F50L1G41LC (2P)

The F50L1G41LC (2P) is an industrial-grade SPI NAND flash memory device providing 1.074 Gbit of non-volatile storage in a low pin-count serial interface. Designed around SPI-NAND architecture with internal ECC and SLC memory cell organization, it delivers compact flash storage for embedded and industrial applications requiring extended temperature range and robust data retention.

This device operates from a 3.3V supply (2.7V–3.6V), supports up to 104 MHz SPI clock, and includes on-chip features such as internal ECC, power-up auto-load of the first page, and CASN page support to simplify system integration and improve reliability in industrial environments.

Key Features

• Memory Capacity & Organization — 1.074 Gbit total capacity organized as 1G × 8 with page size (2K + 64) bytes and block size (128K + 4K) bytes for predictable flash management.
• SPI-NAND Architecture — Serial peripheral interface with support for SPI Mode 0 and Mode 3 and widths x1, x2, x4 (note: x2 program operation not defined) to keep pin count low while enabling high-density storage.
• Performance — Up to 104 MHz clock frequency and an 8 ns access time; page program time ≈ 400 µs and block erase time ≈ 4 ms for efficient write/erase cycles.
• Data Integrity — Internal ECC (1 bit per 512 bytes) enabled by default and read-from-cell-to-register with ECC in ≈ 100 µs to help maintain data reliability.
• Endurance & Retention — Endurance rated to 100,000 program/erase cycles and data retention specified at 10 years.
• Power & Reset Behavior — Fast power-up ready time (max 1 ms) and max reset busy time of 1 ms, with program/erase lockout during power transitions for safe operation.
• Package & Temperature — Surface-mount 8-contact WSON package options (including 8 × 6 mm and 6 × 5 mm variants) and industrial operating temperature from −40 °C to 85 °C.
• Special Features — CASN page support, OTP operation, Read Unique ID, bad-block protection, and command register operations for flexible system-level control.

Typical Applications

• Industrial Embedded Storage — Reliable non-volatile storage for industrial controllers and telemetry modules operating across −40 °C to 85 °C.
• IoT and Edge Devices — Compact, low-pin-count flash for firmware and data logging in constrained IoT endpoints and edge gateways.
• Consumer/Professional Electronics — Firmware storage, parameter tables, and OTP data in devices that benefit from SPI interface simplicity and high density.
• Secure ID and Configuration Storage — Read Unique ID and OTP support for device provisioning and secure configuration storage.

Unique Advantages

• Low Pin-Count SPI Interface — Minimizes PCB routing and simplifies integration while retaining high density and SPI compatiblity.
• Built-In ECC and Auto-Load — Internal 1-bit-per-512-byte ECC and first-page auto-load at power-up reduce software overhead and improve data integrity on boot.
• Industrial Temperature Range — Specified operation from −40 °C to 85 °C for deployment in harsh or outdoor environments.
• Fast Power and Reset Response — Power-up ready and reset busy times up to 1 ms minimize downtime during system start-up and resets.
• Durability and Data Retention — 100K program/erase cycle endurance and 10-year data retention provide long-term reliability for fielded systems.
• Flexible Package Options — 8-contact WSON packaging in compact footprints supports a range of board-space and thermal requirements.

Why Choose F50L1G41LC (2P)?

The F50L1G41LC (2P) targets designs that need high-density, industrial-grade non-volatile storage with a minimal pin count and integrated reliability features. With 1.074 Gbit capacity, on-chip ECC, fast SPI operation to 104 MHz, and robust endurance and retention figures, it suits embedded systems and industrial applications where firmware, logs, and configuration must be stored safely across temperature extremes.

Engineers will find the device straightforward to integrate via standard SPI modes, with compact WSON packaging and predictable program/erase timings to help optimize system-level flash management. The combination of performance, on-chip data integrity, and industrial temperature support makes this part appropriate for long-life, fielded products.

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