F50D2G41XA-IP(2B)

The F50D2G41XA-IP(2B) is a 1.8V SPI NAND Flash memory device from ESMT designed for cost‑effective nonvolatile storage with a low pin count. It uses SLC NAND architecture and provides standard and extended SPI‑compatible serial interfaces with user‑selectable on‑die ECC for reliable data handling.

Targeted for systems that require compact flash storage and industrial temperature operation, this device combines high density, on‑die error correction, and SPI bus flexibility to simplify board design and support system scalability.

Key Features

• Core Memory  2.147 Gbit memory size with organization listed as 2G × 8 and SLC NAND technology.
• Page & Block Structure  Page size 2,176 bytes (2,048 + 128 spare); block contains 64 pages (128K + 8K bytes).
• Performance  104 MHz clock frequency (MAX); on‑die ECC enabled and disabled page read/program timings available in the datasheet (page read: 30 µs / 80 µs MAX; page program: typical 200–220 µs; block erase: 2 ms typical).
• Serial SPI Interface  Standard and extended SPI‑compatible serial bus; instruction/address/data pin modes support 1, 2 or 4‑pin configurations for flexible throughput and pin usage.
• Data Integrity & Security  User‑selectable internal ECC (8 bits per 512 bytes), software write protection with lock register, hardware WP# support, lock‑tight feature, and permanent block lock; includes 10‑page OTP area.
• Reliability  Endurance rated to 100,000 PROGRAM/ERASE cycles and uncycled data retention specified as 10 years at 70°C per datasheet qualification notes.
• Power & Temperature  Device name indicates 1.8V operation; datasheet operating VCC range specified as 1.7–1.95 V. Industrial‑grade operation with an operating temperature range of −40°C to +85°C.
• Package & Mounting  Surface‑mount 8‑contact WSON package (8 × 6 mm listed in ordering information) for compact board integration.

Typical Applications

• Compact Nonvolatile Storage  Low‑pin‑count SPI interface and high density make the device suitable for compact firmware and data storage where board space and pin count are constrained.
• Industrial Embedded Systems  Industrial temperature rating and SLC endurance support reliable operation in factory automation and industrial control equipment.
• Boot and Code Storage  Page/block architecture and on‑die ECC support dependable program/erase cycles for boot code and firmware shadowing.

Unique Advantages

• Low‑pin-count SPI Interface: Reduces PCB complexity and supports future density upgrades without board redesign.
• User‑selectable On‑Die ECC: Enables flexibility between raw throughput and built‑in error correction to match system error‑handling strategies.
• High Endurance SLC NAND: 100,000 PROGRAM/ERASE cycles provide longevity for write‑intensive embedded applications.
• Industrial Temperature Range: −40°C to +85°C operation supports deployment in harsh and wide‑range environments.
• Security & OTP: Multiple protection mechanisms including software/hardware write protection, lock‑tight, permanent block lock, and a 10‑page OTP area for secure storage.
• Compact Surface Mount Package: 8‑contact WSON (8 × 6 mm) minimizes board area while supporting surface‑mount assembly processes.

Why Choose F50D2G41XA-IP(2B)?

The F50D2G41XA-IP(2B) combines SLC NAND density with an industry‑standard SPI interface and selectable on‑die ECC to deliver reliable, compact nonvolatile storage for embedded and industrial designs. With documented endurance, extended temperature operation, and multiple protection features, it is well suited for applications that require durable firmware and data storage in a low‑pin‑count form factor.

This device is appropriate for engineers and procurement teams seeking a scalable memory option that balances density, reliability, and board‑level simplicity backed by ESMT documentation and qualification details in the datasheet.

Request a quote or submit an inquiry to discuss pricing, availability, and integration details for the F50D2G41XA-IP(2B).