F50D1G41LB-IP(2M)

The F50D1G41LB-IP(2M) is a 1.074 Gbit SPI NAND flash memory device from ESMT designed for compact, low-pin-count non-volatile storage. Built on SPI‑NAND architecture, it combines high-density storage with serial SPI command protocols and internal error correction to support reliable firmware and data storage in space-constrained embedded and industrial designs.

This device targets systems that require low-voltage operation, internal ECC and fast program/erase cycles, offering industrial-grade temperature support and a small 8-contact WSON surface-mount package for streamlined board integration.

Key Features

• Memory Capacity & Organization — 1.074 Gbit total capacity organized as 128M × 8 with page structure of 2,048‑byte data plus 64‑byte spare area for management and ECC.
• Low‑Voltage Operation (1.8V) — Nominal 1.8V supply (documented operating range 1.7V–1.95V) suitable for systems using a 1.8V rail.
• SPI Serial Interface — Industry-standard SPI command set and signals (SCK, SI, SO, CS#) with support for SPI Mode 0 and Mode 3 for simple, low-pin-count connections.
• Internal ECC — Built-in 1‑bit error correction per 512 bytes to detect and correct storage errors and report ECC status on readback.
• Fast Program/Erase and Read — Typical program time ~400 µs, block erase ~4 ms, and read-from-cell-to-register in ~100 µs; power-up ready time up to 1 ms.
• Reliability — Endurance rated to 100K program/erase cycles and data retention of 10 years for robust long-term storage.
• Package & Mounting — 8-contact WSON surface-mount package (compact 8×6 mm variants in series ordering), optimized for dense PCB layouts.
• Industrial Temperature Range — Specified operating temperature from −40°C to 85°C for industrial applications.
• System Features — Hardware data protection, bad-block protection, OTP and boot-read support to simplify boot and firmware management.

Typical Applications

• Embedded and Industrial Controllers — Non-volatile storage of firmware and configuration data where low pin count and industrial temperature capability are required.
• Firmware and Boot Storage — Boot-read support and internal ECC make the device suitable for storing boot code and system firmware with integrity checks.
• Space-Constrained Designs — Compact 8-contact WSON package and SPI interface enable implementation in small-form-factor modules and PCBs.

Unique Advantages

• High‑density Serial Storage: 1.074 Gbit capacity in a serial SPI interface delivers significant non-volatile storage without the pin count of parallel NAND.
• Integrated ECC Management: Internal 1‑bit ECC per 512 bytes reduces system-level error management and simplifies read/write data integrity.
• Fast Ready and Program/Erase: Short power-up ready time and sub-millisecond program/erase characteristics accelerate boot and update operations.
• Industrial Robustness: −40°C to 85°C rating and 100K program/erase endurance support long-term deployment in industrial environments.
• Compact Package: 8-contact WSON surface-mount package enables dense PCB integration while retaining a full SPI feature set.

Why Choose F50D1G41LB-IP(2M)?

The F50D1G41LB-IP(2M) positions itself as a practical, high-density SPI‑NAND option for designs that need substantial non-volatile storage with minimal pin usage and reliable data integrity. With internal ECC, defined boot-read support, industry-standard SPI operation, and industrial temperature capability, it is well suited for embedded systems, industrial controllers, and compact devices that require durable firmware and data storage.

Choosing this device provides a balance of density, manageability and board-level integration, delivering long-term retention and endurance characteristics that support lifecycle needs in production and fielded systems.

Request a quote or submit an inquiry to obtain pricing, lead-time and ordering details for the F50D1G41LB-IP(2M) to evaluate it for your next design.