F50D1G41LB (2M)

The F50D1G41LB (2M) is a non-volatile NAND Flash memory device from ESMT's SPI NAND family, organized as 128M × 8 for a total density of 1.074 Gbit. It targets applications requiring automotive-grade qualification and extended temperature operation.

Built on SPI NAND technology with a parallel memory organization, the device combines a compact 8-contact WSON surface-mount package with specifications aimed at embedded storage tasks where AEC-Q100 qualification and wide operating temperatures are required.

Key Features

• Memory Capacity & Organization — 1.074 Gbit density organized as 128M × 8, suitable for mid-range embedded storage requirements.
• Technology & Format — NAND Flash using SPI NAND technology; memory type is non-volatile for persistent data retention.
• Performance — 83 MHz clock frequency and an access time of 8 ns support responsive read operations; typical write cycle time (word page) is 900 µs.
• Voltage — Product name indicates 1.8V operation; specification lists a voltage supply value of 2.5V.
• Reliability & Qualification — AEC-Q100 qualification and an automotive-grade designation indicate suitability for automotive development environments that require qualified components.
• Package & Mounting — Supplied in an 8-contact WSON package for surface-mount assembly, enabling compact board integration.
• Temperature Range — Rated operating temperature from -40 °C to 105 °C for deployment in wide-temperature environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive systems — Non-volatile storage for automotive electronics where AEC-Q100 qualification and extended temperature range are required.
• Embedded storage — Firmware and data storage in compact surface-mount designs that require a 1.074 Gbit NAND solution.
• Harsh-temperature environments — Applications needing reliable operation from -40 °C to 105 °C.

Unique Advantages

• AEC-Q100 qualified — Meets automotive qualification requirements for use in designs that require qualified components.
• Wide operating temperature — -40 °C to 105 °C rating supports deployment across broad environmental conditions.
• Compact surface-mount package — 8-contact WSON enables small-footprint PCB integration and automated assembly.
• Appropriate performance balance — 83 MHz clock frequency and 8 ns access time provide responsive memory access for embedded tasks.
• RoHS compliant — Conforms to environmental and regulatory requirements for many commercial and automotive programs.

Why Choose F50D1G41LB (2M)?

The F50D1G41LB (2M) positions itself as an automotive-grade SPI NAND Flash device delivering 1.074 Gbit capacity in a compact 8-contact WSON surface-mount package. With AEC-Q100 qualification and an operating range from -40 °C to 105 °C, it addresses designs that require qualified, wide-temperature non-volatile storage.

This device is suited to engineering teams building embedded automotive systems or other designs needing a qualified NAND solution with mid-range capacity, defined timing characteristics (83 MHz clock, 8 ns access), and surface-mount packaging for space-constrained boards. Its RoHS compliance further supports regulatory requirements in production programs.

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