F59D2G81KA-45BCIAG2N

The F59D2G81KA-45BCIAG2N is a 2 Gbit (256M × 8) single-level cell (SLC) NAND flash memory device designed for high-reliability embedded storage. It operates from a 1.8V supply (1.7 V–1.95 V) with a parallel x8 multiplexed command/address/data interface and is offered in a compact 67-ball BGA package for space-constrained designs.

Targeted at storage-intensive embedded applications, this AEC‑Q100 qualified, automotive-grade device delivers robust endurance and long-term data retention while supporting features such as cache programming, two-plane operations and boot-from-NAND capability to simplify system boot and firmware download processes.

Key Features

• Core / Memory Organization — 2.147 Gbit capacity organized as 256M × 8 with a page size of (2K + 128) bytes and block size of 64 pages (128K + 8K) bytes.
• Technology — SLC NAND (1 bit/cell) providing endurance and retention characteristics consistent with single-level cell technology.
• Performance — Read cycle 45 ns; access time listed as 25 ns; random read up to 25 µs. Typical page program time 400 µs (Max. 700 µs).
• Program / Erase — Automatic program and erase operations with block erase typical 3.5 ms (Max. 10 ms); supports cache program and cache read for higher throughput.
• Interface — Parallel command/address/data multiplexed DQ port (x8) with support for copy-back operations and EDO mode.
• Reliability & Data Integrity — Endurance rated to 50K program/erase cycles; ECC requirement 8-bit per 512 bytes; hardware data protection and program/erase lockout during power transitions.
• Power — Single 1.8V supply range (1.7 V–1.95 V) for low-voltage system integration.
• Package & Mounting — 67-ball BGA (BGA-67), surface-mount package suitable for compact board layouts.
• Temperature & Qualification — Operating temperature −40 °C to 105 °C; automotive grade with AEC‑Q100 qualification.
• Additional Functional Features — Boot-from-NAND support, automatic page-0 read at power-up option, automatic memory download, two-plane operation and cache/copy features to support flexible system designs.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Solid-State Storage — Embedded file storage and mass-storage applications that require deterministic program/erase behavior and long retention.
• Imaging & Multimedia — Image file memory for still cameras and voice or audio recording devices where page-level transfers and cache programming improve throughput.
• Automotive Systems — Automotive infotainment, telematics and ECU storage applications leveraging AEC‑Q100 qualification and −40 °C to 105 °C operating range.
• Embedded Boot & Firmware — Boot-from-NAND and automatic memory download features for system boot code and field firmware updates.

Unique Advantages

• AEC‑Q100 Automotive Qualification — Built and qualified for automotive environments, supporting designs requiring industry-recognized qualification.
• High Endurance SLC — SLC technology with 50K program/erase cycles provides a reliable storage medium for frequent update scenarios.
• Compact BGA Packaging — 67-ball BGA reduces PCB footprint while supporting high-density embedded storage.
• Robust Data Management Features — ECC guidance (8-bit/512-byte), hardware data protection and power-transition lockout help preserve data integrity in the field.
• System-Level Boot & Download Support — Built-in boot-from-NAND, automatic page-0 read at power-up and automatic memory download streamline firmware delivery and system initialization.
• Wide Operating Voltage and Temperature — 1.7 V–1.95 V supply range and −40 °C to 105 °C operating range enable use across diverse embedded and automotive platforms.

Why Choose F59D2G81KA-45BCIAG2N?

The F59D2G81KA-45BCIAG2N positions itself as a robust, automotive-grade SLC NAND solution for designers needing dependable non-volatile storage with proven endurance and retention. Its combination of AEC‑Q100 qualification, SLC reliability, and functional features such as boot-from-NAND and cache operations make it well suited for embedded systems, automotive infotainment, imaging devices and other applications that require durable onboard storage.

With a compact 67-ball BGA package, broad operating temperature range and a low-voltage 1.8V supply, this device supports compact, power-conscious board designs while providing system-level capabilities to simplify boot and firmware workflows.

Request a quote or submit a technical inquiry to receive pricing, availability and additional technical support for integrating the F59D2G81KA-45BCIAG2N into your design.