F59D1G161LB-45TIG2M

1Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 1Gbit, 1.8V, x16, 45ns, Industrial

Quantity 1,022 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization64M x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G161LB-45TIG2M – SLC NAND Flash, 1Gbit, 1.8V, x16, 45ns, Industrial

The F59D1G161LB-45TIG2M is a 1.074 Gbit SLC NAND Flash memory organized as 64M × 16 with a parallel x16 interface and a 1.8 V power supply range (1.7 V–1.95 V). Designed and manufactured by ESMT, this industrial-grade device is JEDEC-qualified and supplied in a 48-pin TSOPI surface-mount package.

Targeted at embedded and solid-state storage applications, the device offers fast access times and robust NAND features—including automatic program/erase, cache and copy-back operations—making it suitable for boot storage, firmware, and industrial data storage roles where endurance and retention are required.

Key Features

  • Memory Type & Organization — SLC NAND Flash, 1.074 Gbit capacity organized as 64M × 16 for high data integrity and predictable block management.
  • Performance — Fast access characteristics with an access time of 30 ns and page-mode read cycle support down to 45 ns; write-cycle timing listed at 350 µs (word/page).
  • Program/Erase and Page Structure — Automatic program and erase operations; x16 page program and block erase support with cache program and cache read modes for improved throughput.
  • Reliability & Endurance — Endurance specified at 60K program/erase cycles and data retention of 10 years to support long-life industrial applications.
  • ECC Requirement — x16 organization requires ECC of 1 bit/256 Word as specified for reliable operation.
  • Power — Low-voltage operation at 1.8 V nominal (operating range 1.7 V–1.95 V) to support modern low-voltage systems.
  • Interface & I/O — Parallel, multiplexed command/address/data I/O port suitable for direct interfacing with embedded controllers that support NAND protocols.
  • Package & Mounting — 48-pin TSOPI package (TSOPI-48), surface-mount for compact board layouts and standard SMT assembly.
  • Operating Range & Qualification — Industrial temperature range −40°C to 85°C and JEDEC qualification for dependable operation in demanding environments.
  • Embedded NAND Features — Includes copy-back, bad-block protection, automatic power-up page 0 read option, OTP operation, and boot-from-NAND support to simplify firmware and boot storage implementations.

Typical Applications

  • Industrial Embedded Storage — Reliable program/erase endurance and industrial temperature range make it suitable for firmware and data storage in factory automation and control systems.
  • Boot and Firmware Memory — Boot-from-NAND support and automatic page 0 read at power-up enable straightforward use as non-volatile boot/firmware storage for embedded platforms.
  • Solid-State Mass Storage — SLC NAND architecture and cache/copy-back features support solid-state storage designs that require robust write cycles and predictable retention.
  • Data Logging and Instrumentation — Long data retention and high endurance help maintain integrity for logging applications in metering, monitoring, and industrial instrumentation.

Unique Advantages

  • SLC Endurance and Retention: 60K program/erase cycles and 10-year data retention deliver longevity for long-deployment installations.
  • Low-Voltage Operation: 1.8 V nominal supply (1.7 V–1.95 V) supports low-power system architectures without additional level-shifting.
  • High Read/Write Throughput Modes: Cache program/read and copy-back operations enable faster sequential write and read performance for streaming and bulk transfers.
  • Industrial Qualification: JEDEC qualification and −40°C to 85°C operating range meet industrial environmental requirements.
  • Compact Surface-Mount Package: TSOPI-48 surface-mount package simplifies PCB integration in space-constrained designs.
  • Built-in NAND Management Features: Bad-block protection, OTP, and automatic power-up read reduce software complexity and improve system reliability.

Why Choose F59D1G161LB-45TIG2M?

The F59D1G161LB-45TIG2M positions itself as a robust SLC NAND solution for industrial embedded systems that require durable, low-voltage non-volatile memory with predictable endurance and retention. Its combination of JEDEC qualification, industrial temperature range, and NAND-specific features—such as cache program/read and bad-block protection—make it well suited for boot storage, firmware, and solid-state storage designs where long-term reliability matters.

Engineered and manufactured by ESMT, this device delivers a balance of performance (fast access and page-mode cycle support), manageability (copy-back and OTP), and package-level convenience (TSOPI-48 SMT), supporting system designers and procurement teams seeking a field-proven SLC NAND memory option.

Request a quote or submit a product inquiry to get pricing, availability, and technical support for the F59D1G161LB-45TIG2M. Your request will help initiate lead-time and volume pricing information for design integration and production planning.

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