F59D1G161LB-45BIG2M
| Part Description |
SLC NAND Flash, 1Gbit (64M×16), 1.8V, x16, 45ns, 63-ball BGA, Industrial |
|---|---|
| Quantity | 320 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-63 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 30 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.7V ~ 1.95V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 350 µs | Packaging | 63-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 64M x 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59D1G161LB-45BIG2M – SLC NAND Flash, 1Gbit (64M×16), 1.8V, x16, 45ns, 63-ball BGA, Industrial
The F59D1G161LB-45BIG2M is a 1.074 Gbit single-level cell (SLC) NAND flash memory device organized as 64M × 16. It implements a parallel x16 interface and operates from a 1.8V supply (1.7 V – 1.95 V), packaged in a 63-ball BGA for surface-mount assemblies.
Targeted at industrial applications, this JEDEC-qualified device delivers non-volatile storage with on-chip features for reliable data management, system boot support and in-field memory operations where temperature range and endurance matter.
Key Features
- Memory & Organization 1.074 Gbit SLC NAND organized as 64M × 16 with a data register of (1K + 32) words and page program/block erase structures defined in words for the x16 configuration.
- Performance Parallel x16 interface with 45 ns read cycle capability (part speed -45 designation) and series-level paging and cache operations for efficient sequential and streaming reads.
- Program / Erase Characteristics Typical program and erase behaviors for the series include program times on the order of 300 µs (series typical) and block erase times around 4 ms (series typical); Write cycle time for word/page is specified as 350 µs.
- Reliability & Data Integrity Endurance of 60K program/erase cycles and data retention of 10 years (series values). ECC requirement for x16 is 1 bit per 256 words to support data integrity.
- Built‑in Flash Management Features include automatic program and erase, cache program/read, copy-back, bad-block protection, one-time program (OTP), automatic page 0 read at power-up, boot-from-NAND support and automatic memory download (series features).
- Power & Protection 1.8V supply range (1.7 V – 1.95 V) with hardware data protection and program/erase lockout during power transitions to protect data during unstable power conditions.
- Package & Temperature 63-ball BGA (BGA-63) surface-mount package and Industrial temperature grade rated for operation from −40 °C to 85 °C.
- Standards & Qualification JEDEC-qualified NAND flash series implementation.
Typical Applications
- Industrial Embedded Storage — Non-volatile program and data storage for industrial controllers and embedded systems operating across −40 °C to 85 °C.
- System Boot / Firmware Storage — Boot-from-NAND and automatic page 0 read at power-up enable reliable firmware storage and automated startup sequences.
- Mass Storage / Data Logging — SLC endurance and 10-year retention support sustained logging and field data retention in industrial environments.
- Reliable Field Upgrade / Download — Automatic memory download and cache program features facilitate in-field firmware updates and large file writes.
Unique Advantages
- SLC Endurance and Retention: 60K program/erase cycles and 10-year data retention (series) provide robust long-term storage for industrial use cases.
- Boot and Download Support: Built-in boot-from-NAND and automatic memory download simplify system-level boot and firmware update flows.
- Power-Transition Protection: Hardware protection and program/erase lockout during power transitions reduce risk of data corruption during unstable power events.
- Compact, Board-Ready Package: 63-ball BGA surface-mount package (BGA-63) streamlines PCB integration for space-constrained industrial designs.
- JEDEC Qualification: Series-level JEDEC qualification supports predictable behavior and integration into established design and manufacturing flows.
Why Choose F59D1G161LB-45BIG2M?
The F59D1G161LB-45BIG2M positions itself as a reliable industrial-grade SLC NAND solution, combining JEDEC-qualified NAND architecture, SLC endurance characteristics and series-level features such as boot-from-NAND, cache program/read and bad-block protection. Its 1.074 Gbit capacity in a compact 63-ball BGA and wide operating voltage and temperature ranges make it suitable for embedded systems that require durable non-volatile storage and controlled program/erase behavior.
This part is appropriate for designers of industrial controllers, embedded storage subsystems and equipment requiring long-term data retention, firmware boot capability and managed flash operations with ECC guidance for x16 configurations.
Request a quote or submit a purchase inquiry to get pricing and availability for F59D1G161LB-45BIG2M. Our team can provide ordering information, lead-time details and support for integration and qualification in your design.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
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