F59D1G81LB-IP(2M)

1Gb NAND Flash Ind.
Part Description

SLC NAND Flash, x8, 1.8V, ECC:1bit/512Byte

Quantity 1,520 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48 pin TSOPI/ 63 Ball BGA/ 67 Ball BGAMemory FormatNAND FlashTechnologySLC NAND Flash
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48 pin TSOPI/ 63 Ball BGA/ 67 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G81LB-IP(2M) – SLC NAND Flash, x8, 1.8V, ECC:1bit/512Byte

The F59D1G81LB-IP(2M) is a 1.074 Gbit single-level cell (SLC) NAND flash memory organized as 128M × 8 with an additional 4M × 8 spare area. Built for 1.8 V operation, this parallel-interface NAND device targets industrial and embedded solid-state storage applications that require robust data retention and program/erase endurance.

Designed with JEDEC qualification and industrial-grade operating range, the device combines SLC reliability with features such as on-chip ECC requirements, automatic program/erase operations, and cache/copy-back capabilities to support boot, storage and firmware download scenarios in constrained systems.

Key Features

  • Memory Organization — 1.074 Gbit total capacity presented as 128M × 8 with spare 4M × 8 area; data register sizes include (2K + 64) × 8 bytes for x8 configuration.
  • SLC NAND Technology — Single-bit-per-cell architecture with ECC requirement of 1bit/512Byte for x8 devices to support reliable data integrity.
  • Performance — Typical program time ~300 µs per page and typical block erase time ~4 ms (x8 block). Page read and serial access timing details are provided in the device datasheet.
  • Interface & Access — Parallel command/address/data multiplexed I/O port supporting page program, cache program/read, copy-back and EDO modes for efficient data transfer and streaming.
  • Power — 1.8 V supply operation (rated 1.7 V to 1.95 V per datasheet) for low-voltage system integration.
  • Reliability — Endurance rating of 60K program/erase cycles and data retention specified at 10 years; hardware protections include program/erase lockout during power transitions and bad-block protect.
  • System Features — Automatic read-at-power-up option, boot-from-NAND support, automatic memory download, and One Time Program (OTP) operation for system boot and secure data storage workflows.
  • Package & Mounting — Available in 48-pin TSOPI and 63-ball / 67-ball BGA options; surface-mount packages for compact system designs.
  • Operating Range & Qualification — Industrial grade with operating temperature −40°C to 85°C and JEDEC qualification.

Typical Applications

  • Industrial Embedded Storage — Non-volatile firmware and data storage in industrial controllers where wide temperature range and JEDEC qualification are required.
  • Boot and Firmware Memory — Boot-from-NAND support and automatic read-at-power-up enable reliable system boot and automatic memory download for embedded platforms.
  • Solid-State Mass Storage — SLC NAND architecture and data retention characteristics suitable for solid-state storage implementations requiring long-term data integrity.
  • Data Logging and Edge Devices — High endurance and robustness for repeated program/erase cycles in remote data logging and edge compute devices operating across industrial temperature ranges.

Unique Advantages

  • Industrial Temperature Support — Rated for −40°C to 85°C, enabling deployment in harsh and temperature-variable environments.
  • High Endurance and Retention — 60K program/erase cycles and 10-year data retention provide long-term reliability for firmware and critical data storage.
  • Low-Voltage Operation — 1.8 V supply range (1.7 V–1.95 V) supports integration into low-voltage system designs.
  • System-Friendly Features — Built-in cache program/read, copy-back, automatic read at power-up, and OTP support streamline boot and firmware management workflows.
  • Flexible Packaging — Multiple surface-mount package options (48-pin TSOPI, 63-ball and 67-ball BGA) for PCB layout flexibility and form-factor optimization.
  • Standards-Based Qualification — JEDEC-qualified memory simplifies validation and integration for industrial customers.

Why Choose F59D1G81LB-IP(2M)?

The F59D1G81LB-IP(2M) positions itself as a reliable SLC NAND solution for industrial and embedded storage needs, offering a combination of endurance, data retention and system-level features such as boot support and automatic memory download. Its 1.074 Gbit capacity and x8 organization, together with on-chip requirements for ECC and practical program/erase timings, make it suitable for designs that demand predictable long-term behavior and robust data integrity.

Engineers designing industrial controllers, embedded storage systems, or boot/firmware memory solutions will find this device appropriate for applications that require JEDEC qualification, wide operating temperature range, and multiple package options for compact or board-level optimized implementations.

Request a quote or submit an inquiry to get pricing, availability and technical support for F59D1G81LB-IP(2M) and to discuss packaging or qualification options for your design needs.

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