EMMC32G-TX29-8AD01

IC FLASH 256GBIT EMMC 153WFBGA
Part Description

IC FLASH 256GBIT EMMC 153WFBGA

Quantity 451 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerKingston Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage1.8V, 3.3VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°CWrite Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH not applicable
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of EMMC32G-TX29-8AD01 – IC FLASH 256GBIT eMMC 153WFBGA

The EMMC32G-TX29-8AD01 is a packaged managed NAND flash device implementing the e·MMC™ 5.1 interface. It integrates TLC NAND flash (32G × 8 organization, 256 Gbit) with an onboard e·MMC controller to provide a standardized, managed storage element for commercial and industrial embedded systems.

Designed for use as universal embedded storage, the device delivers multiple bus modes and data rates, integrated data management and protection features, and a compact 153-ball WFBGA package suitable for space-constrained designs operating between -25°C and +85°C.

Key Features

  • Core / Interface  e·MMC™ 5.1 compliant managed NAND solution with backward compatibility to prior e·MMC revisions and support for high-speed protocols and variable clock frequencies up to 200 MHz.
  • Memory  256 Gbit total capacity organized as 32G × 8 using TLC NAND flash, providing a non-volatile flash memory format with an integrated controller for media management.
  • Performance Modes  Supports 1-bit, 4-bit and 8-bit data bus widths and multiple transfer modes: single data rate up to 52 MB/s, DDR-104 up to 104 MB/s, HS-200 up to 200 MB/s, and HS-400 up to 400 MB/s.
  • Power  Operating supply ranges include VCCQ = 1.8 V / 3.3 V and VCC = 3.3 V, with host-initiated sleep/awake support (CMD5) and explicit sleep mode for power saving.
  • Reliability & Data Integrity  Internal ECC, CRC for command/data communication, enhanced data management algorithms, secure bad block erase, and data protection mechanisms for sudden power loss during program operations.
  • Advanced Management  Features include field firmware update (FFU), device health reporting, command queuing, cache flushing and barrier reporting, enhanced write protection (permanent and partial), and production state awareness.
  • Package & Temperature  153-ball JEDEC WFBGA package (153-FBGA, 11.5 × 13 mm) with operating Tcase range of -25°C to +85°C and storage range -40°C to +85°C.

Typical Applications

  • Commercial Embedded Storage  Use as primary managed storage in commercial embedded devices where a standardized e·MMC interface and integrated flash management simplify system design.
  • Industrial Systems  Suitable for industrial applications that require non-volatile storage with wide operating temperature support and built-in data integrity features.
  • Boot and System Memory  Supports alternate boot operation mode to provide a simple boot sequence for embedded controllers and system boot partitions.

Unique Advantages

  • Standards-based integration: e·MMC™ 5.1 compliance and backward compatibility reduce host interface complexity and ease migration across NAND generations.
  • Managed NAND with on-board controller: On-device management (ECC, wear-leveling, bad block handling) offloads NAND maintenance from the host processor and simplifies firmware design.
  • Flexible performance modes: Multiple bus widths and transfer modes (up to HS-400) let designers scale throughput to match application requirements and system interfaces.
  • Robust data protection: CRC, internal ECC, secure bad block erase, and power-loss program protection enhance reliability for data-critical embedded applications.
  • Field update and diagnostics: Field firmware update and device health reporting support in-field maintenance and lifecycle management.
  • Compact package for space-constrained designs: 153-WFBGA (11.5 × 13 mm) offers a small form factor while supporting industrial temperature operation.

Why Choose EMMC32G-TX29-8AD01?

The EMMC32G-TX29-8AD01 combines a standards-based e·MMC 5.1 interface with integrated TLC NAND and a controller to deliver managed, high-density non-volatile storage suitable for commercial and industrial embedded systems. Its range of bus widths and transfer modes, together with on-device ECC, CRC and power-loss protection, make it well suited for designs that require a reliable, off-host-managed storage solution.

This device is appropriate for engineers and procurement teams seeking a compact 153-ball WFBGA package with defined operating voltages (VCCQ 1.8 V / 3.3 V, VCC 3.3 V) and an operating temperature range of -25°C to +85°C, providing long-term sustainment through JEDEC e·MMC standard compatibility and field firmware update capability.

Request a quote or contact sales to discuss availability, lead times and pricing for the EMMC32G-TX29-8AD01.

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