F50L1G41XA-IP(2B)

1Gb SPI NAND Flash Ind.
Part Description

SPI NAND Flash, 3.3V

Quantity 1,489 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package8-contact WSON/ 24 Ball BGAMemory FormatNAND FlashTechnologySPI NAND
Memory Size1 GbitAccess Time8 nsGradeIndustrial
Clock Frequency104 MHzVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page600 µsPackaging8-contact WSON/ 24 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F50L1G41XA-IP(2B) – SPI NAND Flash, 3.3V

The F50L1G41XA-IP(2B) is a 1.074 Gbit serial SPI NAND Flash memory device using single-level cell (SLC) technology. It provides low-pin-count, cost-effective non-volatile storage with a standard SPI-compatible serial bus and selectable I/O modes for flexible system integration.

Designed for industrial applications, the device supports extended operating conditions and offers on-die ECC, fast page operations, and integrated security/OTP features to simplify board design and long-term data retention.

Key Features

  • Density & Organization — 1.074 Gbit device organized as 1G × 8 with pages of 2,176 bytes (2,048 bytes data + 128 bytes spare) and blocks of 64 pages.
  • SPI-NAND Serial Interface — Standard and extended SPI-compatible serial bus with flexible command/address/data pin configurations (support for 1, 2 or 4 I/O lines) to minimize pin count and ease migration across densities.
  • Performance — Up to 104 MHz clock frequency; typical page program times around 200–220 µs and block erase typical 2 ms. Page read times are 25 µs (on-die ECC disabled) and 70 µs (on-die ECC enabled).
  • On-Die ECC & Reliability — User-selectable internal ECC with 8-bit/sector correction, endurance rated to 100,000 program/erase cycles and uncycled data retention of 10 years at 70°C.
  • Security & OTP — Software and hardware write protection, permanent block lock, lock-tight behavior across power cycles, and a 10-page OTP area for one-time programmable data.
  • Packages & Mounting — Available in compact 8-contact WSON (8 × 6 mm) and 24-ball BGA (6 × 8 mm) surface-mount packages to support space-constrained board designs.
  • Industrial Grade & Temperature — Rated for industrial operation with an operating temperature range of −40°C to +85°C.
  • Additional System Features — Read page cache mode, read unique ID, read parameter page and automatic device initialization after power-up to streamline system bring-up.

Typical Applications

  • Low-pin-count embedded storage — Ideal for systems that require non-volatile storage with a small number of signals and minimal PCB routing complexity.
  • Industrial control and instrumentation — Industrial temperature rating and high endurance make the device suitable for continuous-operation applications requiring reliable program/erase cycling.
  • Firmware and configuration storage — On-die ECC, OTP region, and security features support robust storage of firmware, configuration data, and unique device IDs.
  • Upgradeable density designs — Standard SPI pinout and protocol allow designers to scale to higher densities without board redesign.

Unique Advantages

  • Low pin-count serial interface: Reduces BOM and PCB complexity while keeping a stable pinout across densities for easier upgrades.
  • Selectable on-die ECC: Lowers host CPU overhead by providing internal error correction with 8-bit/sector capability.
  • Industrial-rated endurance and retention: 100,000 program/erase cycles and 10-year uncycled data retention at 70°C support long-term reliability.
  • Compact package options: Small WSON and BGA packages (8×6 mm and 6×8 mm) enable space-efficient integration in compact systems.
  • Built-in security and OTP: Multiple protection mechanisms plus a 10-page one-time programmable area for secure data storage.
  • Fast, flexible I/O and performance: Up to 104 MHz operation with multi-I/O read/write modes and page cache support for responsive data access.

Why Choose F50L1G41XA-IP(2B)?

The F50L1G41XA-IP(2B) combines SLC NAND reliability with a compact SPI serial interface to deliver cost-effective, high-endurance non-volatile storage for industrial and embedded designs. With user-selectable on-die ECC, robust security features, and compact WSON/BGA package options, it suits applications that need scalable density, simplified board design, and proven data retention.

Choose this device when you need a low-pin-count memory solution that balances endurance, thermal range, and system-level features—making it a practical option for long-life industrial deployments and designs that may migrate to higher densities without PCB changes.

Request a quote or submit an inquiry to receive pricing and availability for the F50L1G41XA-IP(2B) SPI NAND Flash.

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