IS42S16320D-7TL-TR

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 1,484 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320D-7TL-TR – 512Mbit SDRAM, 32M × 16, 54‑TSOP II

The IS42S16320D-7TL-TR is a 512 Mbit synchronous DRAM organized as 32M × 16 that implements a pipelined, fully synchronous architecture for high-speed parallel memory applications. Designed for systems requiring a parallel SDRAM interface, this device delivers up to 143 MHz clock operation with programmable burst and latency options to match a range of memory access patterns.

This part is offered in a 54‑pin TSOP‑II package and supports standard SDRAM functions such as auto-refresh, self-refresh and programmable burst lengths for use in embedded and system memory buffering applications where deterministic, clock-referenced operation is required.

Key Features

  • Core / Memory Organization  512 Mbit density organized as 32M × 16 with internal banks for concurrent row access and precharge.
  • Performance  Rated for 143 MHz clock frequency (‑7 speed grade) with access times down to 5.4 ns and programmable CAS latency (2 or 3 clocks) to tune read timing.
  • Burst and Access Modes  Programmable burst length (1, 2, 4, 8, full page) with selectable sequential or interleave burst sequences and support for burst read/write and burst read/single write operations.
  • Refresh and Reliability  Supports Auto Refresh and Self Refresh with 8K refresh cycles every 64 ms (commercial specification), providing standard DRAM refresh management.
  • Interface  Parallel SDRAM interface with LVTTL signalling and random column address every clock cycle for predictable synchronous operation.
  • Power  Supply voltage range specified as 3.0 V to 3.6 V for the device variant provided.
  • Package & Temperature  54‑pin TSOP‑II package (0.400", 10.16 mm width) rated for commercial temperature operation from 0°C to +70°C (TA).

Typical Applications

  • System memory buffering  Parallel SDRAM buffering for embedded platforms and control systems that require deterministic, clocked memory access.
  • Data streaming and frame buffers  High-speed burst read/write capability and programmable burst lengths make the device suitable for short-term data buffering in streaming applications.
  • General-purpose embedded SDRAM  Use in designs that need a 512 Mbit synchronous DRAM in a compact 54‑TSOP‑II footprint with standard LVTTL parallel interface.

Unique Advantages

  • Configurable timing:  Programmable CAS latency and burst lengths let designers match memory timing to system clocks and access patterns.
  • Predictable synchronous operation:  Fully synchronous, clock-referenced inputs and outputs simplify timing design and integration with system clocks.
  • Compact, industry-standard package:  54‑pin TSOP‑II (10.16 mm width) provides a board-friendly footprint for space-constrained applications.
  • Standard refresh support:  Auto Refresh and Self Refresh with 8K cycles per 64 ms reduce host overhead for DRAM maintenance.
  • Wide supply tolerance in specified variant:  Operation over a 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails.

Why Choose IC DRAM 512MBIT PAR 54TSOP II?

The IS42S16320D-7TL-TR positions itself as a straightforward, clock-synchronous 512 Mbit SDRAM option for engineers needing a parallel memory device with programmable latency and burst control. Its combination of 32M × 16 organization, 143 MHz operation, and standard TSOP‑II packaging makes it suitable for designs that require predictable synchronous performance in a compact form factor.

This device is best suited for designers and procurement teams building embedded systems, buffering subsystems, or other applications that require a serial-free parallel SDRAM solution with standard refresh and burst capabilities. The documented timing, supply, and thermal specifications support reliable integration and long-term use in commercial-temperature designs.

Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for IS42S16320D-7TL-TR.

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