F59D4G81KA-45BCIG2R

4Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 4Gbit, 1.8V, x8, 45ns, Industrial

Quantity 1,403 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-67Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size4 GbitAccess Time20 nsGradeIndustrial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page400 µsPackaging67-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D4G81KA-45BCIG2R – SLC NAND Flash, 4Gbit, 1.8V, x8, 45ns, Industrial

The F59D4G81KA-45BCIG2R is a single-level cell (SLC) NAND flash memory device from ESMT, organized as 512M × 8 for a total of 4.295 Gbit. Designed for industrial applications, it provides a parallel x8 interface at 1.8V (1.7 V–1.95 V) with JEDEC qualification and a compact 67-ball BGA package.

This device supports automatic program and erase operations and is suited for high-density non-volatile storage roles such as solid-state file storage, voice recording, image file memory for still cameras, and embedded boot/firmware storage where endurance, retention and industrial temperature range are required.

Key Features

  • Memory & Organization 4.295 Gbit capacity organized as 512M × 8 with a page size of (4K + 256) bytes and block size of 64 pages = (256K + 16K) bytes. The device contains 2,048 blocks per die (LUN) and a single plane architecture.
  • Technology & Endurance SLC NAND offering 1 bit per cell with endurance rated at 60K program/erase cycles and an uncycled data retention specification of 10 years at 55°C.
  • Performance Read cycle rated at 45 ns (speed grade -45); access time listed as 20 ns. Typical page program time is 400 µs (typical) with up to 700 µs maximum; block erase time is 3.5 ms (typical) with up to 10 ms maximum.
  • Power & Interface Low-voltage operation at 1.8V (range 1.7 V–1.95 V) with a parallel command/address/data multiplexed DQ port and x8 IO configuration for straightforward system integration.
  • System Reliability & Data Integrity Hardware data protection features including program/erase lockout during power transitions, ECC requirement of 8 bit/512 Byte, and support for automatic page 0 read at power-up and boot-from-NAND options.
  • Advanced Functional Features Supports cache program/read, copy-back and cache operations, automatic program and erase sequences, and up to four partial program cycles in the same page (NOP = 4).
  • Package & Temperature Surface-mount 67-ball BGA package (industrial grade) with operating temperature range of −40°C to 85°C, suited for industrial environments.

Typical Applications

  • Solid-state storage — High-density non-volatile storage for embedded file systems and removable storage appliances where SLC endurance and retention are required.
  • Imaging devices — Image file memory for still cameras and similar products that need reliable block/program operations and long-term data retention.
  • Voice and media recording — Storage for voice recorders and media devices leveraging automatic program/erase and cache program capabilities.
  • Embedded boot and firmware storage — Boot-from-NAND support and automatic page-0 read at power-up make this device suitable for firmware and boot media in embedded systems.

Unique Advantages

  • SLC endurance and retention — 60K program/erase cycle rating and 10-year uncycled data retention at 55°C provide a strong reliability profile for long-life applications.
  • Low-voltage operation — 1.8V supply (1.7 V–1.95 V) reduces system power domain complexity while maintaining NAND functionality.
  • Industrial temperature range — −40°C to 85°C operating range supports deployment in rugged and industrial environments.
  • Comprehensive system features — Built-in protections (program/erase lockout on power transitions), ECC requirement guidance, and boot support streamline integration and system reliability.
  • Compact BGA package — 67-ball BGA surface-mount package saves PCB area while providing a robust mounting solution for industrial boards.

Why Choose F59D4G81KA-45BCIG2R?

The F59D4G81KA-45BCIG2R balances industrial-grade resilience with NAND-specific performance characteristics. Its SLC architecture, JEDEC qualification, and proven program/erase timing specs make it appropriate for applications that demand reliable non-volatile storage over extended lifecycles and temperature ranges.

Designed for embedded system integrators and product teams requiring scalable, long-retention flash, this ESMT device offers practical system-level features—boot support, hardware protections, and cache operations—that simplify firmware and storage implementations while meeting industrial requirements.

Request a quote or submit an inquiry to receive pricing and availability for the F59D4G81KA-45BCIG2R. Our team can provide lead-time information and support for integration into your designs.

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