F50L2G41XA-IP(2BE)

The F50L2G41XA-IP(2BE) is a 2 Gbit single-level cell (SLC) SPI‑NAND Flash memory device designed for low-pin-count, non-volatile storage. It provides a high-density, cost-effective storage option with a standard SPI-compatible serial bus and user-selectable on-die ECC to simplify data integrity management.

Targeted at industrial applications, the device combines high endurance and long data retention with a compact 8-contact LGA surface-mount package for space-constrained embedded systems that require reliable firmware and data storage.

Key Features

• Memory Density & Organization — 2.147 Gbit device organized as 2G × 8 with 2176-byte pages (2048 bytes data + 128 bytes spare) and 64-page blocks.
• SLC Technology & Endurance — Single-level cell (SLC) architecture with specified endurance of 100,000 program/erase cycles.
• On‑Die ECC — User-selectable internal ECC (8 bits/sector) to improve raw NAND reliability and reduce host ECC requirements.
• Performance — Up to 104 MHz clock frequency with typical page program time around 200 µs and block erase time around 2 ms; page read times specified with ECC disabled/enabled (25 µs / 70 µs maximum respectively).
• SPI‑NAND Interface — Standard and extended SPI-compatible serial bus; supports instruction/address/data modes using 1, 2 or 4 I/O lines for flexible throughput configurations.
• Security & Protection — Software and hardware write protection features, lock-tight option, permanent block lock protection, and a 10‑page OTP area for one-time programmable data.
• Package & Mounting — 8-contact LGA surface-mount package (8 × 6 mm), suitable for compact PCB layouts.
• Industrial Temperature Grade — Rated operating temperature range of −40°C to +85°C for industrial use cases.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Reliable program and data storage for controllers and instrumentation that require wide temperature operation and long endurance.
• Embedded Storage & Firmware — Compact non-volatile storage for firmware images, configuration data, and boot code in low-pin-count systems.
• Secure Data Storage — Use of OTP area and block-lock features for storing device IDs, calibration data, or security-critical information.
• Space-Constrained Designs — Small 8-contact LGA package for applications where PCB area and pin count are limited.

Unique Advantages

• High-density SLC in a low-pin-count interface: 2 Gbit capacity delivered over a standard SPI interface reduces BOM complexity while providing large non-volatile storage.
• Selectable on-die ECC: Built-in ECC (8 bits/sector) eases host processing and increases usable reliability without external controllers.
• Industrial temperature capability: −40°C to +85°C rating supports deployments in harsher environments and extended temperature ranges.
• Fast SPI performance: 104 MHz clock capability and dedicated read/program/erase timings support responsive firmware updates and data access.
• Robust data integrity features: Endurance of 100,000 program/erase cycles and 10‑year uncycled data retention at 85°C help ensure long-term reliability.
• Compact surface-mount package: 8-contact LGA makes the device straightforward to place in space-constrained assemblies.

Why Choose F50L2G41XA-IP(2BE)?

The F50L2G41XA-IP(2BE) combines high-density SLC NAND, configurable on-die ECC, and an industry-standard SPI interface to deliver a practical, low-pin-count storage solution for industrial and embedded designs. With defined timing characteristics, block and page organization, and security features like OTP and block locking, it suits applications that demand durable data retention and predictable endurance.

This device is appropriate for engineers and procurement teams designing compact systems that require scalable non-volatile capacity, simplified host integration through internal ECC, and industrial temperature support for long-term deployments.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the F50L2G41XA-IP(2BE).