IS42S16320F-6BLI-TR

IC DRAM 512MBIT PAR 54TFBGA
Part Description

IC DRAM 512MBIT PAR 54TFBGA

Quantity 194 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package54-TW-BGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320F-6BLI-TR – IC DRAM 512MBIT PAR 54TFBGA

The IS42S16320F-6BLI-TR is a 512 Mbit synchronous DRAM (SDRAM) device with a 32M × 16 memory organization and a parallel memory interface. It delivers high-speed access with a 167 MHz clock frequency and a 5.4 ns access time, packaged in a 54-TFBGA (54-TW-BGA, 8×13) surface-mount package.

This device is specified for operation from -40°C to 85°C and supports a supply voltage range of 3.0 V to 3.6 V, providing a defined set of electrical and environmental characteristics for system designs that require discrete parallel SDRAM capacity.

Key Features

  • Memory Type and Architecture Volatile SDRAM organized as 32M × 16 for a total memory size of 512 Mbit.
  • Performance 167 MHz clock frequency with a 5.4 ns access time for fast synchronous memory cycles.
  • Interface Parallel memory interface with a 16-bit data organization.
  • Power Supply voltage range from 3.0 V to 3.6 V.
  • Package 54-TFBGA package (listed as 54-TW-BGA, 8×13) for surface-mount integration.
  • Operating Temperature Rated for ambient operation from -40°C to 85°C (TA).

Unique Advantages

  • 512 Mbit density: Provides substantial DRAM capacity in a single device through its 32M × 16 organization.
  • High-speed operation: 167 MHz clocking and 5.4 ns access time enable faster memory access cycles.
  • Parallel 16-bit data path: Native 16-bit organization supports wide data transfers using a parallel interface.
  • Defined supply range: 3.0 V to 3.6 V supply rating aligns with 3.3 V system rails.
  • Compact BGA package: 54-TFBGA (8×13) package supports surface-mount PCB layouts with a small footprint.
  • Extended ambient rating: Specified for -40°C to 85°C operation for broader environmental use.

Why Choose IC DRAM 512MBIT PAR 54TFBGA?

The IS42S16320F-6BLI-TR from Integrated Silicon Solution Inc. is targeted at designs that require a discrete 512 Mbit SDRAM device with a parallel 16-bit interface and clearly specified electrical and thermal operating limits. Its combination of 32M × 16 organization, 167 MHz clock frequency, and 5.4 ns access time offers a defined performance profile for systems needing synchronous DRAM capacity.

Choose this device when your design requires the listed density, speed, supply voltage range, package style, and ambient temperature rating from a known memory supplier. The product specification provides concrete parameters to evaluate integration into existing memory subsystems and system designs.

Request a quote or submit an inquiry for IS42S16320F-6BLI-TR to obtain current availability and pricing information.

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