IS42S16320D-7BLI

IC DRAM 512MBIT PAR 54TFBGA
Part Description

IC DRAM 512MBIT PAR 54TFBGA

Quantity 137 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TW-BGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320D-7BLI – IC DRAM 512MBIT PAR 54TFBGA

The IS42S16320D-7BLI is a 512 Mbit synchronous DRAM (SDRAM) organized as 32M × 16 and provided in a 54-ball TF-BGA package. It implements a pipeline architecture for high-speed synchronous data transfers with all signals referenced to the rising edge of the clock.

Designed as parallel volatile memory for board-level integration, this device targets applications that require a compact, industrial-temperature-capable SDRAM with programmable burst and latency options and a LVTTL-compatible interface.

Key Features

  • Memory Core: 512 Mbit SDRAM organized as 32M × 16 with internal bank architecture for hiding row access and precharge operations.
  • Performance: Clock frequency up to 143 MHz (–7 grade) with access time of 5.4 ns and programmable CAS latency (2 or 3 clocks) to match system timing.
  • Burst and Sequencing: Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential/interleave) for flexible data transfer modes.
  • Refresh and Reliability: Auto Refresh and Self Refresh supported; 8K refresh cycles every 64 ms as specified for reliable data retention in volatile operation.
  • Interface and Signaling: Parallel memory interface with LVTTL-compatible signals and support for burst read/write and burst read/single write operations.
  • Power: Power supply range listed as 3.0 V to 3.6 V.
  • Package and Mounting: Available in a 54-TF-BGA (54‑TW‑BGA, 8 × 13) ball-grid package for compact board-level mounting.
  • Operating Temperature: Rated for –40 °C to +85 °C (TA), suitable for industrial temperature environments.

Typical Applications

  • System Memory: Used as parallel SDRAM for designs requiring a 512 Mbit synchronous memory with programmable burst and latency options.
  • Industrial Equipment: Suitable for systems operating across –40 °C to +85 °C that need reliable volatile memory in a compact package.
  • Board-Level Memory Expansion: Compact 54-ball TF-BGA package supports dense PCB implementations where board space is constrained.
  • High-Speed Interfaces: Employed where clocked SDRAM with up to 143 MHz operation and LVTTL signaling is required for synchronous data buffering.

Unique Advantages

  • 512 Mbit Density in a Compact Package: Provides 32M × 16 organization in a 54-ball TF-BGA for high-density board-level memory.
  • Programmable Performance: CAS latency and burst length options allow tuning memory timing and throughput to match system requirements.
  • Pipeline Architecture: Fully synchronous pipeline design references all signals to the rising clock edge, enabling deterministic timing and high-speed transfers.
  • Industrial Temperature Range: Operates from –40 °C to +85 °C to meet demanding environmental requirements.
  • Refresh and Low-Power Modes: Supports Auto Refresh and Self Refresh with 8K refresh cycles per 64 ms for reliable volatile operation.
  • Standard Voltage Range: 3.0 V to 3.6 V power supply compatibility for common system power rails.

Why Choose IS42S16320D-7BLI?

The IS42S16320D-7BLI combines a 512 Mbit SDRAM architecture with programmable burst and latency controls, a pipeline synchronous interface, and industrial temperature ratings to suit designs that require compact, board-mounted parallel memory. Its 32M × 16 organization and 54-TF-BGA package provide a balance of density and form factor for constrained PCB layouts.

Manufactured by Integrated Silicon Solution, Inc., the device is specified with clear timing, refresh, and power parameters to support reliable system integration and predictable performance in industrial and commercial applications.

Request a quote or submit an RFQ to obtain pricing and availability for the IS42S16320D-7BLI.

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