F50D4G41XB-IP(2XE)

The ESMT F50D4G41XB-IP(2XE) is a 1.8V SPI NAND Flash memory device delivering 4.295 Gbit of single-level cell (SLC) non-volatile storage in a low pin-count serial interface. Designed for systems that require compact board routing and reliable firmware/boot storage, it combines SPI compatibility with NAND economics and on-die ECC options for robust data integrity.

Its architecture supports continuous block read modes, dual/quad I/O options and a standard SPI command set, making it suitable for embedded, industrial and other applications where compact footprint, endurance and read performance matter.

Key Features

• Memory Capacity and Organization — 4.295 Gbit total capacity organized as 4G × 8, with a page size of 4,352 bytes (4,096 bytes data + 256 bytes spare) and 64 pages per block.
• SPI‑NAND SLC Technology — Single-level cell NAND Flash with SPI‑compatible serial bus interface to minimize pin count while providing NAND cost/bit advantages.
• High-Speed Serial Interface — Supports standard and extended SPI command protocols with an array clock frequency up to 83 MHz and multi‑I/O read modes (x2, x4, Dual, Quad, Random) for improved throughput.
• On‑Die ECC and Data Integrity — User‑selectable internal ECC (8 bits/sector) with on‑die ECC option to improve raw NAND reliability during reads and programs.
• Performance Characteristics — Array performance includes page read up to 30 µs (max) with on‑die ECC disabled and page program typical times of 200 µs (TYP) without on‑die ECC; block erase typical 2 ms.
• Endurance and Retention — Endurance rated at 100,000 program/erase cycles and data retention compliant with JESD47H; uncycled retention of 10 years at 70 °C as specified.
• Security and Protection — Supports software write protection (lock register), hardware write protection for BP bits, lock tight feature and permanent block lock protection; includes a 10‑page OTP area.
• Package and Temperature Range — Available in an 8‑contact LGA surface‑mount package (8 × 6 mm footprint option) and specified for industrial operation from −40 °C to 85 °C.

Typical Applications

• Embedded and IoT Devices — Low pin-count SPI interface and compact package simplify board design for firmware and boot storage in space-constrained embedded systems.
• Industrial Control and Instrumentation — Industrial temperature range (−40 °C to 85 °C) and SLC endurance make it suitable for firmware and data logging in industrial equipment.
• Consumer and Networking Equipment — Dual/quad read modes and 83 MHz clock capability support fast boot and read‑intensive operations for consumer electronics and network appliances.
• Secure Memory and Configuration Storage — OTP area, unique ID read capability, and lock features enable secure storage of device configuration and immutable data.

Unique Advantages

• Low Pin‑Count SPI Interface: Reduces PCB routing and BOM complexity while maintaining a standard SPI pinout that scales across densities.
• Selectable On‑Die ECC: Improves usable data reliability without requiring host-side ECC implementation, simplifying system integration.
• SLC Endurance: 100,000 program/erase cycles provide longevity for frequent update scenarios such as firmware flashes and log storage.
• Flexible Read Performance: Multi‑I/O read modes (Dual/Quad) and continuous in‑block read support deliver configurable throughput for boot and runtime reads.
• Industrial Temperature Range: −40 °C to 85 °C rating supports deployment in harsher environments where extended temperature operation is required.
• Built‑in Security and Protection: Hardware/software write protection, lock tight and permanent block lock features protect critical data and reduce risk of accidental modification.

Why Choose F50D4G41XB-IP(2XE)?

The F50D4G41XB-IP(2XE) positions itself as a practical SPI‑NAND solution for designers who need the cost and density advantages of NAND with the simplicity of a low pin‑count serial interface. With SLC technology, user‑selectable on‑die ECC, multi‑I/O read modes and industry‑rated temperature operation, it suits designs that require durable firmware storage, fast boot capability and flexible performance scaling.

Its combination of 4.295 Gbit density, proven endurance and protection features offers long-term value for embedded, industrial and networking applications that demand reliable non‑volatile storage with minimal board‑level impact.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the F50D4G41XB-IP(2XE).