F59D1G161LB-45TG2M
| Part Description |
SLC NAND Flash, 1.074 Gbit (64M × 16), 1.8V, 45 ns, 48-pin TSOPI |
|---|---|
| Quantity | 550 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | TSOPI-48 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 30 ns | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 1.7V ~ 1.95V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 350 µs | Packaging | 48-TSOPI | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 64M x 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59D1G161LB-45TG2M – SLC NAND Flash, 1.074 Gbit (64M × 16), 1.8V, 45 ns, 48-pin TSOPI
The F59D1G161LB-45TG2M is a 1.074 Gbit single-level cell (SLC) NAND flash memory organized as 64M × 16 with a parallel x16 interface and a 1.8 V supply range (1.7 V–1.95 V). It is supplied in a 48-pin TSOPI surface-mount package and is offered in a 45 ns speed grade.
Designed for solid-state storage and embedded code/boot applications, this commercial-grade device combines SLC endurance and retention characteristics with features that support high-throughput programming and read operations, in a compact surface-mount footprint.
Key Features
- Memory & Organization 1.074 Gbit total capacity organized as 64M × 16; SLC (1 bit per cell) NAND architecture.
- Performance 45 ns speed grade (ordering information) with parallel x16 interface for direct 16-bit data bus integration. Write cycle (word/page) specified at 350 µs.
- Power Operates from a 1.8 V nominal supply with an allowed range of 1.7 V to 1.95 V.
- Endurance & Retention Endurance rated at 60K program/erase cycles and data retention specified at 10 years.
- Reliability & ECC ECC requirement for x16 organization: 1 bit per 256 words; includes hardware data protection and bad-block-protect mechanisms.
- Page & Block Architecture x16 page program size: (1K + 32) words; block erase granularity: (64K + 2K) words. Supports cache program/read and copy-back operations to improve throughput.
- Package & Mounting 48-pin TSOPI surface-mount package (TSOPI-48) for compact board-level integration.
- Operating Range Commercial temperature grade: 0 °C to 70 °C.
- Additional Functional Features Automatic program and erase, automatic page 0 read at power-up option, OTP operation, command/address/data multiplexed I/O port, and program/erase lockout during power transitions.
Typical Applications
- Embedded boot and firmware storage — Use the device for system boot code and firmware images where SLC endurance and retention are required.
- Solid-state mass storage — Suitable for compact storage arrays and devices requiring block-erasable, non-volatile memory with high program/erase endurance.
- Industrial and commercial controllers — Store configuration, logs, or application data in commercial-temperature embedded control systems.
- Streaming read/write applications — Cache read and cache program features support improved throughput for sequential page operations.
Unique Advantages
- SLC endurance and retention: 60K program/erase cycles and 10-year data retention offer long service life for fielded products.
- Compact surface-mount package: TSOPI-48 package enables low-profile board-level integration while preserving a parallel x16 interface.
- Flexible power envelope: 1.7 V–1.95 V supply range supports systems using 1.8 V rails with predictable operation.
- Throughput-enhancing features: Cache program/read and copy-back operations reduce programming overhead and improve sustained data transfer rates.
- Robust data management: Built-in bad-block protection, OTP operation, and program/erase lockout during power transitions reduce data integrity risks.
- Clear ECC guideline: x16 ECC requirement (1 bit per 256 words) provides a defined error-management target for system designers.
Why Choose F59D1G161LB-45TG2M?
The F59D1G161LB-45TG2M positions itself as a reliable SLC NAND option for designers needing a 1.8 V, x16 parallel flash memory with strong endurance and data retention characteristics. Its combination of cache and copy-back features, block-erasable architecture, and hardware data protection make it well suited for embedded boot, firmware storage, and solid-state storage applications in commercial temperature environments.
With a compact TSOPI-48 surface-mount package and explicit operational parameters (voltage range, temperature grade, write cycle time, and ECC requirements), this device supports predictable integration into board-level designs where long-term data integrity and sustained program/erase cycling are priorities.
Request a quote or submit an inquiry for the F59D1G161LB-45TG2M to check availability, lead times, and pricing for your design needs.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A