F59D2G81KA-45TG2N

2Gb NAND Flash
Part Description

SLC NAND Flash, 2Gbit (256M×8), 1.8V, x8, 45ns, 48-pin TSOPI

Quantity 525 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size2 GbitAccess Time25 nsGradeCommercial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page400 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization256M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59D2G81KA-45TG2N – SLC NAND Flash, 2Gbit (256M×8), 1.8V, x8, 45ns, 48-pin TSOPI

The F59D2G81KA-45TG2N is a 2.147 Gbit SLC NAND Flash memory organized as 256M × 8 with a 1.8V supply range (1.7 V to 1.95 V). Built for parallel-interface embedded storage, it combines high-density non-volatile storage with SLC endurance and data retention characteristics suitable for industrial and consumer embedded systems.

Designed for applications such as solid-state file storage, voice recording and still-image memory, this device offers page- and block-level operations, hardware protection features and performance options tuned for reliable program/read/erase cycles in space-constrained surface-mount packages.

Key Features

  • Memory Architecture 2.147 Gbit organization (256M × 8) with 2,176-byte data registers (2K + 128) and block size of 64 pages (128K + 8K bytes).
  • SLC NAND Technology Single-level cell NAND Flash offering endurance of 50K program/erase cycles and an uncycled data retention specification of 10 years at 55°C.
  • Performance Read cycle 45 ns, random read up to 25 µs (max), and page program time typ. 400 µs (max. 700 µs), enabling responsive program/read operations.
  • Program/Erase and Reliability Block erase time typ. 3.5 ms (max. 10 ms). ECC requirement: 8-bit per 512-byte for data integrity; supports hardware data protection and program/erase lockout during power transitions.
  • Operational Features Command/address/data multiplexed DQ port, cache program/read, copy-back, two-plane operation, EDO mode and automatic page-0 read at power-up option for flexible system integration.
  • Physical & Power 48-pin TSOPI surface-mount package (12 mm × 20 mm body, 0.5 mm pitch) with VCC 1.8V nominal (1.7–1.95 V) and commercial operating temperature range 0 °C to 70 °C.

Typical Applications

  • Solid-State File Storage High-density non-volatile storage for embedded file systems where SLC endurance and data retention are required.
  • Digital Still Cameras & Imaging Devices Page-based program/read operations and large block sizes support image file memory for still cameras and similar devices.
  • Voice Recording & Multimedia Reliable sequential and random read/write performance for voice recording modules and other audio/multimedia storage functions.
  • Boot and System Flash Boot-from-NAND support and automatic memory download features make it suitable for systems that load firmware or large binary images from NAND.

Unique Advantages

  • SLC Endurance and Retention 50K P/E cycles and a 10-year uncycled retention at 55°C provide long-term data reliability for demanding embedded applications.
  • System Integration Flexibility Multiplexed command/address/data DQ port, cache operations, two-plane and copy-back support simplify data-management strategies and improve throughput.
  • Power-Transition Protection Program/erase lockout during power transitions and hardware data protection reduce risk of corruption during unstable power conditions.
  • Compact Surface-Mount Package 48-pin TSOPI package enables high-density board designs while providing the I/O and control signal set required by parallel NAND interfaces.
  • Predictable Performance Specified read cycle (45 ns), random read (25 µs max) and documented program/erase timings facilitate deterministic system behavior and performance budgeting.

Why Choose F59D2G81KA-45TG2N?

The F59D2G81KA-45TG2N provides a balanced combination of SLC endurance, validated retention characteristics and comprehensive NAND feature support—making it suitable for embedded designs that require long-lived, high-density non-volatile storage. Its documented timing, ECC requirement and power protections enable engineers to design robust storage subsystems with predictable behavior.

This part is well-suited for customers building consumer and industrial embedded systems that need reliable program/erase cycling, secure data handling during power events, and compact surface-mount implementation with a parallel NAND interface.

Request a quote or submit an inquiry to evaluate F59D2G81KA-45TG2N for your next embedded storage design.

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