IS42S16320D-6TLI
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,432 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320D-6TLI – IC DRAM 512MBIT PAR 54TSOP II
The IS42S16320D-6TLI is a 512 Mbit synchronous DRAM organized as 32M × 16, delivered in a 54-pin TSOP-II package. It implements a fully synchronous pipeline architecture with internal bank management to support high-speed data transfer for board-level memory applications.
Designed for parallel memory interfaces, this device targets systems requiring deterministic SDRAM timing, with support for programmable burst lengths, CAS latency options, and both auto- and self-refresh modes to manage dynamic data retention.
Key Features
- Core / Architecture Fully synchronous SDRAM with internal bank structure for hidden row access and precharge, referenced to the rising edge of the clock.
- Memory Organization 512 Mbit capacity organized as 32M × 16 with four internal banks.
- Performance Clock frequency up to 166 MHz (‑6 speed grade) with typical access time of 5.4 ns at CL=3.
- Timing and Refresh Programmable CAS latency (2 or 3 clocks), programmable burst lengths (1, 2, 4, 8, full page), and 8K refresh cycles every 64 ms; supports auto refresh and self refresh modes.
- Interface Parallel LVTTL-compatible interface enabling random column address every clock cycle and burst read/write operations with burst termination commands supported.
- Power Supply voltage range listed as 3.0 V to 3.6 V; datasheet indicates VDD / VDDQ ranges covering this operating window.
- Package 54-pin TSOP-II package (0.400", 10.16 mm width) for compact board-level integration.
- Operating Temperature Industrial temperature range of −40 °C to +85 °C (TA).
Typical Applications
- Board-level system memory Used as parallel SDRAM for embedded systems and devices that require synchronized DRAM resources.
- High-speed data buffering Suitable where pipeline architecture and burst operations are needed to support fast data transfer and temporary storage.
- Industrial electronics The −40 °C to +85 °C operating range supports deployment in industrial environments requiring extended temperature tolerance.
Unique Advantages
- Deterministic synchronous performance: 166 MHz clock support and 5.4 ns access time provide predictable timing for high-speed designs.
- Flexible data handling: Programmable burst lengths and CAS latency options allow tuning for application-specific throughput and latency trade-offs.
- Built-in refresh management: Auto refresh and self refresh with 8K cycles per 64 ms reduce external refresh logic and simplify system design.
- Compact TSOP-II package: 54-pin TSOP-II (10.16 mm width) enables efficient board-area utilization for dense system layouts.
- Industrial temperature capability: −40 °C to +85 °C rating supports reliable operation across a wide thermal range.
Why Choose IC DRAM 512MBIT PAR 54TSOP II?
The IS42S16320D-6TLI positions itself as a practical, high-speed SDRAM option for designs that require a synchronous, parallel memory solution with configurable burst and latency behavior. Its 32M × 16 organization, support for burst and CAS programming, and 166 MHz operation provide a balance of capacity and performance for embedded and industrial applications.
With compact 54‑pin TSOP‑II packaging and built-in refresh and self-refresh capabilities, this device simplifies BOM and board integration while supporting extended temperature operation for robust deployments. It is suited to engineers and procurement teams specifying reliable, deterministic SDRAM on a board-level footprint.
If you would like pricing, availability, or lead-time details for the IS42S16320D-6TLI, request a quote or submit an inquiry and our team will respond with the information you need.