F50L1G41LB-IP(2M)

The F50L1G41LB-IP(2M) is a 1.074 Gbit SPI NAND Flash memory device from ESMT, organized as 1G × 8 and designed for compact, low-pin-count non-volatile storage. It implements SPI-NAND architecture with internal error correction and NAND-specific command support to deliver cost-effective, high-density storage for embedded and industrial applications.

This device is optimized for systems where pin count and board area are constrained, offering fast serial access, internal ECC, and industrial-grade temperature operation for reliable field use.

Key Features

• Memory Density & Organization — 1.074 Gbit capacity organized as 1G × 8 with page size (2K + 64) bytes and block erase unit (128K + 4K) bytes for efficient data management.
• SPI-NAND Interface — Standard SPI-NAND command set supporting SPI-Mode 0 and Mode 3 for serial communication with minimized pin count.
• Clock & Transfer Performance — 104 MHz clock frequency with a loading throughput of 104 MT/s and transfer characteristics suitable for fast serial reads.
• Internal ECC — 1-bit internal ECC (1-bit/512 bytes) that automatically generates and verifies ECC during program and read operations to improve data reliability.
• Program & Erase Timings — Typical program time ~400 µs and block erase time ~4 ms; fast write-cycle behavior with page program size (2K + 64) bytes and measured write-cycle times.
• Endurance & Retention — Endurance rated to 100K program/erase cycles and data retention specified at 10 years.
• System Reliability Features — Hardware data protection, bad-block protection, OTP operation, boot read support, and program/erase lockout during power transitions.
• Power & Operating Range — 3.3V nominal supply (operating 2.7V–3.6V) with power-up ready and reset busy times specified for system integration.
• Package & Temperature — 8-contact WSON surface-mount package (8 × 6 mm) and industrial temperature grade operation from −40°C to 85°C.
• Compliance — RoHS compliant.

Typical Applications

• Embedded systems — Compact SPI NAND storage for systems that require reduced pin count and small PCB footprint.
• Boot and firmware storage — Boot read support and OTP operation make the device suitable for storing boot code and protected firmware.
• Industrial equipment — Industrial temperature grade and robust endurance/retention characteristics support field-deployed embedded controllers and instrumentation.

Unique Advantages

• High-density serial storage: 1.074 Gbit capacity in a small 8-contact WSON package reduces board area while providing large non-volatile storage.
• Integrated ECC for data integrity: Built-in 1-bit ECC per 512 bytes corrects common bit errors automatically, reducing host-side error management complexity.
• Fast serial performance: 104 MHz clock and 104 MT/s throughput deliver responsive read/write behavior for serial flash applications.
• Design-ready reliability: 100K program/erase cycles and 10-year data retention provide long-term stability for deployed products.
• System-level protections: Hardware data protection, bad-block protection, and power-transition lockouts support safer program/erase operations in real-world systems.
• Industrial temperature range: −40°C to 85°C operation supports a wide range of environmental conditions common in industrial deployments.

Why Choose F50L1G41LB-IP(2M)?

The F50L1G41LB-IP(2M) positions itself as a practical, high-density SPI-NAND memory option for designers who need large non-volatile storage with a minimal pin count. With internal ECC, defined program/erase timing, strong endurance, and industrial temperature operation, it balances performance, integration, and reliability for embedded and industrial applications.

This part is well suited for designs that require compact packaging, robust data integrity measures, and long-term retention. Its feature set—including boot read, OTP, and bad-block management—helps simplify system firmware strategies and reduce host-side overhead.

Request a quote or submit a sales inquiry to check availability and pricing for F50L1G41LB-IP(2M) and to discuss volume options or integration questions.