F59D2G81KA-45BCIG2N
| Part Description |
SLC NAND Flash, 2Gbit (256M × 8), 1.8V, x8, 45ns, 67-ball BGA, Industrial |
|---|---|
| Quantity | 714 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-67 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 25 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.7V ~ 1.95V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 400 µs | Packaging | 67-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59D2G81KA-45BCIG2N – SLC NAND Flash, 2Gbit (256M × 8), 1.8V, x8, 45ns, 67-ball BGA, Industrial
The F59D2G81KA-45BCIG2N is a 2 Gbit single-level cell (SLC) NAND flash memory device organized as 256M × 8. It implements a parallel, command/address/data-multiplexed DQ interface and operates from a low-voltage 1.8 V supply (1.7 V to 1.95 V).
Designed for high-density non-volatile storage in industrial environments, this device targets use cases such as solid-state file storage, voice recording and image memory for still cameras, and other systems requiring reliable, long-term data retention across a –40 °C to 85 °C operating range.
Key Features
- Memory Organization 2 Gbit capacity organized as 256M × 8 with a page size of (2K + 128) bytes and block size of 64 pages ((128K + 8K) bytes). Each die contains 2048 blocks (LUN).
- SLC NAND Technology Single-level cell architecture with 1 bit per cell; endurance of 50K program/erase cycles and 10 years data retention (uncycled at 55 °C) for robust storage longevity.
- Performance Read-cycle performance specified at 45 ns (speed bin) with random read up to 25 µs (max). Typical page program time is 400 µs (700 µs max); typical block erase time is 3.5 ms (10 ms max).
- Low-Voltage Operation VCC = 1.8 V (operating range 1.7 V to 1.95 V) for low-voltage system compatibility.
- Interface & Data Path Parallel DQ port for multiplexed command/address/data transfers, supporting cache program/read, copy-back, two-plane operation and EDO mode to optimize throughput.
- System Reliability & Protection Hardware data protection including program/erase lockout during power transitions and ECC requirement of 8 bits per 512 bytes to maintain data integrity.
- Package & Mounting Surface-mount 67-ball BGA (BGA-67) package suitable for compact board designs in industrial applications.
- Qualification & Compliance JEDEC-qualified device and RoHS compliant for regulated production environments.
Typical Applications
- Solid-State File Storage High-density non-volatile storage for embedded file systems and removable media implementations.
- Voice Recording Systems Reliable storage of audio data with predictable program/erase timing and long retention characteristics.
- Still Camera Image Memory Image file storage for cameras and imaging modules that require block/ page-level program and erase operations.
- Industrial Data Logging Non-volatile logging and firmware storage in industrial devices operating across –40 °C to 85 °C.
Unique Advantages
- High Endurance SLC 50K program/erase cycles provide extended device lifetime for write-intensive applications.
- Low-Voltage, Compact Package 1.8 V operation combined with a 67-ball BGA reduces system power and PCB footprint for space-constrained industrial designs.
- Predictable Performance Defined read-cycle (45 ns), random read (up to 25 µs), and program/erase timing enable straightforward performance budgeting in system design.
- Data Integrity Features ECC requirement (8-bit per 512 bytes) plus hardware protections and power-transition lockout reduce risk of data corruption.
- JEDEC Qualification Standardized qualification eases integration and supply-chain validation for production deployments.
- Boot and System Integration Support Boot-from-NAND option, automatic page-0 read at power-up, and automatic memory download features simplify system initialization and firmware management.
Why Choose F59D2G81KA-45BCIG2N?
The F59D2G81KA-45BCIG2N combines SLC NAND endurance, deterministic performance characteristics and low-voltage operation in a compact 67-ball BGA package suited for industrial temperature ranges. Its block and page architecture, ECC guidance and hardware protection features make it well-suited to designers building reliable, long-lived non-volatile storage into imaging devices, voice recorders and other high-density storage applications.
This device is positioned for customers who require JEDEC-qualified NAND with clear timing and endurance specifications, compact integration, and features that support system boot and secure program/erase behavior under power transitions.
Request a quote or contact sales to discuss availability, lead times and pricing for the F59D2G81KA-45BCIG2N.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A