F59D1G81MB-45BG2M

1Gb NAND Flash
Part Description

SLC NAND Flash, 1Gbit (128M x 8), 1.8V, x8, 45ns, 63-ball BGA

Quantity 573 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-63Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeCommercial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page350 µsPackaging63-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization128M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G81MB-45BG2M – SLC NAND Flash, 1Gbit (128M x 8), 1.8V, x8, 45ns, 63-ball BGA

The F59D1G81MB-45BG2M is a single-level-cell (SLC) NAND Flash memory device with a 1.074 Gbit capacity organized as 128M × 8. Built for parallel NAND architectures and offered in a 63-ball BGA package, it targets solid-state mass storage and embedded boot/firmware applications that require robust program/erase endurance and non-volatile data retention.

Key value points include a low-voltage 1.8V supply range, fast read/serial cycle capability, hardware data protection features, and SLC endurance characteristics suitable for designs requiring long-term data retention and repeated program/erase cycles.

Key Features

  • Memory 1.074 Gbit capacity organized as 128M × 8 with spare area; page size (x8) is (2K + 64) bytes and block erase unit is (128K + 4K) bytes.
  • Technology & Endurance SLC NAND cell technology with specified endurance of 100K program/erase cycles and data retention of 10 years.
  • Performance Ordering speed grade at 45 ns cycle time with product access time listed as 30 ns; random page read up to 25 µs (max reported in series datasheet).
  • Program/Erase Timing Typical page program time and block erase times are provided in the datasheet; write-cycle-time for a word/page is specified as 350 µs in the product specifications.
  • Interface & Features Parallel command/address/data multiplexed I/O port with support for cache program/read, copy-back operation, automatic program and erase, and command register operation; OTP and bad-block protection supported.
  • Power Low-voltage operation: VCC = 1.8V (specified range 1.7 V to 1.95 V).
  • Package & Mounting Surface-mount BGA package (63-ball BGA, BGA-63) suitable for compact PCB layouts.
  • Operating Range Commercial temperature grade: 0 °C to 70 °C.
  • Reliability & Protection Hardware data protection features including program/erase lockout during power transitions and ECC requirements documented (x8: 4 bit/512 Byte).
  • Standby & Boot Support Series-level features include automatic page-0 read at power-up, boot-from-NAND support and automatic memory download options (as described in the series datasheet).

Typical Applications

  • Solid-State Mass Storage — Designed for use in storage applications that leverage SLC endurance and spare-area block management for reliable data retention and long life.
  • Boot and Firmware Storage — Supports boot-from-NAND and automatic page-0 read at power-up, making it suitable for system firmware and boot code storage.
  • Embedded Systems — Compact BGA packaging and a 1.8V supply make it suitable for embedded devices requiring onboard non-volatile memory with robust program/erase cycles.
  • Data Logging and Industrial Devices — SLC endurance and 10-year data retention support periodic write/erase cycles and long-term storage in commercial-grade deployments.

Unique Advantages

  • SLC Reliability: Single-level-cell architecture with specified 100K program/erase cycles and 10-year data retention supports demanding write/erase lifecycles.
  • Low-Voltage Operation: 1.7 V to 1.95 V supply range enables designs targeting 1.8V power rails and reduced power profiles.
  • Compact BGA Footprint: 63-ball BGA (BGA-63) package minimizes PCB area while supporting surface-mount assembly.
  • Performance-Oriented Features: Cache program/read and copy-back operations improve throughput for consecutive page programming and streaming read scenarios.
  • System-Level Boot Support: Automatic page-0 read at power-up and boot-from-NAND capability simplify firmware/boot management in system designs.
  • Robust Data Protection: Hardware program/erase lockout during power transitions, bad-block protection, and documented ECC requirements provide layers of reliability for stored data.

Why Choose F59D1G81MB-45BG2M?

The F59D1G81MB-45BG2M delivers a focused combination of SLC endurance, low-voltage operation, and performance features packaged in a compact 63-ball BGA. It is positioned for designers who require a reliable 1Gbit parallel NAND Flash solution for solid-state storage, boot/firmware retention, and embedded applications where program/erase longevity and data retention matter.

With hardware protection mechanisms, cache/copy-back operations, and on-board features documented in the series datasheet, this part supports implementation of robust storage subsystems while fitting constrained PCB footprints and 1.8V system environments.

Request a quote or submit an inquiry to obtain pricing and availability for the F59D1G81MB-45BG2M. Our team can provide lead-time and ordering information to support your design and production planning.

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