F50L2G41KA2V

The F50L2G41KA(2V) from ESMT is a 2 Gbit SPI‑NAND flash memory device designed for industrial operation (‑40°C to +85°C). It implements a serial peripheral interface (SPI) for compact, low‑pin‑count designs and is based on parallel NAND architecture adapted for SPI operation.

With a 3.3V supply range and 104 MHz transfer capability, the device targets embedded and industrial systems that require dense, non‑volatile storage with on‑die ECC and fast program/erase cycles.

Key Features

• Density & Organization – 2.147 Gbit (2 Gbit / 2 × 1 Gbit organization); memory organized as 256M × 8 with page size of 2,176 bytes (2K + 128) and block size of 64 pages.
• Interface & Performance – SPI serial interface supporting x1/x2/x4 widths and SPI Mode 0 and Mode 3; data transfer rate up to 104 MHz (104 MT/s) with a typical program time of 400 µs and typical block erase time of 4 ms.
• On‑Die ECC – User‑selectable internal ECC with 8‑bit correction per 512 bytes; ECC is generated on program and checked/corrected on read, with ECC status reporting.
• Read/Write Timing – Page read time (cell to register, with internal ECC) up to 130 µs (maximum); access/transfer timing compatible with high‑speed SPI operation.
• Reliability & Endurance – Endurance rated to 60K program/erase cycles and data retention specified for 10 years.
• Power & Low‑Power Modes – Single power supply operation from 2.7V to 3.6V (nominal VCC 3.3V) and deep power‑down support; power‑up ready time and max reset busy time up to 1.5 ms.
• Security & Protection – Hardware data protection features including block protection and program/erase lockout during power transitions; first block guaranteed valid at shipment with ECC enabled.
• Package & Industrial Temperature – Available in an 8‑contact WSON package (8 × 6 mm) and specified for industrial operation from −40°C to +85°C.

Typical Applications

• Industrial Control Systems – Non‑volatile code and data storage for controllers and instrumentation operating across an industrial temperature range.
• Embedded Devices – Compact SPI‑based storage for embedded firmware, boot code and data logging where low pin count and high density are required.
• Connected Equipment – Local program and configuration storage in networking and communications modules that need reliable program/erase endurance and on‑die ECC.

Unique Advantages

• High Density in a Small Package: 2 Gbit capacity in an 8‑contact WSON (8 × 6 mm) package delivers large storage without increasing PCB footprint.
• SPI Interface for Low Pin Count: SPI operation reduces system pin requirements while maintaining high transfer rates up to 104 MHz.
• Built‑in ECC: 8‑bit ECC per 512 bytes simplifies system error management by providing hardware correction and ECC status reporting.
• Industrial Temperature Range: Specified operation from −40°C to +85°C supports deployment in harsh and variable environments.
• Fast Program/Erase Cycle Performance: Typical program time of 400 µs and block erase around 4 ms enable efficient firmware updates and data management.
• Designed for Reliability: 60K program/erase cycle endurance and 10‑year data retention support long life in fielded products.

Why Choose F50L2G41KA(2V)?

The F50L2G41KA(2V) positions itself as a practical SPI‑NAND solution for industrial and embedded designs that require high density, on‑die ECC and reliable program/erase performance in a compact package. Its combination of 2 Gbit capacity, SPI interface, and industrial temperature rating makes it suitable for applications where board space and pin count are constrained but robust non‑volatile storage is essential.

Designers seeking a storage device with explicit ECC support, predictable program/erase timings, and long data retention will find the F50L2G41KA(2V) appropriate for firmware storage, boot media, and data logging in industrial and embedded systems.

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