F59D1G81LB-45BG2M

1Gb NAND Flash
Part Description

SLC NAND Flash, 1Gbit (128M x 8), 1.8V, x8, 45ns, 63-ball BGA

Quantity 409 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-63Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeCommercial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page350 µsPackaging63-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization128M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G81LB-45BG2M – SLC NAND Flash, 1Gbit (128M x 8), 1.8V, x8, 45ns, 63-ball BGA

The F59D1G81LB-45BG2M is a 1.074 Gbit single-level cell (SLC) NAND flash memory organized as 128M × 8 with an additional spare area. Designed for 1.8 V operation (1.7 V to 1.95 V), this parallel-interface device targets solid-state mass storage and embedded boot/firmware storage where write endurance and data retention are required.

With block-erasable architecture, hardware protection features and cache/copy-back functions, this 63-ball BGA packaged device supports high-throughput page program and read operations while providing system-level reliability features for embedded designs.

Key Features

  • Memory Core & Organization 1.074 Gbit capacity organized as 128M × 8 with spare (4M × 8). The page size is (2K + 64) bytes and blocks are (128K + 4K) bytes for x8 configuration.
  • Technology SLC NAND Flash memory (1 bit per cell) for non-volatile storage with specified endurance and retention parameters.
  • Performance Page program time typically 300 µs and write-cycle/word-page timing referenced as 350 µs. Data in page mode can be read at a 45 ns cycle time per byte; the part variant is offered with 45 ns cycle capability and the general access time is specified in product data.
  • Interface & I/O Parallel command/address/data multiplexed I/O port supporting cache program/read, copy-back and EDO mode to improve streaming and program throughput.
  • Power Single 1.8 V supply range: 1.7 V to 1.95 V, suitable for low-voltage embedded systems.
  • System Reliability Endurance of 60K program/erase cycles and data retention specified at 10 years. Hardware data protection, program/erase lockout during power transitions, bad-block protect and OTP operation available.
  • Error Management ECC requirement documented: for x8 configuration the requirement is 1 bit per 512 bytes.
  • Package & Mounting Surface-mount 63-ball BGA (BGA-63) packaging for compact board-level integration.
  • Operating Range Commercial grade operating temperature from 0 °C to 70 °C.

Typical Applications

  • Embedded Storage Non-volatile firmware and boot storage for embedded systems leveraging the device’s boot-from-NAND and automatic page-read-at-power-up features.
  • Solid-State Mass Storage Mass storage applications that benefit from block-erasable NAND architecture and robust program/erase cycles.
  • Streaming Read/Write Systems Systems requiring sequential page streaming where cache read and cache program features improve throughput for long-file transfers.

Unique Advantages

  • SLC Reliability: Single-level cell architecture provides predictable endurance and retention characteristics useful for long-lived data storage.
  • High Endurance and Retention: 60K program/erase cycles and 10-year data retention support maintenance intervals and lifecycle planning.
  • Low-Voltage Operation: 1.8 V (1.7 V–1.95 V) supply reduces system power domain complexity for low-voltage designs.
  • Throughput Enhancements: Cache program/read and copy-back operations enable pipelined programming and accelerated consecutive-page reads for better overall throughput.
  • System Protection Features: Hardware data protection and program/erase lockout during power transitions help preserve data integrity during power events.
  • Compact Board Integration: 63-ball BGA package minimizes PCB footprint while supporting surface-mount assembly.

Why Choose F59D1G81LB-45BG2M?

The F59D1G81LB-45BG2M combines SLC NAND robustness with features aimed at embedded and mass-storage applications: compact BGA packaging, low-voltage operation, and system-focused functions such as cache programming, copy-back, bad-block management and automatic read-at-power-up. Its documented endurance and retention figures make it a practical choice where data longevity and program/erase cycle life are design drivers.

This device is suited for engineers and procurement teams specifying non-volatile memory for embedded boot regions, solid-state storage and streaming data applications that require predictable behavior, hardware protection and compact, surface-mount packaging.

Request a quote or submit a product inquiry to obtain pricing, availability, and samples for the F59D1G81LB-45BG2M.

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