IS42S16320D-6TLI-TR
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 134 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320D-6TLI-TR – IC DRAM 512MBIT PAR 54TSOP II
The IS42S16320D-6TLI-TR is a 512 Mbit synchronous DRAM device organized as 32M × 16. It implements a fully synchronous, pipelined architecture with internal bank management and a parallel memory interface suitable for systems requiring deterministic, clock-referenced DRAM operation.
Designed for commercial and industrial temperature operation, this device delivers high-bandwidth, low-latency memory access (166 MHz clock support, 5.4 ns access time) while offering programmability for burst length, burst sequence and CAS latency to match a variety of legacy and embedded system memory requirements.
Key Features
- Core / Architecture Fully synchronous SDRAM with internal bank architecture to hide row access/precharge and support pipelined high-speed transfers.
- Memory Organization 512 Mbit capacity organized as 32M × 16 (4 banks), providing a parallel x16 data path for systems that require this configuration.
- Timing and Performance Supports a clock frequency class including 166 MHz (device -6 speed grade) with an access time from clock of 5.4 ns (CAS latency options supported).
- Programmable Burst and CAS Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); programmable CAS latency of 2 or 3 clocks for flexibility in system timing.
- Refresh and Power Management Auto Refresh and Self Refresh supported; 8K refresh cycles every 64 ms (standard refresh behavior for the device).
- Interface and Signaling LVTTL interface with all signals referenced to the positive clock edge for predictable synchronous operation.
- Power Supply voltage range VDD/VDDQ = 3.0 V to 3.6 V suitable for 3.3 V-class systems.
- Package and Temperature 54-pin TSOP-II (0.400", 10.16 mm width) package; specified operating temperature range −40°C to +85°C (TA).
Typical Applications
- Industrial embedded systems Provides 512 Mbit synchronous DRAM capacity with industrial-temperature support for control and data buffering tasks.
- Legacy parallel-interface platforms Direct-fit memory expansion or replacement in designs that use a parallel x16 SDRAM interface and TSOP-II package footprint.
- Buffering and working memory Suitable where deterministic, clocked DRAM behavior and programmable burst/CAS settings are required for streaming or temporary data storage.
Unique Advantages
- Predictable synchronous operation: Fully synchronous design with clock-referenced inputs and LVTTL signaling for deterministic timing.
- Flexible performance tuning: Programmable burst lengths, burst sequence and CAS latency allow designers to match memory behavior to system timing and throughput needs.
- Compact TSOP-II package: 54-pin TSOP-II package provides a space-efficient solution for systems constrained by board area.
- Industrial temperature support: Specified operation from −40°C to +85°C enables use in thermally demanding environments.
- 3.0–3.6 V supply range: Compatibility with 3.3 V-class power domains simplifies integration into existing power architectures.
Why Choose IS42S16320D-6TLI-TR?
The IS42S16320D-6TLI-TR combines a 512 Mbit SDRAM density with a fully synchronous, programmable architecture that supports 166 MHz-class operation and low access time (5.4 ns). Its LVTTL interface, programmable burst/CAS options and internal bank management make it well suited to systems that require predictable, high-speed parallel DRAM behavior.
With a 54-pin TSOP-II footprint and an operating range that includes industrial temperatures, this device is appropriate for designers maintaining or upgrading parallel-interface memory subsystems who need a compact, configurable DRAM option with documented timing and refresh characteristics.
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