IS42S16320D-6TLI-TR

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 134 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320D-6TLI-TR – IC DRAM 512MBIT PAR 54TSOP II

The IS42S16320D-6TLI-TR is a 512 Mbit synchronous DRAM device organized as 32M × 16. It implements a fully synchronous, pipelined architecture with internal bank management and a parallel memory interface suitable for systems requiring deterministic, clock-referenced DRAM operation.

Designed for commercial and industrial temperature operation, this device delivers high-bandwidth, low-latency memory access (166 MHz clock support, 5.4 ns access time) while offering programmability for burst length, burst sequence and CAS latency to match a variety of legacy and embedded system memory requirements.

Key Features

  • Core / Architecture  Fully synchronous SDRAM with internal bank architecture to hide row access/precharge and support pipelined high-speed transfers.
  • Memory Organization  512 Mbit capacity organized as 32M × 16 (4 banks), providing a parallel x16 data path for systems that require this configuration.
  • Timing and Performance  Supports a clock frequency class including 166 MHz (device -6 speed grade) with an access time from clock of 5.4 ns (CAS latency options supported).
  • Programmable Burst and CAS  Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); programmable CAS latency of 2 or 3 clocks for flexibility in system timing.
  • Refresh and Power Management  Auto Refresh and Self Refresh supported; 8K refresh cycles every 64 ms (standard refresh behavior for the device).
  • Interface and Signaling  LVTTL interface with all signals referenced to the positive clock edge for predictable synchronous operation.
  • Power  Supply voltage range VDD/VDDQ = 3.0 V to 3.6 V suitable for 3.3 V-class systems.
  • Package and Temperature  54-pin TSOP-II (0.400", 10.16 mm width) package; specified operating temperature range −40°C to +85°C (TA).

Typical Applications

  • Industrial embedded systems  Provides 512 Mbit synchronous DRAM capacity with industrial-temperature support for control and data buffering tasks.
  • Legacy parallel-interface platforms  Direct-fit memory expansion or replacement in designs that use a parallel x16 SDRAM interface and TSOP-II package footprint.
  • Buffering and working memory  Suitable where deterministic, clocked DRAM behavior and programmable burst/CAS settings are required for streaming or temporary data storage.

Unique Advantages

  • Predictable synchronous operation: Fully synchronous design with clock-referenced inputs and LVTTL signaling for deterministic timing.
  • Flexible performance tuning: Programmable burst lengths, burst sequence and CAS latency allow designers to match memory behavior to system timing and throughput needs.
  • Compact TSOP-II package: 54-pin TSOP-II package provides a space-efficient solution for systems constrained by board area.
  • Industrial temperature support: Specified operation from −40°C to +85°C enables use in thermally demanding environments.
  • 3.0–3.6 V supply range: Compatibility with 3.3 V-class power domains simplifies integration into existing power architectures.

Why Choose IS42S16320D-6TLI-TR?

The IS42S16320D-6TLI-TR combines a 512 Mbit SDRAM density with a fully synchronous, programmable architecture that supports 166 MHz-class operation and low access time (5.4 ns). Its LVTTL interface, programmable burst/CAS options and internal bank management make it well suited to systems that require predictable, high-speed parallel DRAM behavior.

With a 54-pin TSOP-II footprint and an operating range that includes industrial temperatures, this device is appropriate for designers maintaining or upgrading parallel-interface memory subsystems who need a compact, configurable DRAM option with documented timing and refresh characteristics.

Request a quote or submit a pricing and availability inquiry to receive detailed lead-time and purchase information for the IS42S16320D-6TLI-TR.

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