F59D1G161LB-IP(2M)

1Gb NAND Flash Ind.
Part Description

SLC NAND Flash, x16, 1.8V, ECC:1bit/256Word

Quantity 1,434 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48 pin TSOPI/ 63 Ball BGAMemory FormatNAND FlashTechnologySLC NAND Flash
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48 pin TSOPI/ 63 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G161LB-IP(2M) – SLC NAND Flash, x16, 1.8V, ECC:1bit/256Word

The F59D1G161LB-IP(2M) is a 1.074 Gbit single-level cell (SLC) NAND Flash memory organized as 1G × 16. Designed for industrial-grade, non-volatile storage, it implements a parallel NAND interface with ECC requirements targeted at robust data integrity.

Typical use cases include embedded mass storage and boot/firmware storage in industrial systems where endurance, controlled program/erase cycles and broad operating temperature range are required. The device emphasizes reliable SLC endurance and system-level features that support efficient block management and high-throughput page operations.

Key Features

  • Memory Core 1.074 Gbit SLC NAND organization (1G × 16) providing single-bit-per-cell storage for higher endurance and data retention.
  • Performance 30 ns access time and page/read/program operations optimized for parallel access; program cycle (word/page) specified at 350 µs.
  • Page & Block Architecture x16 page size: (1K + 32) words; block erase unit: (64K + 2K) words. Supports cache program/read and copy-back for efficient data transfers.
  • Data Integrity ECC requirement for x16 organization: 1 bit per 256 words. Endurance rated at 60K program/erase cycles and typical data retention of 10 years.
  • Power 1.8 V supply (operating range 1.7 V to 1.95 V as specified in the product series) suitable for low-voltage embedded systems.
  • Interface & Package Parallel NAND interface. Available in surface-mount packages: 48-pin TSOPI and 63-ball BGA.
  • System & Reliability Features Automatic program and erase, bad-block protection, program/erase lockout during power transitions, Automatic Page 0 read at power-up, One Time Program (OTP) support.
  • Industrial Grade & Qualification JEDEC-qualified device with industrial operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

  • Embedded Storage Firmware, boot code and file system storage in industrial controllers and networking equipment that require SLC endurance and reliable power-up behavior.
  • Industrial Automation Non-volatile storage for machine control and data logging where wide temperature range and program/erase endurance are important.
  • Consumer & Appliance Boot Memory Boot ROM and firmware storage in devices where automatic page 0 read at power-up and fast page read/program throughput accelerate system start-up and firmware updates.

Unique Advantages

  • High Endurance SLC Technology Single-level cell architecture and specified 60K program/erase cycles deliver long service life for write-intensive embedded applications.
  • Designed for Robust Data Integrity ECC specification of 1 bit/256 words for x16 organization plus bad-block management and OTP support reduce application-level error handling.
  • Efficient Page and Cache Operations Cache program/read and copy-back features enable higher throughput and optimized block-management without extra serial data cycles.
  • Industrial Temperature Range −40 °C to 85 °C rating supports deployments in challenging environmental conditions.
  • Flexible Packaging Available in 48-pin TSOPI and 63-ball BGA surface-mount packages to fit different PCB density and mechanical requirements.
  • Standards-Based Qualification JEDEC qualification and RoHS compliance simplify integration into regulated industrial products.

Why Choose F59D1G161LB-IP(2M)?

The F59D1G161LB-IP(2M) positions itself as a reliable, industrial-grade SLC NAND Flash memory option for embedded systems that require robust endurance, controlled program/erase behavior and comprehensive NAND features (cache program/read, copy-back, bad-block protect, OTP). Its parallel x16 organization and ECC requirement support stable data integrity while the package options and operating temperature range make it suitable for a range of industrial board designs.

This device is well suited for engineers and procurement teams designing industrial controllers, boot/firmware storage and embedded mass storage solutions that value endurance, predictable program/erase characteristics and JEDEC qualification for consistent supply-chain integration.

Request a quote or submit an inquiry to get pricing, availability and lead-time information for F59D1G161LB-IP(2M).

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