F59D1G161LB-45TG2M

1Gb NAND Flash
Part Description

SLC NAND Flash, 1.074 Gbit (64M × 16), 1.8V, 45 ns, 48-pin TSOPI

Quantity 550 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeCommercial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page350 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization64M x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G161LB-45TG2M – SLC NAND Flash, 1.074 Gbit (64M × 16), 1.8V, 45 ns, 48-pin TSOPI

The F59D1G161LB-45TG2M is a 1.074 Gbit single-level cell (SLC) NAND flash memory organized as 64M × 16 with a parallel x16 interface and a 1.8 V supply range (1.7 V–1.95 V). It is supplied in a 48-pin TSOPI surface-mount package and is offered in a 45 ns speed grade.

Designed for solid-state storage and embedded code/boot applications, this commercial-grade device combines SLC endurance and retention characteristics with features that support high-throughput programming and read operations, in a compact surface-mount footprint.

Key Features

  • Memory & Organization 1.074 Gbit total capacity organized as 64M × 16; SLC (1 bit per cell) NAND architecture.
  • Performance 45 ns speed grade (ordering information) with parallel x16 interface for direct 16-bit data bus integration. Write cycle (word/page) specified at 350 µs.
  • Power Operates from a 1.8 V nominal supply with an allowed range of 1.7 V to 1.95 V.
  • Endurance & Retention Endurance rated at 60K program/erase cycles and data retention specified at 10 years.
  • Reliability & ECC ECC requirement for x16 organization: 1 bit per 256 words; includes hardware data protection and bad-block-protect mechanisms.
  • Page & Block Architecture x16 page program size: (1K + 32) words; block erase granularity: (64K + 2K) words. Supports cache program/read and copy-back operations to improve throughput.
  • Package & Mounting 48-pin TSOPI surface-mount package (TSOPI-48) for compact board-level integration.
  • Operating Range Commercial temperature grade: 0 °C to 70 °C.
  • Additional Functional Features Automatic program and erase, automatic page 0 read at power-up option, OTP operation, command/address/data multiplexed I/O port, and program/erase lockout during power transitions.

Typical Applications

  • Embedded boot and firmware storage — Use the device for system boot code and firmware images where SLC endurance and retention are required.
  • Solid-state mass storage — Suitable for compact storage arrays and devices requiring block-erasable, non-volatile memory with high program/erase endurance.
  • Industrial and commercial controllers — Store configuration, logs, or application data in commercial-temperature embedded control systems.
  • Streaming read/write applications — Cache read and cache program features support improved throughput for sequential page operations.

Unique Advantages

  • SLC endurance and retention: 60K program/erase cycles and 10-year data retention offer long service life for fielded products.
  • Compact surface-mount package: TSOPI-48 package enables low-profile board-level integration while preserving a parallel x16 interface.
  • Flexible power envelope: 1.7 V–1.95 V supply range supports systems using 1.8 V rails with predictable operation.
  • Throughput-enhancing features: Cache program/read and copy-back operations reduce programming overhead and improve sustained data transfer rates.
  • Robust data management: Built-in bad-block protection, OTP operation, and program/erase lockout during power transitions reduce data integrity risks.
  • Clear ECC guideline: x16 ECC requirement (1 bit per 256 words) provides a defined error-management target for system designers.

Why Choose F59D1G161LB-45TG2M?

The F59D1G161LB-45TG2M positions itself as a reliable SLC NAND option for designers needing a 1.8 V, x16 parallel flash memory with strong endurance and data retention characteristics. Its combination of cache and copy-back features, block-erasable architecture, and hardware data protection make it well suited for embedded boot, firmware storage, and solid-state storage applications in commercial temperature environments.

With a compact TSOPI-48 surface-mount package and explicit operational parameters (voltage range, temperature grade, write cycle time, and ECC requirements), this device supports predictable integration into board-level designs where long-term data integrity and sustained program/erase cycling are priorities.

Request a quote or submit an inquiry for the F59D1G161LB-45TG2M to check availability, lead times, and pricing for your design needs.

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