F59D1G81LB&F59D1G161LB-IP(2M)

1Gb NAND Flash Ind.
Part Description

Ind. -40~85°C, SLC NAND, 1.8V

Quantity 92 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48 pin TSOPI; 63/ 67 Ball BGAMemory FormatNAND FlashTechnologySLC NAND Flash
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48 pin TSOPI; 63/ 67 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G81LB&F59D1G161LB-IP(2M) – Ind. -40~85°C, SLC NAND, 1.8V

The F59D1G81LB & F59D1G161LB series from ESMT is a 1 Gbit-class SLC NAND Flash memory family designed for industrial-temperature non-volatile storage. The devices provide SLC NAND architecture with parallel I/O and support for boot-from-NAND and automatic memory download functions.

Targeted at industrial embedded storage and solid-state mass storage applications, the family offers low-voltage 1.8V operation, options in x8 and x16 organizations, and multiple surface-mount packages to suit board-level integration and reliability requirements in -40 °C to 85 °C environments.

Key Features

  • Memory & Architecture SLC NAND Flash non-volatile memory with 1.074 Gbit capacity and organization options including 128M×8 (x8) and 64M×16 (x16) structures.
  • Low-Voltage Operation 1.8V VCC operation (1.7 V – 1.95 V supply range as specified in the datasheet) for reduced power-domain complexity in system designs.
  • Performance Access time specified at 30 ns; typical program time around 300 µs and typical block erase time around 4 ms (datasheet typical values). Random read and serial access modes and cache read/program features improve throughput for sequential and streaming data.
  • Endurance & Data Retention SLC endurance rated at 60K program/erase cycles with data retention specified at 10 years.
  • Reliability & Protection Built-in hardware data protection, program/erase lockout during power transitions, bad-block protection, and ECC requirements (x8 – 1bit/512Byte; x16 – 1bit/256Word) to maintain data integrity.
  • Advanced Flash Functions Features include automatic program and erase, cache program/read, copy-back operation, automatic Page 0 read at power-up option, One Time Program (OTP) operation, and NOP/command register support for flexible control.
  • Interface & Packaging Parallel command/address/data multiplexed I/O port; available in 48‑pin TSOPI and 63/67‑ball BGA surface-mount packages to fit diverse board and thermal constraints.
  • Industrial Grade & Standards Industrial operating temperature range −40 °C to 85 °C and JEDEC qualification; RoHS compliant.

Typical Applications

  • Industrial Embedded Storage — Persistent program and configuration storage in industrial controllers and embedded systems operating across −40 °C to 85 °C.
  • Boot and Firmware Storage — Boot-from-NAND support and automatic Page 0 read at power-up make it suitable for storing bootloaders and firmware images.
  • Solid-State Mass Storage — SLC architecture and cache/copy-back features support reliable mass storage use in industrial-grade SSDs and data-logging modules.
  • Network and Communications Equipment — Non-volatile code and data storage for routers, switches, and other network appliances requiring JEDEC-qualified flash.

Unique Advantages

  • Industrial Temperature Range: Operation from −40 °C to 85 °C supports deployment in harsh and temperature-variable environments.
  • SLC Endurance: 60K program/erase cycles and 10-year data retention provide long-term reliability for firmware and persistent data.
  • Low-Voltage 1.8V Operation: Enables integration into low-voltage platforms and simplifies power-domain design.
  • Flexible Integration Options: Parallel interface plus TSOPI and BGA packages allow designers to select the footprint and assembly style that match thermal and space constraints.
  • Embedded System Features: Boot-from-NAND, automatic Page 0 read, OTP, cache program/read, and copy-back operations streamline firmware management and field updates.
  • Data Integrity Support: Hardware protection and defined ECC requirements help maintain data reliability in critical applications.

Why Choose F59D1G81LB&F59D1G161LB-IP(2M)?

The F59D1G81LB & F59D1G161LB series delivers industrial-grade SLC NAND Flash with features tailored for robust, long-life embedded storage. With 1.8V operation, selectable x8/x16 organizations, JEDEC qualification, and package options for board-level flexibility, these devices are positioned for designs that require reliable non-volatile memory across temperature extremes.

Engineers designing industrial controllers, storage modules, or network appliances will find the series’ endurance, data-retention characteristics, and built-in flash-management features practical for long-term deployments and field upgradability.

Request a quote or submit an inquiry to evaluate F59D1G81LB&F59D1G161LB-IP(2M) for your next industrial storage or embedded firmware project.

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