F59D1G81LB-IP(2M)
| Part Description |
SLC NAND Flash, x8, 1.8V, ECC:1bit/512Byte |
|---|---|
| Quantity | 1,520 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 48 pin TSOPI/ 63 Ball BGA/ 67 Ball BGA | Memory Format | NAND Flash | Technology | SLC NAND Flash | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 30 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 350 µs | Packaging | 48 pin TSOPI/ 63 Ball BGA/ 67 Ball BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 1G x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59D1G81LB-IP(2M) – SLC NAND Flash, x8, 1.8V, ECC:1bit/512Byte
The F59D1G81LB-IP(2M) is a 1.074 Gbit single-level cell (SLC) NAND flash memory organized as 128M × 8 with an additional 4M × 8 spare area. Built for 1.8 V operation, this parallel-interface NAND device targets industrial and embedded solid-state storage applications that require robust data retention and program/erase endurance.
Designed with JEDEC qualification and industrial-grade operating range, the device combines SLC reliability with features such as on-chip ECC requirements, automatic program/erase operations, and cache/copy-back capabilities to support boot, storage and firmware download scenarios in constrained systems.
Key Features
- Memory Organization — 1.074 Gbit total capacity presented as 128M × 8 with spare 4M × 8 area; data register sizes include (2K + 64) × 8 bytes for x8 configuration.
- SLC NAND Technology — Single-bit-per-cell architecture with ECC requirement of 1bit/512Byte for x8 devices to support reliable data integrity.
- Performance — Typical program time ~300 µs per page and typical block erase time ~4 ms (x8 block). Page read and serial access timing details are provided in the device datasheet.
- Interface & Access — Parallel command/address/data multiplexed I/O port supporting page program, cache program/read, copy-back and EDO modes for efficient data transfer and streaming.
- Power — 1.8 V supply operation (rated 1.7 V to 1.95 V per datasheet) for low-voltage system integration.
- Reliability — Endurance rating of 60K program/erase cycles and data retention specified at 10 years; hardware protections include program/erase lockout during power transitions and bad-block protect.
- System Features — Automatic read-at-power-up option, boot-from-NAND support, automatic memory download, and One Time Program (OTP) operation for system boot and secure data storage workflows.
- Package & Mounting — Available in 48-pin TSOPI and 63-ball / 67-ball BGA options; surface-mount packages for compact system designs.
- Operating Range & Qualification — Industrial grade with operating temperature −40°C to 85°C and JEDEC qualification.
Typical Applications
- Industrial Embedded Storage — Non-volatile firmware and data storage in industrial controllers where wide temperature range and JEDEC qualification are required.
- Boot and Firmware Memory — Boot-from-NAND support and automatic read-at-power-up enable reliable system boot and automatic memory download for embedded platforms.
- Solid-State Mass Storage — SLC NAND architecture and data retention characteristics suitable for solid-state storage implementations requiring long-term data integrity.
- Data Logging and Edge Devices — High endurance and robustness for repeated program/erase cycles in remote data logging and edge compute devices operating across industrial temperature ranges.
Unique Advantages
- Industrial Temperature Support — Rated for −40°C to 85°C, enabling deployment in harsh and temperature-variable environments.
- High Endurance and Retention — 60K program/erase cycles and 10-year data retention provide long-term reliability for firmware and critical data storage.
- Low-Voltage Operation — 1.8 V supply range (1.7 V–1.95 V) supports integration into low-voltage system designs.
- System-Friendly Features — Built-in cache program/read, copy-back, automatic read at power-up, and OTP support streamline boot and firmware management workflows.
- Flexible Packaging — Multiple surface-mount package options (48-pin TSOPI, 63-ball and 67-ball BGA) for PCB layout flexibility and form-factor optimization.
- Standards-Based Qualification — JEDEC-qualified memory simplifies validation and integration for industrial customers.
Why Choose F59D1G81LB-IP(2M)?
The F59D1G81LB-IP(2M) positions itself as a reliable SLC NAND solution for industrial and embedded storage needs, offering a combination of endurance, data retention and system-level features such as boot support and automatic memory download. Its 1.074 Gbit capacity and x8 organization, together with on-chip requirements for ECC and practical program/erase timings, make it suitable for designs that demand predictable long-term behavior and robust data integrity.
Engineers designing industrial controllers, embedded storage systems, or boot/firmware memory solutions will find this device appropriate for applications that require JEDEC qualification, wide operating temperature range, and multiple package options for compact or board-level optimized implementations.
Request a quote or submit an inquiry to get pricing, availability and technical support for F59D1G81LB-IP(2M) and to discuss packaging or qualification options for your design needs.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
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