F50L4G41XB-IP(2X)

The ESMT F50L4G41XB-IP(2X) is a 4.295 Gbit SLC SPI‑NAND flash memory device designed for low pin‑count nonvolatile storage. It delivers a compact serial peripheral interface with industry‑standard SPI command compatibility and features intended for boot and embedded storage applications where board real‑estate and pin count are constrained.

Built for robust embedded designs, this device combines high-density SLC storage, user-selectable on‑die ECC, and advanced read modes to support reliable firmware storage, boot-up functionality and general purpose data retention in industrial environments.

Key Features

• Memory and Organization  4.295 Gbit SLC NAND organized as 4G × 8 with pages of 4,352 bytes (4,096 bytes data + 256 bytes spare) and blocks of 64 pages (256K + 16K bytes).
• Serial SPI Interface  Standard and extended SPI‑compatible serial bus interface with flexible I/O: instruction/address/data combinations on 1, 2 or 4 pins supporting Dual/Quad and Random read modes for higher throughput.
• Performance  104 MHz maximum clock frequency and an 8 ns access time; page read and program timings documented in the datasheet (page read: 25 µs max with ECC disabled; page program: 200 µs typical with ECC disabled).
• On‑Die ECC and Data Integrity  User‑selectable internal ECC (8 bits/sector) and features for automatic device initialization and continuous read within a block to support reliable boot and data operations.
• Endurance and Retention  100,000 program/erase cycles endurance and uncycled data retention of 10 years (24/7 @ 70°C) as documented in the qualification information.
• Security and Protection  Software write protection via lock register, hardware write protection to freeze BP bits, lock‑tight feature for BP bit freezing during one power cycle, and permanent block lock protection. Includes a 10‑page OTP area.
• Package and Thermal  Surface‑mount 8‑contact WSON package; industrial grade operating temperature range of −40°C to +85°C per product specifications.
• Regulatory  RoHS compliant.

Typical Applications

• Embedded Boot and Firmware Storage  Supports boot‑up functionality and storage of firmware images in designs that require a low pin‑count, compact nonvolatile memory.
• Industrial Controllers  Industrial temperature rating and endurance characteristics make it suitable for firmware and configuration storage in industrial systems.
• Compact Consumer and IoT Devices  Low pin‑count SPI interface and small WSON package allow board space savings in tightly constrained designs.
• General Purpose Nonvolatile Storage  High density SLC NAND for applications requiring durable data storage with on‑die ECC and block protection features.

Unique Advantages

• High‑density SLC Storage: 4.295 Gbit capacity in a 4G × 8 organization provides significant nonvolatile storage in a compact footprint.
• Flexible SPI I/O Modes: Support for 1/2/4‑bit I/O, Dual/Quad and Random read modes enables designers to balance throughput and pin count.
• Robust Data Integrity: User‑selectable on‑die ECC (8 bits/sector) plus permanent and temporary block protection options help protect firmware and critical data.
• Documented Endurance and Retention: 100,000 program/erase cycles and 10‑year uncycled data retention (24/7 @ 70°C) per qualification information for long‑life deployments.
• Industrial Temperature Range: −40°C to +85°C operation supports deployment in demanding environments.
• Compact Surface‑Mount Packaging: 8‑contact WSON (surface mount) simplifies layout and reduces BOM for compact devices.

Why Choose F50L4G41XB-IP(2X)?

The F50L4G41XB-IP(2X) combines SLC endurance and retention with a low pin‑count SPI interface to provide a cost‑effective, high‑density nonvolatile memory solution for embedded and industrial designs. With on‑die ECC, comprehensive block protection features, and documented performance figures (including 104 MHz clocking and short page program/read times), it is positioned for applications that require reliable firmware and data storage in compact form factors.

This device is well suited to engineers and procurement teams designing scalable embedded systems that need industrial temperature capability, durable program/erase endurance, and the board‑level savings afforded by a small, surface‑mount SPI‑NAND package.

Request a quote or submit an inquiry to our sales team to get pricing, availability, and technical support for the F50L4G41XB-IP(2X).