F59D1G161LB-45TIG2M
| Part Description |
SLC NAND Flash, 1Gbit, 1.8V, x16, 45ns, Industrial |
|---|---|
| Quantity | 1,022 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | TSOPI-48 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 30 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.7V ~ 1.95V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 350 µs | Packaging | 48-TSOPI | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 64M x 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59D1G161LB-45TIG2M – SLC NAND Flash, 1Gbit, 1.8V, x16, 45ns, Industrial
The F59D1G161LB-45TIG2M is a 1.074 Gbit SLC NAND Flash memory organized as 64M × 16 with a parallel x16 interface and a 1.8 V power supply range (1.7 V–1.95 V). Designed and manufactured by ESMT, this industrial-grade device is JEDEC-qualified and supplied in a 48-pin TSOPI surface-mount package.
Targeted at embedded and solid-state storage applications, the device offers fast access times and robust NAND features—including automatic program/erase, cache and copy-back operations—making it suitable for boot storage, firmware, and industrial data storage roles where endurance and retention are required.
Key Features
- Memory Type & Organization — SLC NAND Flash, 1.074 Gbit capacity organized as 64M × 16 for high data integrity and predictable block management.
- Performance — Fast access characteristics with an access time of 30 ns and page-mode read cycle support down to 45 ns; write-cycle timing listed at 350 µs (word/page).
- Program/Erase and Page Structure — Automatic program and erase operations; x16 page program and block erase support with cache program and cache read modes for improved throughput.
- Reliability & Endurance — Endurance specified at 60K program/erase cycles and data retention of 10 years to support long-life industrial applications.
- ECC Requirement — x16 organization requires ECC of 1 bit/256 Word as specified for reliable operation.
- Power — Low-voltage operation at 1.8 V nominal (operating range 1.7 V–1.95 V) to support modern low-voltage systems.
- Interface & I/O — Parallel, multiplexed command/address/data I/O port suitable for direct interfacing with embedded controllers that support NAND protocols.
- Package & Mounting — 48-pin TSOPI package (TSOPI-48), surface-mount for compact board layouts and standard SMT assembly.
- Operating Range & Qualification — Industrial temperature range −40°C to 85°C and JEDEC qualification for dependable operation in demanding environments.
- Embedded NAND Features — Includes copy-back, bad-block protection, automatic power-up page 0 read option, OTP operation, and boot-from-NAND support to simplify firmware and boot storage implementations.
Typical Applications
- Industrial Embedded Storage — Reliable program/erase endurance and industrial temperature range make it suitable for firmware and data storage in factory automation and control systems.
- Boot and Firmware Memory — Boot-from-NAND support and automatic page 0 read at power-up enable straightforward use as non-volatile boot/firmware storage for embedded platforms.
- Solid-State Mass Storage — SLC NAND architecture and cache/copy-back features support solid-state storage designs that require robust write cycles and predictable retention.
- Data Logging and Instrumentation — Long data retention and high endurance help maintain integrity for logging applications in metering, monitoring, and industrial instrumentation.
Unique Advantages
- SLC Endurance and Retention: 60K program/erase cycles and 10-year data retention deliver longevity for long-deployment installations.
- Low-Voltage Operation: 1.8 V nominal supply (1.7 V–1.95 V) supports low-power system architectures without additional level-shifting.
- High Read/Write Throughput Modes: Cache program/read and copy-back operations enable faster sequential write and read performance for streaming and bulk transfers.
- Industrial Qualification: JEDEC qualification and −40°C to 85°C operating range meet industrial environmental requirements.
- Compact Surface-Mount Package: TSOPI-48 surface-mount package simplifies PCB integration in space-constrained designs.
- Built-in NAND Management Features: Bad-block protection, OTP, and automatic power-up read reduce software complexity and improve system reliability.
Why Choose F59D1G161LB-45TIG2M?
The F59D1G161LB-45TIG2M positions itself as a robust SLC NAND solution for industrial embedded systems that require durable, low-voltage non-volatile memory with predictable endurance and retention. Its combination of JEDEC qualification, industrial temperature range, and NAND-specific features—such as cache program/read and bad-block protection—make it well suited for boot storage, firmware, and solid-state storage designs where long-term reliability matters.
Engineered and manufactured by ESMT, this device delivers a balance of performance (fast access and page-mode cycle support), manageability (copy-back and OTP), and package-level convenience (TSOPI-48 SMT), supporting system designers and procurement teams seeking a field-proven SLC NAND memory option.
Request a quote or submit a product inquiry to get pricing, availability, and technical support for the F59D1G161LB-45TIG2M. Your request will help initiate lead-time and volume pricing information for design integration and production planning.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A