F59D1G161MB-45TIG2M

1Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 1Gbit (64M × 16), 1.8V, x16, 45ns, Industrial

Quantity 1,423 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization64M x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G161MB-45TIG2M – SLC NAND Flash, 1Gbit (64M × 16), 1.8V, x16, 45ns, Industrial

The F59D1G161MB-45TIG2M is a 1.074 Gbit single-level-cell (SLC) NAND flash organized as 64M × 16 with a parallel x16 interface and 1.8V supply operation (1.7 V ~ 1.95 V). Built for industrial use, this device offers block-erasable NAND storage with features that support boot-from-NAND, automatic memory download and high-throughput read/write modes.

Designed for embedded and industrial storage applications, the device provides reliable non-volatile memory with integrated program/erase management, ECC requirements, and endurance and retention characteristics suitable for long-term fielded products.

Key Features

  • Memory Core and Organization — SLC NAND Flash, 1.074 Gbit organized as 64M × 16; data register of (1K + 32) × 16‑bit supporting page program and read operations for x16 configurations.
  • Page and Block Structure — x16 page program size: (1K + 32) words; block erase size: (64K + 2K) words; supports automatic program and erase operations.
  • Performance — 45 ns cycle time per byte in page-mode read as specified for the -45T speed grade; cache read and cache program operations to improve throughput for consecutive page access and pipelined programming.
  • Power — 1.8V nominal supply with an operating range of 1.7 V to 1.95 V, enabling integration into 1.8V system domains.
  • Reliability and Data Integrity — ECC requirement for x16 devices of 4 bit/256 Word; endurance rated at 100K program/erase cycles and data retention specified at 10 years.
  • Robustness and Protection — Hardware data protection including program/erase lockout during power transitions, bad-block protection and optional automatic page 0 read at power-up.
  • Package and Mounting — Surface-mount 48-pin TSOPI package (TSOPI-48), suitable for compact PCB designs.
  • Operating Range and Qualification — Industrial-grade temperature range of -40 °C to +85 °C and JEDEC qualification; RoHS compliant.

Typical Applications

  • Embedded Industrial Storage — Non-volatile storage for industrial controllers and instrumentation that require SLC endurance and a wide operating temperature range.
  • Firmware and Boot Storage — Boot-from-NAND support and automatic page‑0 read options for reliable bootloader and firmware storage.
  • High-Throughput Data Streaming — Cache read and cache program features improve read/write throughput when streaming consecutive pages or writing large files.
  • Mass Storage for Fielded Products — Long data retention and high P/E cycle endurance for devices requiring durable, non-volatile storage in the field.

Unique Advantages

  • SLC Endurance and Retention — 100K program/erase cycles and 10-year data retention provide predictable lifetime characteristics for long-term deployments.
  • Industrial Temperature Grade — Rated for -40 °C to +85 °C, enabling use in harsh or temperature-variable environments.
  • System-Level Protection — Program/erase lockout during power transitions and bad-block protection help preserve data integrity in real-world power and usage conditions.
  • Throughput Enhancements — Cache read and cache program operations plus copy-back support reduce programming overhead and accelerate consecutive-page access patterns.
  • Compact, Surface-Mount Package — TSOPI-48 package supports low-profile PCB implementations and automated assembly processes.
  • Clear ECC and Interface Requirements — Specified ECC requirement (4 bit/256 Word for x16) and parallel x16 interface simplify system design and validation.

Why Choose F59D1G161MB-45TIG2M?

The F59D1G161MB-45TIG2M delivers SLC NAND reliability and endurance in a compact TSOPI-48 surface-mount package with industrial temperature rating and JEDEC qualification. Its 1.074 Gbit capacity, x16 parallel interface and 1.8V supply range make it a pragmatic choice for embedded and industrial storage designs that require robust non-volatile memory with predictable program/erase lifetimes and long data retention.

This device is suited for engineers building firmware/boot storage, high-throughput streaming applications, and fielded products that demand resilience across temperature and power conditions. The included protection features and clearly defined ECC requirements aid integration, verification and long-term maintainability.

Request a quote or submit an inquiry to get pricing, lead-time and availability for the F59D1G161MB-45TIG2M for your next design.

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