F59D1G81MB-45TIG2M

1Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 1 Gbit, 1.8 V, x8, 45 ns, Industrial

Quantity 684 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization128M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G81MB-45TIG2M – SLC NAND Flash, 1 Gbit, 1.8 V, x8, 45 ns, Industrial

The F59D1G81MB-45TIG2M is a 1.074 Gbit single-level cell (SLC) NAND flash memory organized as 128M × 8, designed for industrial-grade applications. It implements a 1.8 V (1.7 V–1.95 V) parallel NAND interface with command/address/data multiplexed I/O, and is offered in a 48-pin TSOPI surface-mount package.

Targeted at solid-state mass storage and embedded systems requiring reliable non-volatile storage, this device delivers fast read/write cycles with on-chip features that support boot and high-throughput program/read operations while meeting JEDEC qualification and RoHS compliance.

Key Features

  • Memory Core 1.074 Gbit SLC NAND organized as 128M × 8 with spare capacity ((128M + 4M) × 8). Endurance is specified at 100K program/erase cycles with 10 years data retention.
  • Performance Fast read capability with an access time listed as 30 ns (specification) and page-mode data read supported at a 45 ns cycle time per byte; random read response up to 25 µs (max.).
  • Program & Erase Typical page program time is 300 µs with a write-cycle timing listed at 350 µs; typical block erase time is 4 ms for a 128 KB block (x8 device).
  • Interface & Architecture Parallel NAND interface with command/address/data multiplexed I/O ports, cache program/read, copy-back operation and EDO mode to improve throughput and data handling.
  • Reliability & Data Integrity Hardware data protection features including program/erase lockout during power transitions, bad-block protection, One Time Program (OTP) option, and ECC guidance (x8: 4 bit/512 Byte).
  • Power & Supply Low-voltage operation at 1.8 V nominal (operating range 1.7 V–1.95 V) suitable for low-power system designs.
  • Package & Temperature Available in a Pb-free 48-pin TSOPI (TSOPI-48) surface-mount package with industrial operating temperature range −40°C to +85°C and JEDEC qualification.
  • System Features Boot-from-NAND support, automatic page 0 read at power-up option, automatic memory download, cache and copy-back functions to facilitate system boot and firmware update workflows.

Typical Applications

  • Industrial Solid-State Storage — Reliable non-volatile storage for industrial controllers and data storage appliances where SLC endurance and 10-year retention are required.
  • Embedded Systems & Boot Memory — Supports boot-from-NAND and automatic page read at power-up for firmware storage and system boot applications.
  • High-Throughput Program/Read Workloads — Cache program/read and copy-back features improve throughput when streaming consecutive pages or performing large file writes.

Unique Advantages

  • High Endurance SLC Technology: 100K program/erase cycles and 10 years data retention provide long operational life for demanding applications.
  • Low-Voltage Operation: 1.7 V–1.95 V supply range supports low-power system designs and standard 1.8 V platforms.
  • Boot and System Integration Features: Boot-from-NAND, automatic page 0 read at power-up, and automatic memory download simplify firmware deployment and system initialization.
  • Performance Enhancements: Cache program/read, copy-back operation, and EDO mode increase effective throughput for sequential and pipelined operations.
  • Industrial-Grade Reliability: JEDEC qualification, RoHS compliance, and an operating range of −40°C to +85°C support deployment in industrial environments.
  • Flexible Packaging: 48-pin TSOPI surface-mount package suitable for compact PCB layouts and automated assembly.

Why Choose F59D1G81MB-45TIG2M?

The F59D1G81MB-45TIG2M combines SLC NAND endurance and retention with features tailored for embedded and industrial storage systems—fast read/write timings, cache and copy-back operations, and boot support that simplify firmware and data management. Its low-voltage 1.8 V operation, JEDEC qualification, and industrial temperature rating make it well suited for designs that require long-term reliability and predictable behavior.

Choose this device for industrial applications and embedded designs that need robust non-volatile storage, firmware boot capability, and performance-oriented NAND features packed into a compact TSOPI-48 surface-mount package.

Request a quote or submit an inquiry to receive pricing and lead-time information for the F59D1G81MB-45TIG2M and discuss availability for your production needs.

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