IS42S16320D-7TLI-TR
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 18 Available (as of May 19, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320D-7TLI-TR – IC DRAM 512MBIT PAR 54TSOP II
The IS42S16320D-7TLI-TR is a 512 Mbit synchronous DRAM device organized as 32M × 16. It uses a pipelined, fully synchronous architecture with parallel memory interface and LVTTL signaling for high-speed, clock-referenced operation.
Designed for board-level memory expansion where a 54-pin TSOP-II package and industrial temperature range are required, this device delivers programmable burst modes, selectable CAS latency, and standard SDRAM refresh modes to support system memory requirements.
Key Features
- Memory Core The device is a 512 Mbit SDRAM organized as 32M × 16 with internal bank architecture to hide row access/precharge latency.
- Performance Clock frequency up to 143 MHz (‑7 speed grade) with access time of 5.4 ns and programmable CAS latency (2 or 3 clocks).
- Interface Parallel memory interface with LVTTL signaling for standard synchronous DRAM connectivity.
- Burst and Mode Control Programmable burst lengths (1, 2, 4, 8, full page) and burst sequences (sequential/interleave); supports burst read/write and burst read/single write operations with burst termination commands.
- Refresh and Self-Refresh Supports Auto Refresh and Self Refresh with 8K refresh cycles per 64 ms (standard SDRAM refresh behavior).
- Power Supply voltage range specified at 3.0 V to 3.6 V for this device variant.
- Package & Temperature 54-pin TSOP-II (0.400", 10.16 mm width) package; operating temperature range −40 °C to +85 °C (TA).
Typical Applications
- Embedded and Industrial Systems Board-level memory expansion where a 512 Mbit parallel SDRAM in a 54-pin TSOP-II package is required and operation to −40 °C is needed.
- Legacy Parallel SDRAM Designs Replacement or population of existing designs that use parallel SDRAM interfaces and LVTTL signaling.
- Networking and Communications Modules Local buffering and working memory in modules that require synchronous DRAM with programmable burst and CAS latency.
- Repair and Prototyping Use in prototype boards or repair applications that specify the 54-TSOP II package and 32M × 16 organization.
Unique Advantages
- Synchronous, pipelined architecture: Enables clock-referenced operation and predictable timing for systems designed around a positive clock edge.
- Flexible performance tuning: Programmable CAS latency and burst configurations let designers trade latency and throughput to match system timing.
- Industrial temperature support: Specified operation from −40 °C to +85 °C for use in temperature-sensitive environments.
- Compact TSOP-II footprint: 54-pin TSOP-II package (10.16 mm width) simplifies PCB routing for board-level memory implementations.
- Standard refresh behavior: Auto and self-refresh support with 8K refresh cycles per 64 ms for reliable dynamic memory retention management.
Why Choose IS42S16320D-7TLI-TR?
The IS42S16320D-7TLI-TR combines a 512 Mbit SDRAM density with synchronous, pipelined operation and flexible burst/CAS settings to meet the needs of systems that require deterministic memory timing and parallel LVTTL interfacing. Its 54-pin TSOP-II package and −40 °C to +85 °C operating range make it suitable for board-level integration in industrial and embedded applications.
This device is appropriate for designers and procurement teams who need a verified 32M × 16 SDRAM component with configurable performance characteristics, standard SDRAM refresh modes, and compact packaging for existing parallel memory footprints.
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