F59D1G161LB-45BIG2M

1Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 1Gbit (64M×16), 1.8V, x16, 45ns, 63-ball BGA, Industrial

Quantity 320 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-63Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time30 nsGradeIndustrial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page350 µsPackaging63-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization64M x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D1G161LB-45BIG2M – SLC NAND Flash, 1Gbit (64M×16), 1.8V, x16, 45ns, 63-ball BGA, Industrial

The F59D1G161LB-45BIG2M is a 1.074 Gbit single-level cell (SLC) NAND flash memory device organized as 64M × 16. It implements a parallel x16 interface and operates from a 1.8V supply (1.7 V – 1.95 V), packaged in a 63-ball BGA for surface-mount assemblies.

Targeted at industrial applications, this JEDEC-qualified device delivers non-volatile storage with on-chip features for reliable data management, system boot support and in-field memory operations where temperature range and endurance matter.

Key Features

  • Memory & Organization 1.074 Gbit SLC NAND organized as 64M × 16 with a data register of (1K + 32) words and page program/block erase structures defined in words for the x16 configuration.
  • Performance Parallel x16 interface with 45 ns read cycle capability (part speed -45 designation) and series-level paging and cache operations for efficient sequential and streaming reads.
  • Program / Erase Characteristics Typical program and erase behaviors for the series include program times on the order of 300 µs (series typical) and block erase times around 4 ms (series typical); Write cycle time for word/page is specified as 350 µs.
  • Reliability & Data Integrity Endurance of 60K program/erase cycles and data retention of 10 years (series values). ECC requirement for x16 is 1 bit per 256 words to support data integrity.
  • Built‑in Flash Management Features include automatic program and erase, cache program/read, copy-back, bad-block protection, one-time program (OTP), automatic page 0 read at power-up, boot-from-NAND support and automatic memory download (series features).
  • Power & Protection 1.8V supply range (1.7 V – 1.95 V) with hardware data protection and program/erase lockout during power transitions to protect data during unstable power conditions.
  • Package & Temperature 63-ball BGA (BGA-63) surface-mount package and Industrial temperature grade rated for operation from −40 °C to 85 °C.
  • Standards & Qualification JEDEC-qualified NAND flash series implementation.

Typical Applications

  • Industrial Embedded Storage — Non-volatile program and data storage for industrial controllers and embedded systems operating across −40 °C to 85 °C.
  • System Boot / Firmware Storage — Boot-from-NAND and automatic page 0 read at power-up enable reliable firmware storage and automated startup sequences.
  • Mass Storage / Data Logging — SLC endurance and 10-year retention support sustained logging and field data retention in industrial environments.
  • Reliable Field Upgrade / Download — Automatic memory download and cache program features facilitate in-field firmware updates and large file writes.

Unique Advantages

  • SLC Endurance and Retention: 60K program/erase cycles and 10-year data retention (series) provide robust long-term storage for industrial use cases.
  • Boot and Download Support: Built-in boot-from-NAND and automatic memory download simplify system-level boot and firmware update flows.
  • Power-Transition Protection: Hardware protection and program/erase lockout during power transitions reduce risk of data corruption during unstable power events.
  • Compact, Board-Ready Package: 63-ball BGA surface-mount package (BGA-63) streamlines PCB integration for space-constrained industrial designs.
  • JEDEC Qualification: Series-level JEDEC qualification supports predictable behavior and integration into established design and manufacturing flows.

Why Choose F59D1G161LB-45BIG2M?

The F59D1G161LB-45BIG2M positions itself as a reliable industrial-grade SLC NAND solution, combining JEDEC-qualified NAND architecture, SLC endurance characteristics and series-level features such as boot-from-NAND, cache program/read and bad-block protection. Its 1.074 Gbit capacity in a compact 63-ball BGA and wide operating voltage and temperature ranges make it suitable for embedded systems that require durable non-volatile storage and controlled program/erase behavior.

This part is appropriate for designers of industrial controllers, embedded storage subsystems and equipment requiring long-term data retention, firmware boot capability and managed flash operations with ECC guidance for x16 configurations.

Request a quote or submit a purchase inquiry to get pricing and availability for F59D1G161LB-45BIG2M. Our team can provide ordering information, lead-time details and support for integration and qualification in your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1998


    Headquarters: Hsinchu Science Park, Hsinchu, Taiwan


    Employees: 400+


    Revenue: $377.8 Million


    Certifications and Memberships: N/A


    Featured Products
    Latest News
    keyboard_arrow_up