F50D2G41KB (2P)
| Part Description |
Ind. -40~85°C, SPI NAND, 1.8V |
|---|---|
| Quantity | 1,541 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 8-contact WSON | Memory Format | NAND Flash | Technology | SPI NAND Flash | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 8 ns | Grade | Industrial | ||
| Clock Frequency | 104 MHz | Voltage | 2.5V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 600 µs | Packaging | 8-contact WSON | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F50D2G41KB (2P) – Ind. -40~85°C, SPI NAND, 1.8V
The F50D2G41KB (2P) is an industrial-grade SPI NAND Flash memory device from ESMT. It provides 2.147 Gbit of non-volatile NAND storage organized as 256M × 8, designed for embedded systems that require robust data retention across a wide temperature range.
Key technical attributes include a 104 MHz clock capability, an 8 ns access time specification, and a write-cycle time of 600 µs per word page. The device is supplied in an 8-contact WSON surface-mount package and is RoHS compliant.
Key Features
- Memory Capacity: 2.147 Gbit total storage, organized as 256M × 8 for straightforward addressing and block management.
- Technology: SPI NAND Flash non-volatile memory technology suitable for persistent data and code storage.
- Performance: 104 MHz clock frequency and 8 ns access time enable responsive read operations for embedded applications.
- Write Characteristics: Write cycle time per word page of 600 µs for predictable program timing in firmware and data update flows.
- Voltage Supply: 2.5 V supply specification for integration with systems that support this operating voltage.
- Industrial Temperature Range: Rated for operation from −40 °C to 85 °C to meet industrial environmental demands.
- Package & Mounting: 8-contact WSON surface-mount package for compact board-level integration.
- Compliance: RoHS-compliant construction.
Typical Applications
- Industrial Embedded Storage: Non-volatile 2.147 Gbit capacity with −40 °C to 85 °C operating range makes it suitable for industrial controllers and factory automation devices needing reliable local storage.
- Firmware and Code Storage: SPI NAND Flash technology supports storing boot code, firmware images, and update packages for embedded systems.
- Edge and IoT Devices: Compact WSON package and surface-mount mounting simplify integration into space-constrained edge modules and IoT endpoints.
Unique Advantages
- Industrial Temperature Support: Operation from −40 °C to 85 °C enables deployment in challenging thermal environments.
- Moderate Capacity in Compact Package: 2.147 Gbit organized as 256M × 8 in an 8-contact WSON offers substantial storage while minimizing PCB footprint.
- Predictable Performance Metrics: 104 MHz clock and 8 ns access time provide clear performance parameters for system timing and boot sequencing.
- Deterministic Write Timing: 600 µs write-cycle time per word page supports planning for firmware updates and in-field programming.
- RoHS Compliance: Environmentally compliant manufacturing supports regulatory and supply-chain requirements.
Why Choose F50D2G41KB (2P)?
The F50D2G41KB (2P) balances substantial non-volatile capacity with industrial-grade environmental tolerance and defined performance characteristics. It is positioned for embedded designs that need reliable SPI NAND Flash storage, compact board-level integration, and clear electrical and timing parameters for system design.
Choose this ESMT SPI NAND device for industrial applications, firmware storage, and space-constrained modules where a 2.147 Gbit NAND solution with predictable access and write timing is required.
Request a quote or submit an inquiry to check availability and pricing for the F50D2G41KB (2P) and to receive detailed ordering information tailored to your project needs.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
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