F50D4G41XB-IP(2X)

The F50D4G41XB-IP(2X) is a 4.295 Gbit SPI-NAND Flash memory device from ESMT built on single-level cell (SLC) technology. It provides a low pin-count serial peripheral interface and is designed for embedded and industrial applications that require non-volatile code and data storage with robust endurance and retention characteristics.

With an 83 MHz maximum clock, selectable x1/x2/x4 I/O modes, on-die ECC and support for continuous read within a block, this device targets designs needing compact footprint, reliable program/erase cycles and boot-up read performance in industrial temperature ranges.

Key Features

• Memory Capacity & Organization — 4.295 Gbit total capacity organized as 4G × 8 with page size 4,352 bytes (4,096 bytes data + 256 bytes spare), 64 pages per block and 1 plane of 2,048 blocks.
• SPI-NAND Architecture — Standard and extended SPI-compatible serial bus interface supporting instruction/address/data on 1, 2 or 4 pins to minimize pin count; device signals include SCK, SI, SO, CS#, HOLD#, WP# plus VCC and GND.
• Voltage Supply — 1.8 V operating range (1.7 V to 1.95 V) suitable for low-voltage embedded systems.
• Performance — 83 MHz maximum clock frequency with read page and program timings documented (page read: 30 µs max with ECC disabled, page program: 200 µs typical with ECC disabled); block erase typical 2 ms.
• On-Die ECC — User-selectable internal ECC (8 bits/sector) to support data integrity during read operations; device shipped with block 0 valid when ECC enabled.
• Advanced Read Modes — Read page cache and continuous read within a block with x2/x4, Dual, Quad and Random read options to support faster boot and streaming reads.
• Security & Protection — Software write protection via lock register, hardware write protection (WP#) with lock freeze options, permanent block lock and a 10-page OTP area for one-time programmable data.
• Endurance & Retention — Endurance rated at 100,000 program/erase cycles and uncycled data retention specified as 10 years at 70°C (JESD47H-compliant data retention qualification references available).
• Package & Mounting — 8-contact LGA package (surface-mount) in the ESMT F50D4G41XB series package footprint (ordering examples list 8 × 6 mm variant).
• Industrial Temperature Grade — Rated for industrial operating temperatures from -40°C to 85°C.

Typical Applications

• Embedded Systems — Low pin-count SPI interface and compact 8-contact LGA package simplify board-level integration for microcontroller-based systems and firmware storage.
• Industrial Equipment — Industrial temperature rating (-40°C to 85°C) and high endurance make the device suitable for factory automation, instrumentation and control applications.
• Boot and Code Storage — Continuous read within a block and read-cache modes support reliable boot-up and fast code execution from non-volatile storage.
• Consumer & Connected Devices — SLC reliability, on-die ECC and multiple I/O modes provide flexible performance and data integrity for IoT and connected-device firmware and data needs.

Unique Advantages

• Low Pin-Count SPI Interface: Reduces PCB routing complexity and BOM by using a serial bus while retaining NAND-style capacity and cost per bit.
• SLC Technology: Provides higher endurance characteristics (100,000 P/E cycles) and robust data retention for demanding embedded workloads.
• Selectable ECC: On-die ECC (8 bits/sector) improves read reliability and can be enabled or disabled per application requirements.
• Flexible Read Modes: Dual/Quad and cache read modes plus continuous block read support faster system boot and high-throughput read operations without increasing pin count.
• Industrial Temperature Range: -40°C to 85°C rating makes the device applicable across a wide range of deployment environments.
• Security & OTP: Hardware/software protection features and a 10-page OTP area enable secure storage of critical data and configuration.

Why Choose F50D4G41XB-IP(2X)?

The F50D4G41XB-IP(2X) combines SLC NAND endurance and on-die ECC with a compact SPI interface and multiple read modes to deliver a reliable, low-pin-count non-volatile solution. It is positioned for designs that require industrial temperature operation, long data retention and flexible performance scaling via x1/x2/x4 I/O modes.

This device suits engineers and procurement teams building embedded systems, industrial controllers, and connected devices that need scalable capacity, robust program/erase lifecycles and straightforward board-level integration in an 8-contact LGA surface-mount package.

Request a quote or contact sales for pricing, availability and to discuss how F50D4G41XB-IP(2X) fits your design requirements.