IS42S16320D-6TLI

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 1,432 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320D-6TLI – IC DRAM 512MBIT PAR 54TSOP II

The IS42S16320D-6TLI is a 512 Mbit synchronous DRAM organized as 32M × 16, delivered in a 54-pin TSOP-II package. It implements a fully synchronous pipeline architecture with internal bank management to support high-speed data transfer for board-level memory applications.

Designed for parallel memory interfaces, this device targets systems requiring deterministic SDRAM timing, with support for programmable burst lengths, CAS latency options, and both auto- and self-refresh modes to manage dynamic data retention.

Key Features

  • Core / Architecture  Fully synchronous SDRAM with internal bank structure for hidden row access and precharge, referenced to the rising edge of the clock.
  • Memory Organization  512 Mbit capacity organized as 32M × 16 with four internal banks.
  • Performance  Clock frequency up to 166 MHz (‑6 speed grade) with typical access time of 5.4 ns at CL=3.
  • Timing and Refresh  Programmable CAS latency (2 or 3 clocks), programmable burst lengths (1, 2, 4, 8, full page), and 8K refresh cycles every 64 ms; supports auto refresh and self refresh modes.
  • Interface  Parallel LVTTL-compatible interface enabling random column address every clock cycle and burst read/write operations with burst termination commands supported.
  • Power  Supply voltage range listed as 3.0 V to 3.6 V; datasheet indicates VDD / VDDQ ranges covering this operating window.
  • Package  54-pin TSOP-II package (0.400", 10.16 mm width) for compact board-level integration.
  • Operating Temperature  Industrial temperature range of −40 °C to +85 °C (TA).

Typical Applications

  • Board-level system memory  Used as parallel SDRAM for embedded systems and devices that require synchronized DRAM resources.
  • High-speed data buffering  Suitable where pipeline architecture and burst operations are needed to support fast data transfer and temporary storage.
  • Industrial electronics  The −40 °C to +85 °C operating range supports deployment in industrial environments requiring extended temperature tolerance.

Unique Advantages

  • Deterministic synchronous performance: 166 MHz clock support and 5.4 ns access time provide predictable timing for high-speed designs.
  • Flexible data handling: Programmable burst lengths and CAS latency options allow tuning for application-specific throughput and latency trade-offs.
  • Built-in refresh management: Auto refresh and self refresh with 8K cycles per 64 ms reduce external refresh logic and simplify system design.
  • Compact TSOP-II package: 54-pin TSOP-II (10.16 mm width) enables efficient board-area utilization for dense system layouts.
  • Industrial temperature capability: −40 °C to +85 °C rating supports reliable operation across a wide thermal range.

Why Choose IC DRAM 512MBIT PAR 54TSOP II?

The IS42S16320D-6TLI positions itself as a practical, high-speed SDRAM option for designs that require a synchronous, parallel memory solution with configurable burst and latency behavior. Its 32M × 16 organization, support for burst and CAS programming, and 166 MHz operation provide a balance of capacity and performance for embedded and industrial applications.

With compact 54‑pin TSOP‑II packaging and built-in refresh and self-refresh capabilities, this device simplifies BOM and board integration while supporting extended temperature operation for robust deployments. It is suited to engineers and procurement teams specifying reliable, deterministic SDRAM on a board-level footprint.

If you would like pricing, availability, or lead-time details for the IS42S16320D-6TLI, request a quote or submit an inquiry and our team will respond with the information you need.

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