IS42S16160J-7BL-TR

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 345 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160J-7BL-TR – 256Mbit Parallel SDRAM, 54-TFBGA

The IS42S16160J-7BL-TR is a 256 Mbit volatile SDRAM device organized as 16M x 16 with a parallel memory interface. It delivers 256 Mbit capacity in a compact 54-TFBGA (8×8) package and operates from a 3V ~ 3.6V supply.

Designed for systems that require parallel SDRAM memory with defined performance characteristics, the device provides a 143 MHz clock frequency and an access time of 5.4 ns within an operating temperature range of 0°C to 70°C.

Key Features

  • Memory Architecture 256 Mbit SDRAM organized as 16M x 16 for parallel memory implementations.
  • Performance Supports a clock frequency of 143 MHz and an access time of 5.4 ns to meet defined timing and throughput requirements.
  • Interface Parallel memory interface for direct integration into parallel memory subsystems.
  • Power Operates from a 3V ~ 3.6V supply range, suitable for designs targeting this voltage domain.
  • Package 54-TFBGA (8×8) package case that provides a compact board-level footprint.
  • Operating Range Specified for commercial temperature operation from 0°C to 70°C (TA).

Typical Applications

  • Parallel memory subsystems — Provides 256 Mbit of SDRAM organized as 16M x 16 for systems using a parallel memory interface.
  • High-speed buffering — 143 MHz clock frequency and 5.4 ns access time support high-throughput buffering and data staging where defined timing is required.
  • Compact board designs — 54-TFBGA (8×8) package enables integration in space-constrained PCB layouts.
  • Commercial-temperature designs — Rated for 0°C to 70°C operation and a 3V ~ 3.6V supply for typical commercial applications.

Unique Advantages

  • Fixed 16M × 16 organization: Simplifies memory mapping and interface design for parallel SDRAM implementations.
  • Defined timing performance: 143 MHz maximum clock frequency and 5.4 ns access time provide predictable performance for system timing budgets.
  • Wide 3.0–3.6 V supply compatibility: Operates across a common supply window for designs using 3V-class power rails.
  • Compact TFBGA package: 54-TFBGA (8×8) package minimizes board area while maintaining standard footprint characteristics.
  • Commercial temperature rating: Specified for 0°C to 70°C to match typical commercial-grade device requirements.

Why Choose IS42S16160J-7BL-TR?

IS42S16160J-7BL-TR positions itself as a straightforward parallel SDRAM option when a 256 Mbit, 16M x 16 memory device is required. Its documented clock and access-time characteristics, combined with a compact 54-TFBGA (8×8) package and standard 3V ~ 3.6V operation, make it suitable for designs that need a defined-performance SDRAM component within commercial temperature limits.

This device is appropriate for engineers specifying board-level parallel memory where capacity, predictable timing, package footprint, and supply compatibility are primary selection criteria.

Request a quote or submit a product inquiry for IS42S16160J-7BL-TR to obtain pricing and availability information.

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