F59D1G161MB-45TIG2M
| Part Description |
SLC NAND Flash, 1Gbit (64M × 16), 1.8V, x16, 45ns, Industrial |
|---|---|
| Quantity | 1,423 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | TSOPI-48 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 30 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.7V ~ 1.95V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 350 µs | Packaging | 48-TSOPI | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 64M x 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59D1G161MB-45TIG2M – SLC NAND Flash, 1Gbit (64M × 16), 1.8V, x16, 45ns, Industrial
The F59D1G161MB-45TIG2M is a 1.074 Gbit single-level-cell (SLC) NAND flash organized as 64M × 16 with a parallel x16 interface and 1.8V supply operation (1.7 V ~ 1.95 V). Built for industrial use, this device offers block-erasable NAND storage with features that support boot-from-NAND, automatic memory download and high-throughput read/write modes.
Designed for embedded and industrial storage applications, the device provides reliable non-volatile memory with integrated program/erase management, ECC requirements, and endurance and retention characteristics suitable for long-term fielded products.
Key Features
- Memory Core and Organization — SLC NAND Flash, 1.074 Gbit organized as 64M × 16; data register of (1K + 32) × 16‑bit supporting page program and read operations for x16 configurations.
- Page and Block Structure — x16 page program size: (1K + 32) words; block erase size: (64K + 2K) words; supports automatic program and erase operations.
- Performance — 45 ns cycle time per byte in page-mode read as specified for the -45T speed grade; cache read and cache program operations to improve throughput for consecutive page access and pipelined programming.
- Power — 1.8V nominal supply with an operating range of 1.7 V to 1.95 V, enabling integration into 1.8V system domains.
- Reliability and Data Integrity — ECC requirement for x16 devices of 4 bit/256 Word; endurance rated at 100K program/erase cycles and data retention specified at 10 years.
- Robustness and Protection — Hardware data protection including program/erase lockout during power transitions, bad-block protection and optional automatic page 0 read at power-up.
- Package and Mounting — Surface-mount 48-pin TSOPI package (TSOPI-48), suitable for compact PCB designs.
- Operating Range and Qualification — Industrial-grade temperature range of -40 °C to +85 °C and JEDEC qualification; RoHS compliant.
Typical Applications
- Embedded Industrial Storage — Non-volatile storage for industrial controllers and instrumentation that require SLC endurance and a wide operating temperature range.
- Firmware and Boot Storage — Boot-from-NAND support and automatic page‑0 read options for reliable bootloader and firmware storage.
- High-Throughput Data Streaming — Cache read and cache program features improve read/write throughput when streaming consecutive pages or writing large files.
- Mass Storage for Fielded Products — Long data retention and high P/E cycle endurance for devices requiring durable, non-volatile storage in the field.
Unique Advantages
- SLC Endurance and Retention — 100K program/erase cycles and 10-year data retention provide predictable lifetime characteristics for long-term deployments.
- Industrial Temperature Grade — Rated for -40 °C to +85 °C, enabling use in harsh or temperature-variable environments.
- System-Level Protection — Program/erase lockout during power transitions and bad-block protection help preserve data integrity in real-world power and usage conditions.
- Throughput Enhancements — Cache read and cache program operations plus copy-back support reduce programming overhead and accelerate consecutive-page access patterns.
- Compact, Surface-Mount Package — TSOPI-48 package supports low-profile PCB implementations and automated assembly processes.
- Clear ECC and Interface Requirements — Specified ECC requirement (4 bit/256 Word for x16) and parallel x16 interface simplify system design and validation.
Why Choose F59D1G161MB-45TIG2M?
The F59D1G161MB-45TIG2M delivers SLC NAND reliability and endurance in a compact TSOPI-48 surface-mount package with industrial temperature rating and JEDEC qualification. Its 1.074 Gbit capacity, x16 parallel interface and 1.8V supply range make it a pragmatic choice for embedded and industrial storage designs that require robust non-volatile memory with predictable program/erase lifetimes and long data retention.
This device is suited for engineers building firmware/boot storage, high-throughput streaming applications, and fielded products that demand resilience across temperature and power conditions. The included protection features and clearly defined ECC requirements aid integration, verification and long-term maintainability.
Request a quote or submit an inquiry to get pricing, lead-time and availability for the F59D1G161MB-45TIG2M for your next design.
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