage across the device operating range (−25 °C to +85 °C) for industrial controllers and data-logging equipment.
- Consumer & IoT Devices Used where a single-package managed flash solution simplifies BOM and offloads flash management from the host processor.
Unique Advantages
- Integrated Managed Flash: Onboard e·MMC controller manages NAND flash media, reducing host processor overhead for wear-leveling, error control and performance optimization.
- Standardized Interface: JEDEC e·MMC™ 5.1 compliance and backward compatibility simplify integration with existing e·MMC host controllers and future-proof product sustainment.
- Flexible Performance Modes: Multiple bus widths and transfer modes (including HS-200 and HS-400) allow designers to match bandwidth to application needs.
- Data Protection Features: Internal ECC, CRC, secure bad block handling and power-off protection mitigate common flash reliability concerns in embedded deployments.
- Compact, Board-Ready Package: 153-ball WFBGA (11.5 × 13 mm) package provides dense storage in a small footprint suitable for space-constrained designs.
Why Choose IC FLASH 512GBIT EMMC 153WFBGA?
The EMMC64G-TY29-5B111 combines TLC NAND and an integrated e·MMC™ 5.1 controller into a single, managed storage component that simplifies system design by handling flash management and data integrity tasks internally. Its JEDEC-compliant interface, flexible voltage options and multiple transfer modes make it suitable for a wide range of commercial and industrial embedded applications.
This device is well suited to designers seeking a standardized, compact non-volatile storage solution that offers protocol compatibility, onboard management features and temperature-rated operation for sustained deployment and product lifecycle support.
If you need pricing or availability, request a quote or submit an inquiry to receive product and purchasing information for the EMMC64G-TY29-5B111.
