IS42S16320D-7TL-TR
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,484 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320D-7TL-TR – 512Mbit SDRAM, 32M × 16, 54‑TSOP II
The IS42S16320D-7TL-TR is a 512 Mbit synchronous DRAM organized as 32M × 16 that implements a pipelined, fully synchronous architecture for high-speed parallel memory applications. Designed for systems requiring a parallel SDRAM interface, this device delivers up to 143 MHz clock operation with programmable burst and latency options to match a range of memory access patterns.
This part is offered in a 54‑pin TSOP‑II package and supports standard SDRAM functions such as auto-refresh, self-refresh and programmable burst lengths for use in embedded and system memory buffering applications where deterministic, clock-referenced operation is required.
Key Features
- Core / Memory Organization 512 Mbit density organized as 32M × 16 with internal banks for concurrent row access and precharge.
- Performance Rated for 143 MHz clock frequency (‑7 speed grade) with access times down to 5.4 ns and programmable CAS latency (2 or 3 clocks) to tune read timing.
- Burst and Access Modes Programmable burst length (1, 2, 4, 8, full page) with selectable sequential or interleave burst sequences and support for burst read/write and burst read/single write operations.
- Refresh and Reliability Supports Auto Refresh and Self Refresh with 8K refresh cycles every 64 ms (commercial specification), providing standard DRAM refresh management.
- Interface Parallel SDRAM interface with LVTTL signalling and random column address every clock cycle for predictable synchronous operation.
- Power Supply voltage range specified as 3.0 V to 3.6 V for the device variant provided.
- Package & Temperature 54‑pin TSOP‑II package (0.400", 10.16 mm width) rated for commercial temperature operation from 0°C to +70°C (TA).
Typical Applications
- System memory buffering Parallel SDRAM buffering for embedded platforms and control systems that require deterministic, clocked memory access.
- Data streaming and frame buffers High-speed burst read/write capability and programmable burst lengths make the device suitable for short-term data buffering in streaming applications.
- General-purpose embedded SDRAM Use in designs that need a 512 Mbit synchronous DRAM in a compact 54‑TSOP‑II footprint with standard LVTTL parallel interface.
Unique Advantages
- Configurable timing: Programmable CAS latency and burst lengths let designers match memory timing to system clocks and access patterns.
- Predictable synchronous operation: Fully synchronous, clock-referenced inputs and outputs simplify timing design and integration with system clocks.
- Compact, industry-standard package: 54‑pin TSOP‑II (10.16 mm width) provides a board-friendly footprint for space-constrained applications.
- Standard refresh support: Auto Refresh and Self Refresh with 8K cycles per 64 ms reduce host overhead for DRAM maintenance.
- Wide supply tolerance in specified variant: Operation over a 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails.
Why Choose IC DRAM 512MBIT PAR 54TSOP II?
The IS42S16320D-7TL-TR positions itself as a straightforward, clock-synchronous 512 Mbit SDRAM option for engineers needing a parallel memory device with programmable latency and burst control. Its combination of 32M × 16 organization, 143 MHz operation, and standard TSOP‑II packaging makes it suitable for designs that require predictable synchronous performance in a compact form factor.
This device is best suited for designers and procurement teams building embedded systems, buffering subsystems, or other applications that require a serial-free parallel SDRAM solution with standard refresh and burst capabilities. The documented timing, supply, and thermal specifications support reliable integration and long-term use in commercial-temperature designs.
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