F59D1G81MB&F59D1G161MB-IP(2M)

1Gb NAND Flash Ind.
Part Description

Ind. -40~85°C, SLC NAND, 1.8V

Quantity 934 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48 pin TSOPI; 48/ 63/ 67 Ball BGAMemory FormatNAND FlashTechnologySLC NAND Flash
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48 pin TSOPI; 48/ 63/ 67 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G81MB&F59D1G161MB-IP(2M) – Ind. -40~85°C, SLC NAND, 1.8V

The F59D1G81MB & F59D1G161MB series are industrial-grade SLC NAND flash devices providing 1.074 Gbit non-volatile storage in parallel interface configurations. Designed for industrial embedded storage, the devices deliver single-bit-per-cell SLC reliability, robust endurance and extended operating temperature support for demanding environments.

These devices support boot-from-NAND and automatic memory download functions and are offered in multiple surface-mount packages to suit system-level integration and density requirements.

Key Features

  • Memory Capacity & Organization — 1.074 Gbit total capacity; organized as 1G × 8 with spare area and page/block architecture suitable for page-program and block-erase operations.
  • SLC NAND Technology — Single-level cell architecture with ECC requirements specified (x8: 4bit/512Byte; x16: 4bit/256Word), 100K program/erase endurance and 10 years data retention.
  • Voltage & Interface — 1.8V VCC (datasheet range 1.7 V–1.95 V) with parallel command/address/data multiplexed I/O for direct integration into embedded controllers.
  • Performance — Read cycle time down to 30 ns (access time); typical program time ~300–350 µs per page and typical block erase around 4 ms for X8 devices.
  • Reliability & Protection — Hardware protections including program/erase lockout during power transitions, bad-block protection and support for copy-back and cache program/read operations to optimize block management and throughput.
  • Industrial Temperature Range — Guaranteed operation from −40°C to 85°C for use in industrial environments.
  • Package Options — Available in surface-mount packages including 48-pin TSOPI and 48/63/67-ball BGA variants to match board-level and thermal requirements.
  • Standards & Compliance — JEDEC qualification and RoHS compliant.

Typical Applications

  • Industrial Embedded Storage — Reliable non-volatile storage for industrial controllers, data logging and factory automation where extended temperature range and endurance are required.
  • Boot and Firmware Storage — Boot-from-NAND and automatic memory download options make these devices suitable for storing boot code and firmware images in embedded systems.
  • Solid-State Mass Storage — Page/block architecture with cache and copy-back operations enables efficient storage management for solid-state applications that need durable program/erase cycles.
  • High-Reliability Data Retention — Use in systems requiring long-term data retention (specified 10 years) and predictable P/E cycling for lifecycle planning.

Unique Advantages

  • Industrial-grade robustness: Extended −40°C to 85°C operating range supports deployment in harsh environments.
  • Proven SLC endurance: 100K program/erase cycles provide predictable lifetime for write-intensive embedded storage.
  • Flexible packaging: Multiple TSOPI and BGA package options simplify BOM choices for board-space and thermal constraints.
  • Built-in data management features: Cache program/read, copy-back and bad-block protection streamline defect management and improve throughput.
  • Ecosystem-ready interfaces: Parallel, multiplexed command/address/data I/O and JEDEC qualification ease integration with standard controllers and toolchains.
  • Compliance and sourcing confidence: RoHS compliance and JEDEC qualification support regulatory and supply-chain requirements.

Why Choose F59D1G81MB&F59D1G161MB-IP(2M)?

The F59D1G81MB & F59D1G161MB series deliver an industrial-grade SLC NAND solution that balances endurance, data retention and operational temperature range for embedded storage applications. With parallel I/O, cache and copy-back capabilities, and JEDEC qualification, these devices are positioned for systems that require reliable, long-life non-volatile memory with predictable behavior.

These parts are well suited to engineers designing industrial controllers, boot/firmware storage solutions and solid-state storage systems that need a combination of SLC reliability, package flexibility and proven memory management features.

Request a quote or submit an inquiry for pricing and availability to evaluate the F59D1G81MB & F59D1G161MB series for your next industrial storage design.

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